Patents by Inventor Hitoshi Akimura

Hitoshi Akimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive resin composition
    Patent number: 5183591
    Abstract: An electroconductive resin composition which is composed of a rubber-reinforced styrene resin having a controlled pH value of from 5.0 through 9.0 and a carbon material filler and a metal material filler as incorporated into the resin. A method of preparing the electroconductive resin composition where a rubber-reinforced styrene resin is adjusted to have a pH value of from 5.0 through 9.0 and a carbon material filler and a metal material filler are added to the resin.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: February 2, 1993
    Assignees: Ube Cycon, Ltd., Aisin Seiki Kabushiki Kaisha
    Inventors: Sumihisa Akahoshi, Hitoshi Akimura, Isao Nakabayashi, Masami Ishii, Tamio Ohi, Makoto Yoshida
  • Modeling material composition
    Patent number: 4624976
    Abstract: A composition for modeling material comprising a synthetic resin, a wooden powder and an oil formulated and kneaded. The synthetic resin is a rubber-reinforced styrene resin. The oil is a hydrocarbon oil having a specified viscosity, and restriction of the content of an aromatic ring-forming carbon. The composition is formed into flat board, round rod, etc. and used as modeling material for shaping patterns or models.
    Type: Grant
    Filed: July 22, 1985
    Date of Patent: November 25, 1986
    Assignees: Nippon Petrochemicals Co., Ltd., Ube Cycon, Ltd.
    Inventors: Osamu Amano, Atsushi Kaiya, Takao Tanaka, Hitoshi Akimura, Katsuhiro Tsujihata, Kouji Hirata