Abstract: Disclosed is an electrostatic chuck comprising a ceramic dielectric layer having a surface for placing thereon a work that is to be held, and an electrode provided on a surface opposite to the surface of the ceramic dielectric layer for placing the work thereon, wherein: the placing surface of the ceramic dielectric layer is sectionalized into an outer peripheral region and a central region by gas injection grooves extending in a circumferential manner; the surface roughness Ra(o) of the outer peripheral region of the placing surface and the surface roughness Ra(i) ot the central region satisfy the following conditions: 0.6≦Ra(i)≦1.5 &mgr;m Ra(o)≦0.7 &mgr;m Ra(i)≧Ra(o)  and the outer peripheral region of the placing surface is higher than the inner peripheral region by not less than 0.6 &mgr;m.

Abstract: Disclosed is an electrostatic chuck comprising a ceramic dielectric layer having a surface for placing thereon a work that is to be held, and an eloctrode provided on a surface opposite to the surface of the ceramic dielectric layer for placing the work thereon, wherein:

Abstract: An electrostatic chuck comprising a chucking body of a dielectric ceramics and an electrostatic inner electrode embedded in the chuck (first invention), the ceramics having a volume resistivity value not more than 10.sup.13 .OMEGA.cm at a high temperature not less than 250.degree. C. This electrostatic chuck can properly chuck, fix, carry and correct wafers even at a high temperature not less than 250.degree. C. in CVD, PVD or high temperature etching apparatuses.An electrostatic chuck comprising a chucking body of a single-crystalline sapphire and an electrostatic inner electrode embedded in the chuck (second invention). This electrostatic chuck is characterized by extremely small leak current, high mechanical strength and strong chucking force even in the temperature range of room temperature to 500.degree. C. and in the voltage range of 500 to 2000 V. With this electrostatic chuck, objects to be chucked, such as silicon wafers, are less contaminated.