Abstract: Provided is a joint for high-pressure pipes, which allows improved efficiency in pipe replacement work as well as improved seal performance and resistance against vibration of a pipe joint. The pipe joint for coupling a first pipe and a second pipe comprises: a first joint for coupling with a first pipe; a second joint for coupling with a second pipe; a clamp having a band portion that overlaps an abuttment part for of the first joint and the second joint, and that couples the first joint to the second joint in an abutting state; and a tightening element for shrinking the internal diameter of the band portion by a tightening operation. The external diameter of each end part of the first joint and the second joint in the abuttment part is larger than the external diameter of intermediate portions of the first joint and the second joint.

Abstract: Provided is a seal ring structure for a high-pressure pipe joint that is capable of improving the sealing performance and vibration resistance of a pipe joint. The seal ring structure comprises a seal ring and a retainer. The seal ring is donut shaped. A cross-section of the seal ring comprises a quadrangle having two diagonal lines that are orthogonal to each other. One diagonal line is parallel to a planar perpendicular line formed by the donut shape, and opposing vertexes on the diagonal lines are in contact with the end face of each joint. The retainer is able to engage with the peripheral edge of the joint end face.

Abstract: A semiconductor light emitting device has an outer lead disposed along an outer wall of a mold resin portion perpendicular to a light-emitting plane of a light emitting diode. An outer lead is also disposed at an outer wall of the mold resin portion parallel to and opposite to the light-emitting plane. The outer wall of the resin mold where the outer lead is disposed is taken as a mount face. Each outer wall of the mold resin portion constituting a mount face includes at least one outer lead for an anode and a cathode. According to the present configuration, there is provided a semiconductor light emitting device that allows selection of side-emission mounting or top-emission mounting with the same components on a mount substrate.

Abstract: A silver-plated metal member region on which a light emitting element is disposed, an extraction electrode having a copper plate pattern, and a convex resin portion separating the metal member region into a plurality of sections are provided on the bottom surface of a concave portion in a package of a semiconductor light emitting device. A covering resin is partially formed on the metal member region and a sealing resin is placed to cover the metal member region, the covering resin and the convex resin portion. According to this configuration, the area of contact is decreased between the sealing resin and the metal member region having the light emitting element placed thereon, to thereby prevent the light emitting element from falling off and being displaced from the metal member region, with the result that a semiconductor light emitting device of high reliability can be provided.

Abstract: A silver-plated metal member region on which a light emitting element is disposed, an extraction electrode having a copper plate pattern, and a convex resin portion separating the metal member region into a plurality of sections are provided on the bottom surface of a concave portion in a package of a semiconductor light emitting device. A covering resin is partially formed on the metal member region and a sealing resin is placed to cover the metal member region, the covering resin and the convex resin portion. According to this configuration, the area of contact is decreased between the sealing resin and the metal member region having the light emitting element placed thereon, to thereby prevent the light emitting element from falling off and being displaced from the metal member region, with the result that a semiconductor light emitting device of high reliability can be provided.

Abstract: A semiconductor light emitting device has an outer lead disposed along an outer wall of a mold resin portion perpendicular to a light-emitting plane of a light emitting diode. An outer lead is also disposed at an outer wall of the mold resin portion parallel to and opposite to the light-emitting plane. The outer wall of the resin mold where the outer lead is disposed is taken as a mount face. Each outer wall of the mold resin portion constituting a mount face includes at least one outer lead for an anode and a cathode. According to the present configuration, there is provided a semiconductor light emitting device that allows selection of side-emission mounting or top-emission mounting with the same components on a mount substrate.

Abstract: A semiconductor laser device includes a first lead having a plate-like mounting portion on which a semiconductor laser chip is mounted and a lead portion extending from the mounting portion, a second lead extending along the lead portion of the first lead, and a retention portion made of an insulative material that integrally retains the first lead and the second lead. The mounting portion of the first lead has a back surface exposed from the retention portion, and the first lead further has a tie bar portion projecting from the mounting portion along the back surface of the mounting portion.

Abstract: A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends

Abstract: A semiconductor laser device has a semiconductor laser and a polarizing diffraction grating that is arranged ahead of the semiconductor laser. A reflected light from an optical recording medium is diffracted by the polarizing diffraction grating according to the polarization direction of the reflected light. The reflected light is thereby deviated from the direction toward the semiconductor laser to prevent the reflected light from returning to the semiconductor laser.

Abstract: A semiconductor laser device includes a first lead having a plate-like mounting portion on which a semiconductor laser chip is mounted and a lead portion extending from the mounting portion, a second lead extending along the lead portion of the first lead, and a retention portion made of an insulative material that integrally retains the first lead and the second lead. The mounting portion of the first lead has a back surface exposed from the retention portion, and the first lead further has a tie bar portion projecting from the mounting portion along the back surface of the mounting portion.

Abstract: A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends

Abstract: A semiconductor laser device has a semiconductor laser and a polarizing diffraction grating that is arranged ahead of the semiconductor laser. A reflected light from an optical recording medium is diffracted by the polarizing diffraction grating according to the polarization direction of the reflected light. The reflected light is thereby deviated from the direction toward the semiconductor laser to prevent the reflected light from returning to the semiconductor laser.

Abstract: First, second semiconductor lasers and a photodetector are integrated in a laser package of an integrated laser unit. A composite PBS is so structured that generally 100% of s-polarized light derived from the first semiconductor laser is reflected while generally 100% of s-polarized light derived from the second semiconductor laser is transmitted. Then, return beams of s-polarized light of the first, second semiconductor lasers separated by the composite PBS 18 are converged on the same photodetector by the first, second polarization hologram devices. By doing so, the first, second polarization hologram devices are adjusted independently of each other, so that the offset adjustment of servo error signals for the first, second semiconductor lasers can be easily achieved in assembly process. Thus, the optical pickup becomes easy to assemble and adjust.