Patents by Inventor Hitoki Nakaya

Hitoki Nakaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7362201
    Abstract: An inductance device has a hollow center coil around which a conducting wire is wound so that a hollow portion is formed along a center axis line of the hollow center coil, a filler which is filled into the hollow portion of the hollow center coil, and includes magnetic powder or a compound including the magnetic powder, and an accommodation case which accommodates the hollow core coil and has a bottom, wherein the filler is filled into the accommodation case.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: April 22, 2008
    Assignee: Yonezawa Electric Wire Co., Ltd.
    Inventors: Seiichiro Saegusa, Hitoki Nakaya, Takayuki Ochi
  • Patent number: 7295168
    Abstract: An antenna coil has a simple structure and a high sensitivity and can be thinner. The antenna coil includes an X Y coil unit having an X axis coil and a Y axis coil wound around a core, a Z axis coil wound around the X Y coil unit, and a resin portion insert molded around the X Y coil unit and the Z axis coil. In the antenna coil, the X axis coil, the Y axis coil, and the Z axis coil are arranged so that the three coils have an axis in a direction orthogonal to each other, and the X Y coil unit and the Z axis are integrated by the resin portion.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: November 13, 2007
    Assignee: Yonezawa Electric Wire Co., Ltd.
    Inventors: Seiichiro Saegusa, Hitoki Nakaya, Takayuki Ochi, Shigeyoshi Seino
  • Publication number: 20070097011
    Abstract: An antenna coil is presented. The antenna coil includes a printed board for providing an antenna thereon, a core separately provided from the printed board and wound around by a coil, and a magnetic shield layer provided on a surface of the printed board and below the core. The magnetic shield layer includes nonmetallic magnetic powder, and is formed by self-fusion of the nonmetallic magnetic powder having self-fusing film or a compound containing nonmetallic magnetic powder and adhesive resin. The antenna coil further includes at least two legs for supporting the core on the printed board. The upper surface of the coil includes a coating film by resin powder coating. The antenna coil further includes a terminal connected to each end of the coils, wherein the terminal is formed by a metallic plate layer and functions as an electrode.
    Type: Application
    Filed: December 5, 2006
    Publication date: May 3, 2007
    Inventors: Seiichiro Saegusa, Hitoki Nakaya, Takayuki Ochi, Shigeyoshi Seino
  • Publication number: 20070052510
    Abstract: An inductance device has a hollow center coil around which a conducting wire is wound so that a hollow portion is formed along a center axis line of the hollow center coil, a filler which is filled into the hollow portion of the hollow center coil, and includes magnetic powder or a compound including the magnetic powder, and an accommodation case which accommodates the hollow core coil and has a bottom, wherein the filler is filled into the accommodation case.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 8, 2007
    Inventors: Seiichiro Saegusa, Hitoki Nakaya, Takayuki Ochi
  • Publication number: 20050270249
    Abstract: An antenna coil has a simple structure and a high sensitivity and can be thinner. The antenna coil includes an X Y coil unit having an X axis coil and a Y axis coil wound around a core, a Z axis coil wound around the X Y coil unit, and a resin portion insert molded around the X Y coil unit and the Z axis coil. In the antenna coil, the X axis coil, the Y axis coil, and the Z axis coil are arranged so that the three coils have an axis in a direction orthogonal to each other, and the X Y coil unit and the Z axis are integrated by the resin portion.
    Type: Application
    Filed: May 13, 2005
    Publication date: December 8, 2005
    Applicant: Yonezawa Electric Wire Co., Ltd.
    Inventors: Seiichiro Saegusa, Hitoki Nakaya, Takayuki Ochi, Shigeyoshi Seino