Patents by Inventor Hisen-Hwa Tseng

Hisen-Hwa Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cassette pod equipped with position sensing device
    Patent number: 6775918
    Abstract: A wafer cassette pod that is equipped with at least one position sensing device to avoid the accidental falling of a cassette pod door resulting in wafer breakage. The wafer cassette pod is provided with at least one position sensing device mounted in the sidewall of the cassette pod with a finger member protruding from the end surface of the sidewall forming the cassette pod opening. When the wafer cassette pod is not properly positioned, or docked on the loadport, the spring force of the position sensing device pushes the cassette pod away from the entrance of the loadport and thus, preventing the accidental falling of a cassette pod poor resulting in possible wafer breakage problems.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: August 17, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Hisen-Hwa Tseng, Chia-Hung Chung, Ming-Chien Wen
  • Wafer cassette pod equipped with position sensing device
    Publication number: 20030146129
    Abstract: A wafer cassette pod that is equipped with at least one position sensing device to avoid the accidental falling of a cassette pod door resulting in wafer breakage. The wafer cassette pod is provided with at least one position sensing device mounted in the sidewall of the cassette pod with a finger member protruding from the end surface of the sidewall forming the cassette pod opening. When the wafer cassette pod is not properly positioned, or docked on the loadport, the spring force of the position sensing device pushes the cassette pod away from the entrance of the loadport and thus, preventing the accidental falling of a cassette pod poor resulting in possible wafer breakage problems.
    Type: Application
    Filed: February 6, 2002
    Publication date: August 7, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hisen-Hwa Tseng, Chia-Hung Chung, Ming-Chien Wen