Patents by Inventor Hitoshi Fujiyama

Hitoshi Fujiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230306634
    Abstract: There is provided a target detection method and detection device that can detect a target by a simple method and configuration.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 28, 2023
    Applicants: SHIROKI CORPORATION, TAMADIC Co., Ltd., Shinya Hirano, TACT SYSTEM Co., Ltd.
    Inventors: Yu OKUMURA, Naofumi Matsushita, Junya Nakamura, Tomokazu Uchiyama, Shinji Fujino, Motohiro Kakureya, Kohei Yagi, Shinya Hirano, Hitoshi Fujiyama
  • Publication number: 20230302651
    Abstract: There are provided a target detection method and detection device that include a calibration function and can maintain detection accuracy of a target irrespectively of a change (such as a temperature) in external environment. A target detection method includes: a step of calculating a quantitative value; a step of, at a first position information generation device, measuring a first target; a step of, at a second position information generation device, measuring a second target; a step of calculating a position of the second target using the first position information generation device as a position reference based on a measurement value of the first target obtained by the first position information generation device, a measurement value of the second target obtained by the second position information generation device, and the quantitative value; and a step of calibrating the quantitative value before measuring a third target using the second position information generation device.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 28, 2023
    Applicants: SHIROKI CORPORATION, TAMADIC Co., Ltd., Shinya HIRANO, TACT SYSTEM Co., Ltd.
    Inventors: Yu Okumura, Naofumi Matsushita, Junya Nakamura, Tomokazu Uchiyama, Shinji Fujino, Motohiro Kakureya, Kohei Yagi, Shinya Hirano, Hitoshi Fujiyama
  • Publication number: 20230031819
    Abstract: There are provided a positioning method and a positioning device that can position workpieces by a simple method and configuration. A positioning method includes: gripping at least one of first and second workpieces; obtaining point group data of the at least one gripped workpiece of the first and second workpieces; calculating a translation matrix of shape fitting point group data obtained by adjusting a position of the point group data to reference data in a position adjustment state of the first and second workpieces; calculating an inverse matrix based on the translation matrix; and positioning the first and second workpieces by moving the at least one gripped workpiece of the first and second workpieces based on at least one of the translation matrix and the inverse matrix.
    Type: Application
    Filed: July 22, 2022
    Publication date: February 2, 2023
    Inventors: Jun MASUDA, Kenji SHIMIZU, Yuji MORI, Hisao HISHIKAWA, Naofumi MATSUSHITA, Shunsuke TANAKA, Yuki INOUE, Fuminori IMAIZUMI, Junya NAKAMURA, Tomokazu UCHIYAMA, Shinji FUJINO, Motohiro KAKUREYA, Kohei YAGI, Shinya HIRANO, Hitoshi FUJIYAMA
  • Patent number: 8410808
    Abstract: Provided is an anisotropic conductive connector and a prove member, each of which ensures that all of the conductive parts exhibit uniform conductivity when a pressing force is applied, even when the inspection target wafer has a large area and total number of inspection target electrodes of integrated circuits is 10,000 or more, and a wafer inspection system including the probe member.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: April 2, 2013
    Assignee: JSR Corporation
    Inventors: Masaya Naoi, Hitoshi Fujiyama, Ichihiro Miura
  • Patent number: 7737707
    Abstract: A sheet-like probe and a method of producing the probe. In the probe electrode structure bodies do not come out from an insulation film and achieve high durability, and in a burn-in test for a wafer having a large area and for a circuit device having to-be-inspected electrodes with small intervals, positional displacement, caused by temperature variation, between the electrode structure bodies and the to-be-inspected electrode can be reliably prevented for stable connection conditions. The sheet-like probe includes an insulation layer and a contact film provided with electrode structure bodies arranged on the insulation layer to be apart from each other in the surface direction of the insulation layer and penetratingly extend in the thickness direction of the insulation layer. The electrode structure bodies each are composed of a surface electrode section exposed to the front surface of the insulation layer.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: June 15, 2010
    Assignee: JSR Corporation
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi
  • Publication number: 20100127724
    Abstract: Provided is an anisotropic conductive connector and a prove member, each of which ensures that all of the conductive parts exhibit uniform conductivity when a pressing force is applied, even when the inspection target wafer has a large area and total number of inspection target electrodes of integrated circuits is 10,000 or more, and a wafer inspection system including the probe member.
    Type: Application
    Filed: March 27, 2008
    Publication date: May 27, 2010
    Applicant: JSR CORPORATION
    Inventors: Masaya Naoi, Hitoshi Fujiyama, Ichihiro Miura
  • Patent number: 7671609
    Abstract: A sheet-like probe has a porous film. In the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are integrated such that a flexible resin insulation layer is included in a fine hole of the porous film. Electrode structure bodies are supported in a penetrating manner in the insulation layer.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: March 2, 2010
    Assignee: JSR Corporation
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi
  • Patent number: 7656176
    Abstract: A probe member for wafer inspection having a sheet-like probe, the probe including a frame plate in which openings are formed, and contact films arranged on a front surface of the frame plate so as to close the openings, each of the contact films obtained by arranging, in an insulating film formed of a flexible resin, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed corresponding to the electrode regions, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, wherein each of the openings of the frame plate in the sheet-like probe have a size for receiving the external shape in a plane direction in the elastic anisotropically conductive film of the anisotropically conductive connector.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 2, 2010
    Assignee: JSR Corporation
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Publication number: 20090140756
    Abstract: Disclosed herein are a probe member for wafer inspection, a probe card for wafer inspection and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.
    Type: Application
    Filed: October 27, 2005
    Publication date: June 4, 2009
    Applicant: JSR Corporation
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Publication number: 20070268032
    Abstract: Provided are a probe member, a probe card and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.
    Type: Application
    Filed: November 10, 2005
    Publication date: November 22, 2007
    Applicant: JSR CORPORATION
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Publication number: 20070205783
    Abstract: A sheet-like probe and a method of producing the probe. In the probe electrode structure bodies do not come out from an insulation film and achieve high durability, and in a burn-in test for a wafer having a large area and for a circuit device having to-be-inspected electrodes with small intervals, positional displacement, caused by temperature variation, between the electrode structure bodies and the to-be-inspected electrode can be reliably prevented for stable connection conditions. The sheet-like probe includes an insulation layer and a contact film provided with electrode structure bodies arranged on the insulation layer to be apart from each other in the surface direction of the insulation layer and penetratingly extend in the thickness direction of the insulation layer. The electrode structure bodies each are composed of a surface electrode section exposed to the front surface of the insulation layer.
    Type: Application
    Filed: April 26, 2005
    Publication date: September 6, 2007
    Applicant: JSR CORPORATION
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi