Patents by Inventor Hisayuki Inoue

Hisayuki Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensor device
    Patent number: 7392706
    Abstract: A sensor substrate 1 having on its lower surface a surface acoustic wave element 2 for detecting pressure is mounted on a supporting substrate 6 through a sealing member 4 surrounding a sensor section 2. A sealing space S is formed by the sensor substrate 1, the supporting substrate 6, and the sealing member 4, and the surface acoustic wave element 2 for detecting pressure is sealed hermetically in the sealing space S. Reliability can be enhanced by protecting the surface acoustic wave element 2 from the external environment.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: July 1, 2008
    Assignee: Kyocera Corporation
    Inventors: Kazuhisa Momose, Kaoru Matsuo, Shinichi Shimokihara, Hisayuki Inoue, Masashi Kamada, Hiroshi Tachioka, Kouichi Maruta, Hiroshi Oka
  • Pressure sensor device
    Publication number: 20070089525
    Abstract: A sensor substrate 1 having on its lower surface a surface acoustic wave element 2 for detecting pressure is mounted on a supporting substrate 6 through a sealing member 4 surrounding a sensor section 2. A sealing space S is formed by the sensor substrate 1, the supporting substrate 6, and the sealing member 4, and the surface acoustic wave element 2 for detecting pressure is sealed hermetically in the sealing space S. Reliability can be enhanced by protecting the surface acoustic wave element 2 from the external environment.
    Type: Application
    Filed: November 26, 2004
    Publication date: April 26, 2007
    Inventors: Kazuhisa Momose, Kaoru Matsuo, Shinichi Shimokihara, Hisayuki Inoue
  • Apparatus carrying electronic device
    Patent number: 6917101
    Abstract: An apparatus in which a device electrode pad in an electronic device and a connecting conductor pattern in a substrate are connected to each other through a plurality of wire thin lines which differ from one another in mechanical characteristic frequencies. Even if the frequency of vibration applied to the apparatus from the exterior coincides with the characteristic frequency of the given wire thin line so that the wire thin line is broken, it does not coincide with the characteristic frequency of the other wire thin line. Accordingly, no resonance phenomenon occurs in the other wire thin line, thereby reducing a probability that the wire thin line is broken.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: July 12, 2005
    Assignee: Kyocera Corporation
    Inventor: Hisayuki Inoue
  • Apparatus carrying electronic device
    Publication number: 20040007711
    Abstract: An apparatus in which a device electrode pad in an electronic device and a connecting conductor pattern in a substrate are connected to each other through a plurality of wire thin lines which differ from one another in mechanical characteristic frequencies. Even if the frequency of vibration applied to the apparatus from the exterior coincides with the characteristic frequency of the given wire thin line so that the wire thin line is broken, it does not coincide with the characteristic frequency of the other wire thin line. Accordingly, no resonance phenomenon occurs in the other wire thin line, thereby reducing a probability that the wire thin line is broken.
    Type: Application
    Filed: July 8, 2003
    Publication date: January 15, 2004
    Applicant: KYOCERA CORPORATION
    Inventor: Hisayuki Inoue