Patents by Inventor Hitoki Kanagawa

Hitoki Kanagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8450613
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: May 28, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Publication number: 20120193127
    Abstract: A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 2, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Saori ISHIGAKI, Hitoki KANAGAWA, Yoshito FUJIMURA
  • Publication number: 20120124829
    Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.
    Type: Application
    Filed: October 25, 2011
    Publication date: May 24, 2012
    Applicant: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Yuu Sugimoto, Hitoki Kanagawa
  • Patent number: 8184931
    Abstract: A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: May 22, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Jun Ishii, Toshiki Naito
  • Patent number: 8174844
    Abstract: A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: May 8, 2012
    Assignee: NITTO DENKO Corporation
    Inventors: Hitoki Kanagawa, Akinori Itokawa, Naotaka Higuchi
  • Patent number: 8146246
    Abstract: A method of manufacturing a wired circuit board, including: forming an insulating layer in a pattern thereby forming second through holes penetrating the insulating layer in a thickness direction thereof; and after forming the insulating layer, forming, on the insulating layer, a conductive pattern in a pattern having terminals which are continuous with an upper surface and a side surface of a side end portion of the insulating layer such that the terminals extend into the second through holes. The terminals are operative for connecting with external terminals via a molten metal. The terminals include annular, step-shaped shoulder portions aligned with the second through holes and that are recessed downward from an upper surface, and first through holes having a diameter smaller than that of the second through holes and which pass through the terminals in a thickness direction thereof.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Patent number: 8056223
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: November 15, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Patent number: 8015703
    Abstract: A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with external terminals via a molten metal is formed on the metal supporting board and the insulating layer. The terminals include shoulder portions corresponding to the concave portions and are concaved downward from an upper surface. First through holes penetrate the terminals in a thickness direction thereof Second through holes are formed communicating with the first through holes in portions of the insulating layer corresponding to the terminals by removing the concave portions to expose a lower surface of the terminals such that the second through holes penetrate the insulating layer in a thickness direction thereof and have a diameter larger than that of the first through holes.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: September 13, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Patent number: 7957614
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: June 7, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Publication number: 20110128033
    Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.
    Type: Application
    Filed: November 18, 2010
    Publication date: June 2, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hitoki Kanagawa
  • Publication number: 20110119911
    Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.
    Type: Application
    Filed: January 31, 2011
    Publication date: May 26, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Patent number: 7925127
    Abstract: A suspension board with circuit includes a circuit board formed with an opening, and having a mounting portion defined by the opening for mounting thereon a slider on which a magnetic head is mounted, and an optical waveguide disposed on the circuit board so as to traverse the opening. The optical waveguide is slack in the opening.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: April 12, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Publication number: 20100224391
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 9, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Publication number: 20100157560
    Abstract: A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 24, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Akinori Itokawa, Naotaka Higuchi
  • Patent number: 7732900
    Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: June 8, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Publication number: 20100083492
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Application
    Filed: December 7, 2009
    Publication date: April 8, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Publication number: 20100033875
    Abstract: A suspension board with circuit includes a metal supporting board extending in a longitudinal direction, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. In the suspension board with circuit, a magnetic-head mounting region where a slider with a magnetic head mounted thereon is mounted is located in one end portion in the longitudinal direction, and the thickness of the metal supporting board in at least a part of the magnetic-head mounting region is smaller than that in a region other than the magnetic-head mounting region.
    Type: Application
    Filed: July 29, 2009
    Publication date: February 11, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Yoshinari Yoshida, Hitoki Kanagawa
  • Publication number: 20100002985
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Application
    Filed: June 16, 2009
    Publication date: January 7, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Publication number: 20090310908
    Abstract: A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 17, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Jun Ishii, Toshiki Naito
  • Publication number: 20090310909
    Abstract: A suspension board with circuit includes a circuit board formed with an opening, and having a mounting portion defined by the opening for mounting thereon a slider on which a magnetic head is mounted, and an optical waveguide disposed on the circuit board so as to traverse the opening. The optical waveguide is slack in the opening.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 17, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito