Patents by Inventor Hitoshi Egawa

Hitoshi Egawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Table tennis ball and table tennis ball-use thermoplastic resin composition
    Patent number: 9623288
    Abstract: A table tennis ball faithfully reproduces the playing characteristics of celluloid table tennis balls without using celluloid, and a thermoplastic resin composition for table tennis balls provides a table tennis ball having an excellent balance of elastic modulus, impact resistance, and density. The table tennis ball is composed of a celluloid-free thermoplastic resin or thermoplastic resin composition having a flexural modulus according to ISO 178 of 1650 MPa or more, a Charpy impact strength according to ISO 179 of 20 kJ/m2 or more, and a density according to ISO 1183 of less than 1.20 g/cm3, has a diameter of 39.0 mm or more, and weighs 2.0 to 3.5 g.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: April 18, 2017
    Assignees: Nippon Takkyu Co., Ltd., Toray Industries, Inc.
    Inventors: Hidenori Mochizuki, Hitoshi Egawa, Tetsu Sato, Tadakatsu Takasaki, Satoshi Toki
  • TABLE TENNIS BALL AND TABLE TENNIS BALL-USE THERMOPLASTIC RESIN COMPOSITION
    Publication number: 20160074713
    Abstract: A table tennis ball faithfully reproduces the playing characteristics of celluloid table tennis balls without using celluloid, and a thermoplastic resin composition for table tennis balls provides a table tennis ball having an excellent balance of elastic modulus, impact resistance, and density. The table tennis ball is composed of a celluloid-free thermoplastic resin or thermoplastic resin composition having a flexural modulus according to ISO 178 of 1650 MPa or more, a Charpy impact strength according to ISO 179 of 20 kJ/m2 or more, and a density according to ISO 1183 of less than 1.20 g/cm3, has a diameter of 39.0 mm or more, and weighs 2.0 to 3.5 g.
    Type: Application
    Filed: April 16, 2014
    Publication date: March 17, 2016
    Inventors: Hidenori Mochizuki, Hitoshi Egawa, Tetsu Sato, Tadakatsu Takasaki, Satoshi Toki