Abstract: A continuous assembly apparatus comprising means for transporting a lead frame, for adhering a semiconductor chip to a supporting member of the lead frame, for connecting chip electrodes via bonding wires to inner leads of the lead frame, for forming a protective coating on the chip, wire and lead frame, and for separating the inner leads from the supporting member.

Abstract: A lead frame is prepared which has a plurality of leads whose inner lead portions are coupled to a support member and a notch formed across the bottom surface of each inner lead portion near at its front portion on the support member side. After an LSI chip is adhered to the support member, pads on the chip are connected via bonding wires to corresponding inner leads of the plurality of leads. The chip and inner lead portions are buried in an insulating layer made of resin or the like as protective coating. Each inner lead portion is cut with a cutting device such as laser beam at the notch position to separate the inner lead portion from the support member. Thereafter, the separated assembly unit is accommodated in a package made of resin or the like, and the outer leads are cut and shaped. For an assembly method of a semiconductor device including a wire bonding process, bonding defects to be caused by deformed leads can be reduced.

Abstract: A lead frame is prepared which has a plurality of leads whose inner lead portions are coupled to a support member and a notch formed across the bottom surface of each inner lead portion near at its front portion on the support member side. After an LSI chip is adhered to the support member, pads on the chip are connected via bonding wires to corresponding inner leads of the plurality of leads. The chip and inner lead portions are buried in an insulating layer made of resin or the like as protective coating. Each inner lead portion is cut with a cutting device such as laser beam at the notch position to separate the inner lead portion from the support member. Thereafter, the separated assembly unit is accommodated in a package made of resin or the like, and the outer leads are cut and shaped. For an assembly method of a semiconductor device including a wire bonding process, bonding defects to be caused by deformed leads can be reduced.