Patents by Inventor Hitoshi Chiyoma

Hitoshi Chiyoma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10007004
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 26, 2018
    Assignee: TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
    Inventors: Hitoshi Chiyoma, Atsuya Yoshida, Wataru Matsuyama, Toyoo Yamamoto, Hiroshi Aida, Yuichi Shimba
  • Patent number: 9964652
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: May 8, 2018
    Assignee: TOSHIBA ELECTRONIC TUBES & DEVICES CO., LTD.
    Inventors: Hitoshi Chiyoma, Atsuya Yoshida, Wataru Matsuyama, Toyoo Yamamoto, Hiroshi Aida, Yuichi Shimba
  • Patent number: 9880292
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: January 30, 2018
    Assignee: TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
    Inventors: Hitoshi Chiyoma, Atsuya Yoshida, Wataru Matsuyama, Toyoo Yamamoto, Hiroshi Aida, Yuichi Shimba
  • Publication number: 20170363751
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Application
    Filed: September 6, 2017
    Publication date: December 21, 2017
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Hitoshi Chiyoma, Atsuya Yoshida, Wataru Matsuyama, Toyoo Yamamoto, Hiroshi Aida, Yuichi Shimba
  • Publication number: 20170363752
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Application
    Filed: September 6, 2017
    Publication date: December 21, 2017
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
    Inventors: Hitoshi CHIYOMA, Atsuya YOSHIDA, Wataru MATSUYAMA, Toyoo YAMAMOTO, Hiroshi AIDA, Yuichi SHIMBA
  • Patent number: 9006669
    Abstract: According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hitoshi Chiyoma, Hiroshi Iwata
  • Publication number: 20140295062
    Abstract: According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.
    Type: Application
    Filed: June 11, 2014
    Publication date: October 2, 2014
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Hitoshi CHIYOMA, Atsuya YOSHIDA, Wataru MATSUYAMA, Toyoo YAMAMOTO, Hiroshi AIDA, Yuichi SHIMBA
  • Patent number: 7982190
    Abstract: According to one embodiment, a radiation detector includes, a substrate, a scintillator layer, a moistureproof body, and an adhesion layer. The substrate comprises a photoelectric conversion element. The scintillator layer is formed on the substrate and converts radiation into fluorescence. The moistureproof body comprises a flange portion in a periphery thereof, the moistureproof body being deep enough to contain at least the scintillator layer. The adhesion layer causes the substrate and the flange portion of the moistureproof body to adhere to each other in a sealed manner.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: July 19, 2011
    Assignee: Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Katsuhisa Homma, Hitoshi Chiyoma, Shinetsu Fujieda, Keiko Sakai, Masakuni Ikagawa, Akiko Suzuki
  • Publication number: 20100224784
    Abstract: According to one embodiment, a radiation detector includes, a substrate, a scintillator layer, a moistureproof body, and an adhesion layer. The substrate comprises a photoelectric conversion element. The scintillator layer is formed on the substrate and converts radiation into fluorescence. The moistureproof body comprises a flange portion in a periphery thereof, the moistureproof body being deep enough to contain at least the scintillator layer. The adhesion layer causes the substrate and the flange portion of the moistureproof body to adhere to each other in a sealed manner.
    Type: Application
    Filed: May 18, 2010
    Publication date: September 9, 2010
    Applicant: Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Katsuhisa Homma, Hitoshi Chiyoma, Shinetsu Fujieda, Keiko Sakai, Masakuni Ikagawa, Akiko Suzuki
  • Publication number: 20100224785
    Abstract: According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.
    Type: Application
    Filed: May 18, 2010
    Publication date: September 9, 2010
    Applicants: KABUSHIKI KAISHA TOSHIBA, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Hitoshi Chiyoma, Hiroshi Iwata
  • Patent number: 7772562
    Abstract: In a radiation detector in which scintillator layers are directly formed on all the light receiving parts of a plurality of photoelectric conversion substrates, space and level difference between the adjacent photoelectric conversion substrates are determined so that the effects of these space and level difference fall within a range corresponding to the effect of one photoelectric conversion element. Specifically, the space between the adjacent photoelectric conversion substrates is equal to or less than 133 ?m and the level difference between the adjacent photoelectric conversion substrates is equal to or less than 100 ?m. Accordingly, the scintillator layers can be directly formed on all the light receiving parts of the plurality of photoelectric conversion substrates. This prevents degradation in MTF and sensitivity and reduces manufacturing costs.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: August 10, 2010
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Shirofumi Yamagishi, Hitoshi Chiyoma
  • Patent number: 7755053
    Abstract: A radiation detection apparatus includes a radiation detection panel having a fluorescent film and photoelectric conversion elements, a support board for supporting the radiation detection panel, and a gel member displaced between the radiation detection panel and support board.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: July 13, 2010
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices, Co., Ltd.
    Inventor: Hitoshi Chiyoma
  • Publication number: 20100019162
    Abstract: In a radiation detector in which scintillator layers are directly formed on all the light receiving parts of a plurality of photoelectric conversion substrates, space and level difference between the adjacent photoelectric conversion substrates are determined so that the effects of these space and level difference fall within a range corresponding to the effect of one photoelectric conversion element. Specifically, the space between the adjacent photoelectric conversion substrates is equal to or less than 133 ?m and the level difference between the adjacent photoelectric conversion substrates is equal to or less than 100 ?m. Accordingly, the scintillator layers can be directly formed on all the light receiving parts of the plurality of photoelectric conversion substrates. This prevents degradation in MTF and sensitivity and reduces manufacturing costs.
    Type: Application
    Filed: June 24, 2009
    Publication date: January 28, 2010
    Applicants: KABUSHIKI KAISHA TOSHIBA, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventors: Shirofumi Yamagishi, Hitoshi Chiyoma
  • Publication number: 20090127466
    Abstract: A radiation detection apparatus includes a radiation detection panel having a fluorescent film and photoelectric conversion elements, a support board for supporting the radiation detection panel, and a gel member displaced between the radiation detection panel and support board.
    Type: Application
    Filed: November 17, 2008
    Publication date: May 21, 2009
    Applicants: KABUSHIKI KAISHA TOSHIBA, Toshiba Electron Tubes & Devices Co., Ltd.
    Inventor: Hitoshi Chiyoma
  • Publication number: 20080237474
    Abstract: A semiconductor photodiode includes: an insulative substrate; a first conductivity type semiconductor layer formed on the insulative substrate; an i-type semiconductor layer formed on the first conductivity type semiconductor layer; a second conductivity type semiconductor layer formed on the i-type semiconductor layer; and a metal electrode. The metal electrode is provided between the insulative substrate and the first conductivity type semiconductor layer so that a peripheral face of the metal electrode is located inside a peripheral face of the first conductivity type semiconductor layer.
    Type: Application
    Filed: March 24, 2008
    Publication date: October 2, 2008
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
    Inventors: Junichi TONOTANI, Hiroshi AIDA, Hiroshi ONIHASHI, Hitoshi CHIYOMA
  • Patent number: 6754950
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: June 29, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Patent number: 6628043
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Publication number: 20020149298
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: October 17, 2002
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Patent number: 6377138
    Abstract: A surface acoustic wave filter element and a method of producing the same. The element is constructed in a manner such that a conductive film, which constitutes a plurality of electrode fingers, a bus bar connecting the electrode fingers in common, an electrode pad connected to the bus bar, etc., is formed on a piezoelectric substrate. When using the surface acoustic wave filter element with this arrangement in a high-frequency band, the thickness of the conductive film and the line width of electrodes are reduced, so that the mechanical strength is a critical problem. According to the present invention, therefore, the conductive film has a two-layer structure, including a layer containing tantalum and aluminum and a metallic layer of aluminum or an alloy consisting mainly of aluminum formed thereon, for example. The composition ratio between tantalum and aluminum is set so that the tantalum content ranges from 39% to 75% (atomic percentage).
    Type: Grant
    Filed: June 4, 1999
    Date of Patent: April 23, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshiyuki Takagi, Hitoshi Chiyoma, Naoki Akahori, Yasuo Ebata, Minoru Kawase, Masayoshi Koshino, Kaoru Sakinada
  • Publication number: 20010009342
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: July 26, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma