Patents by Inventor Hitesh Arora
Hitesh Arora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11921824Abstract: Techniques are generally described for fusing sensor data of different modalities using a transformer. In various examples, first sensor data may be received from a first sensor and second sensor data may be received from a second sensor. A first feature representation of the first sensor data may be generated using a first machine learning model and a second feature representation of the second sensor data may be generated using a second machine learning model. In some examples, a modified first feature representation of the first sensor data may be generated based at least in part on a self-attention mechanism of a transformer encoder. The modified first feature representation may be generated based at least in part on the first feature representation and the second feature representation. A computer vision task may be performed using the modified first feature representation.Type: GrantFiled: March 29, 2021Date of Patent: March 5, 2024Assignee: Amazon Technologies, Inc.Inventors: Todd Hester, Sheng Chen, Mark Buckler, Ayan Tuhinendu Sinha, Hitesh Arora, Michael Lawrence LeKander, Hamed Pirsiavash
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Publication number: 20220125876Abstract: The present invention relates to methods of immune modulation. In particular, the present invention relates to regulation of inflammation and immune responses by modulation of ABCF1. Modulation of ABCF1 may be useful in the treatment of sepsis, autoimmune diseases, cancer or infections.Type: ApplicationFiled: February 14, 2020Publication date: April 28, 2022Applicant: Pacific Myco Biosciences, Ltd.Inventors: Wilfred JEFFERIES, Hitesh ARORA, Sara WILCOX, Lonna MUNRO, Cheryl PFEIFER
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Patent number: 10472229Abstract: A method for fabricating a nanostructure utilizes a templated monocrystalline substrate. The templated monocrystalline substrate is energetically (i.e., preferably thermally) treated, with an optional precleaning and an optional amorphous material layer located thereupon, to form a template structured monocrystalline substrate that includes the monocrystalline substrate with a plurality of epitaxially aligned contiguous monocrystalline pillars extending therefrom. The monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars may comprise the same or different monocrystalline materials.Type: GrantFiled: March 4, 2011Date of Patent: November 12, 2019Assignee: Cornell University—Cornell Center for TechnologyInventors: Ulrich Wiesner, Michael Thompson, Hitesh Arora
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Patent number: 10347281Abstract: Methods are disclosed for increasing areal density in Heat Assisted Magnetic Recording (HAMR) data storage systems by controlling the media layer grain size, grain size distribution, and pitch via templating techniques that are compatible with the high temperature HAMR media deposition. Embodiments include using current HAMR media seed layers as well as additionally introduced interlayers for the templating process. Topographic as well as chemical templating methods are disclosed that may employ nanoimprint technology or nanoparticle self-assembly among other patterning techniques.Type: GrantFiled: June 2, 2015Date of Patent: July 9, 2019Assignee: Western Digital Technologies, Inc.Inventors: Hitesh Arora, Bruce Gurney, Olav Hellwig, Jodi Mari Iwata, Tiffany Suzanne Santos, Dieter K. Weller, Frank Zhu
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Patent number: 9719170Abstract: Block copolymers (BCPs) and synthetic infiltration synthesis (SIS) are used to double the line density on a substrate. The BCP comprises first and second interconnected BCP components with a functional group at the junction or interface of the components. After deposition of the BCP on the substrate and annealing, a pattern of parallel stripes of first and second BCP components is formed with a pattern of functional group interfaces between the components. Each of the BCP components is non-reactive with atomic layer deposition (ALD) precursors, while the functional group is reactive with the ALD precursors. The ALD results in the infiltration of inorganic material into the interfaces where the reactive functional groups are located but without affecting the BCP components. After removal of the organic material, a pattern of parallel lines of inorganic material remains with a pitch half that of the stripes of BCP components.Type: GrantFiled: July 12, 2016Date of Patent: August 1, 2017Assignee: Western Digital Technologies, Inc.Inventors: Hitesh Arora, Ricardo Ruiz
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Patent number: 9640415Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.Type: GrantFiled: December 1, 2014Date of Patent: May 2, 2017Assignee: Intel CorporationInventors: Randall D Lowe, Jr., Suriyakala Suriya Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora
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Patent number: 9530718Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.Type: GrantFiled: December 26, 2012Date of Patent: December 27, 2016Assignee: Intel CorporationInventors: Hitesh Arora, Mihir A. Oka, Chandra M. Jha
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Publication number: 20160358622Abstract: Methods are disclosed for increasing areal density in Heat Assisted Magnetic Recording (HAMR) data storage systems by controlling the media layer grain size, grain size distribution, and pitch via templating techniques that are compatible with the high temperature HAMR media deposition. Embodiments include using current HAMR media seed layers as well as additionally introduced interlayers for the templating process. Topographic as well as chemical templating methods are disclosed that may employ nanoimprint technology or nanoparticle self-assembly among other patterning techniques.Type: ApplicationFiled: June 2, 2015Publication date: December 8, 2016Inventors: Hitesh Arora, Bruce GURNEY, Olav HELLWIG, Jodi Mari IWATA, Tiffany Suzanne SANTOS, Dieter K. WELLER, Frank ZHU
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Publication number: 20160343591Abstract: Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 1, 2016Publication date: November 24, 2016Inventors: Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen-Givoni, Hitesh Arora, Nisha Ananthakrishnan, Yiqun Bai, Yonghao Xiu, Rajendra C. Dias
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Publication number: 20160319427Abstract: Block copolymers (BCPs) and synthetic infiltration synthesis (SIS) are used to double the line density on a substrate. The BCP comprises first and second interconnected BCP components with a functional group at the junction or interface of the components. After deposition of the BCP on the substrate and annealing, a pattern of parallel stripes of first and second BCP components is formed with a pattern of functional group interfaces between the components. Each of the BCP components is non-reactive with atomic layer deposition (ALD) precursors, while the functional group is reactive with the ALD precursors. The ALD results in the infiltration of inorganic material into the interfaces where the reactive functional groups are located but without affecting the BCP components. After removal of the organic material, a pattern of parallel lines of inorganic material remains with a pitch half that of the stripes of BCP components.Type: ApplicationFiled: July 12, 2016Publication date: November 3, 2016Inventors: Hitesh Arora, Ricardo Ruiz
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Patent number: 9464348Abstract: A method for making a bit-patterned media (BPM) magnetic recording disk by etching the recording layer using a patterned hard mask layer uses glancing angle deposition (GLAD) of additional hard mask material as a capping layer onto the tops of the patterned hard mask pillars while the disk is rotated about an axis orthogonal to the plane of the disk. In one embodiment the capping layer is deposited after the pillars have been only partially eroded during a partial ion-milling of the recording layer. Ion-milling is then again performed to remove the remaining recording layer material. In another embodiment, before ion-milling of the recording layer, the capping layer is deposited onto the tops of the un-eroded hard mask pillars. This increases the lateral dimension of the hard mask pillars so that after ion-milling of the recording layer, the magnetic islands have an increased lateral dimension.Type: GrantFiled: August 26, 2014Date of Patent: October 11, 2016Assignee: HGST Netherlands B.V.Inventors: Hitesh Arora, Jean-Marc L. Beaujour, Zuwei Liu, Tsai-Wei Wu
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Patent number: 9431274Abstract: Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.Type: GrantFiled: December 20, 2012Date of Patent: August 30, 2016Assignee: Intel CorporationInventors: Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan, Yiqun Bai, Yonghao Xiu, Rajendra C. Dias
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Patent number: 9431046Abstract: A perpendicular magnetic recording (PMR) disk has a patterned template layer for the growth of the magnetic grains and the nonmagnetic material surrounding the grains. The template layer is a substantially planar platinum (Pt) or palladium (Pd) layer that is patterned to have Pt or Pd regions arranged in a hexagonal-close-packed (hcp) pattern with the Pt or Pd regions surrounded by Pt-oxide or Pd-oxide regions. The two separate regions of the template layer have different surface chemistries and energies, which provide a “chemical contrast” to impinging atoms during deposition of the metallic magnetic material and nonmagnetic (typically oxide) material, effectively guiding the deposition. The metallic magnetic material is preferentially deposited on the pristine, epitaxial Pt or Pd regions to form the magnetic grains, while the oxide migrates to the oxidized Pt or Pd regions due to the matching of lower surface energy.Type: GrantFiled: October 31, 2014Date of Patent: August 30, 2016Assignee: HGST Netherlands B.V.Inventors: Hitesh Arora, Andrea Fasoli, Qing Zhu
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Patent number: 9416447Abstract: Block copolymers (BCPs) and synthetic infiltration synthesis (SIS) are used to double the line density on a substrate. The BCP comprises first and second interconnected BCP components with a functional group at the junction or interface of the components. After deposition of the BCP on the substrate and annealing, a pattern of parallel stripes of first and second BCP components is formed with a pattern of functional group interfaces between the components. Each of the BCP components is non-reactive with atomic layer deposition (ALD) precursors, while the functional group is reactive with the ALD precursors. The ALD results in the infiltration of inorganic material into the interfaces where the reactive functional groups are located but without affecting the BCP components. After removal of the organic material, a pattern of parallel lines of inorganic material remains with a pitch half that of the stripes of BCP components.Type: GrantFiled: February 7, 2014Date of Patent: August 16, 2016Assignee: HGST Netherlands B.V.Inventors: Hitesh Arora, Ricardo Ruiz
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Patent number: 9336809Abstract: A method to fabricate an imprint template for bit-patterned magnetic recording media using block copolymers (BCPs) integrates data region patterning and servo region patterning. A heat sink layer is formed on the imprint substrate only in the data regions. A sublayer for the BCP is deposited over both the data regions and the servo regions and patterned to form stripes in the data regions and servo features in the servo regions. A BCP is then deposited in both the data and servo regions. Only the BCP in the data regions is heated, which causes phase separation of the BCP in the data regions into the two BCP components. The selective heating may be accomplished by directed controlled laser radiation to only the data regions. The heat sink layer below the data regions absorbs the heat from the laser radiation, confining it to the data regions.Type: GrantFiled: August 28, 2014Date of Patent: May 10, 2016Assignee: HGST Netherlands B.V.Inventors: Hitesh Arora, Sripathi Vangipuram Canchi, Franck Dreyfus Rose, Ricardo Ruiz, Vipin Ayanoor-Vitikkate
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Publication number: 20160125904Abstract: A perpendicular magnetic recording (PMR) disk has a patterned template layer for the growth of the magnetic grains and the nonmagnetic material surrounding the grains. The template layer is a substantially planar platinum (Pt) or palladium (Pd) layer that is patterned to have Pt or Pd regions arranged in a hexagonal-close-packed (hcp) pattern with the Pt or Pd regions surrounded by Pt-oxide or Pd-oxide regions. The two separate regions of the template layer have different surface chemistries and energies, which provide a “chemical contrast” to impinging atoms during deposition of the metallic magnetic material and nonmagnetic (typically oxide) material, effectively guiding the deposition. The metallic magnetic material is preferentially deposited on the pristine, epitaxial Pt or Pd regions to form the magnetic grains, while the oxide migrates to the oxidized Pt or Pd regions due to the matching of lower surface energy.Type: ApplicationFiled: October 31, 2014Publication date: May 5, 2016Inventors: Hitesh Arora, Andrea Fasoli, Qing Zhu
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Publication number: 20160064026Abstract: A method for making a bit-patterned media (BPM) magnetic recording disk by etching the recording layer using a patterned hard mask layer uses glancing angle deposition (GLAD) of additional hard mask material as a capping layer onto the tops of the patterned hard mask pillars while the disk is rotated about an axis orthogonal to the plane of the disk. In one embodiment the capping layer is deposited after the pillars have been only partially eroded during a partial ion-milling of the recording layer. Ion-milling is then again performed to remove the remaining recording layer material. In another embodiment, before ion-milling of the recording layer, the capping layer is deposited onto the tops of the un-eroded hard mask pillars. This increases the lateral dimension of the hard mask pillars so that after ion-milling of the recording layer, the magnetic islands have an increased lateral dimension.Type: ApplicationFiled: August 26, 2014Publication date: March 3, 2016Inventors: Hitesh Arora, Jean-Marc L. Beaujour, Zuwei Liu, Tsai-Wei Wu
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Publication number: 20160064027Abstract: A method to fabricate an imprint template for bit-patterned magnetic recording media using block copolymers (BCPs) integrates data region patterning and servo region patterning. A heat sink layer is formed on the imprint substrate only in the data regions. A sublayer for the BCP is deposited over both the data regions and the servo regions and patterned to form stripes in the data regions and servo features in the servo regions. A BCP is then deposited in both the data and servo regions. Only the BCP in the data regions is heated, which causes phase separation of the BCP in the data regions into the two BCP components. The selective heating may be accomplished by directed controlled laser radiation to only the data regions. The heat sink layer below the data regions absorbs the heat from the laser radiation, confining it to the data regions.Type: ApplicationFiled: August 28, 2014Publication date: March 3, 2016Inventors: Hitesh Arora, Sripathi Vangipuram Canchi, Franck Dreyfus Rose, Ricardo Ruiz, Vipin Ayanoor-Vitikkate
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Publication number: 20150287901Abstract: Thermoelectric structures include a flexible substrate; a plurality of conductive shunts; and a plurality of thermoelectric legs that are in thermal and electrical communication with the thermoelectric legs via thermal and electrical paths. In some embodiments, the paths are through apertures in the flexible substrate, and the flexible substrate can be substantially out of the thermal and electrical paths. Some embodiments include a circuit board coupled to the flexible substrate, and a bend in the flexible substrate can be disposed between the plurality of conductive shunts and the circuit board. In some embodiments, a plurality of perforations are defined through the flexible substrate and can be configured to rupture responsive to a temperature condition that otherwise would damage one or more of the thermal and electrical paths, said rupture inhibiting such damage. Other embodiments, and methods, are provided.Type: ApplicationFiled: April 6, 2015Publication date: October 8, 2015Inventors: Adam Lorimer, Jordan Chase, Sasi Bhushan Beera, Mario Aguirre, Hitesh Arora, Douglas Crane
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Publication number: 20150225850Abstract: Block copolymers (BCPs) and synthetic infiltration synthesis (SIS) are used to double the line density on a substrate. The BCP comprises first and second interconnected BCP components with a functional group at the junction or interface of the components. After deposition of the BCP on the substrate and annealing, a pattern of parallel stripes of first and second BCP components is formed with a pattern of functional group interfaces between the components. Each of the BCP components is non-reactive with atomic layer deposition (ALD) precursors, while the functional group is reactive with the ALD precursors. The ALD results in the infiltration of inorganic material into the interfaces where the reactive functional groups are located but without affecting the BCP components. After removal of the organic material, a pattern of parallel lines of inorganic material remains with a pitch half that of the stripes of BCP components.Type: ApplicationFiled: February 7, 2014Publication date: August 13, 2015Applicant: HGST Netherlands B.V.Inventors: Hitesh Arora, Ricardo Ruiz