Patents by Inventor Hitomi Iizuka

Hitomi Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10553520
    Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: February 4, 2020
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Hitomi Iizuka, Hiroaki Tsurumi, Shinya Tsuchida, Kenji Hirose, Yuta Tamaki
  • Publication number: 20180247881
    Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
    Type: Application
    Filed: April 4, 2016
    Publication date: August 30, 2018
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Hitomi Iizuka, Hiroaki Tsurumi, Shinya Tsuchida, Kenji Hirose, Yuta Tamaki