Patents by Inventor Hisoshi Adachi

Hisoshi Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin
    Patent number: 5600151
    Abstract: A semiconductor device having a stress-buffering film which is effective in buffering the stress caused by a molding resin during sealing, the stress-buffering film being made of a silicone ladder resin represented by formula (I) ##STR1## wherein each end group R may be the same or different and represents a hydrogen atom or an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerizable unsaturated group, and n is an integer of 10 or larger.
    Type: Grant
    Filed: February 13, 1995
    Date of Patent: February 4, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Etsushi Adachi, Hisoshi Adachi, Shigeyuki Yamamoto, Hiroyuki Nishimura, Shintaro Minami, Tooru Tazima, Hiroshi Tobimatsu