Patents by Inventor HITACHI CABLE FINE-TECH, LTD.

HITACHI CABLE FINE-TECH, LTD. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130220674
    Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 29, 2013
    Applicants: HITACHI CABLE, LTD., HITACHI CABLE FINE-TECH, LTD.
    Inventors: Hitachi Cable Fine-Tech, Ltd., Hitachi Cable, Ltd.
  • Publication number: 20130220677
    Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 29, 2013
    Applicants: Hitachi Cable Fine-Tech, Ltd., Hitachi Cable, Ltd.
    Inventors: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
  • Publication number: 20130161057
    Abstract: A flexible flat cable includes a plurality of conductors arranged in parallel at predetermined intervals, an insulation layer provided on both surfaces of the conductors, a nonwoven fabric layer provided on an outer surface of the insulation layer, and a shield layer provided on an outer surface of the nonwoven fabric layer. The nonwoven fabric layer includes a nonwoven fabric having a plurality of recessed portions formed on a surface thereof, the recessed portion being enclosed by a pair of opposite long sides and a pair of opposite short sides.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 27, 2013
    Applicant: HITACHI CABLE FINE-TECH, LTD.
    Inventor: HITACHI CABLE FINE-TECH, LTD.