Patents by Inventor Hitoshi Hamaguchi

Hitoshi Hamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10392699
    Abstract: The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i): (i) the step of forming a coating film on a non-flat surface of a structure using a resin composition which includes an acid-dissociable group-containing polymer and an acid generator; and (ii) the step of forming a recess by subjecting a prescribed part of a portion of the coating film to irradiation with radiation.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: August 27, 2019
    Assignee: JSR CORPORATION
    Inventors: Hitoshi Hamaguchi, Kenrou Tanaka, Kenzou Ookita, Keisuke Kuriyama
  • Patent number: 10032920
    Abstract: The thin film transistor includes a first insulating layer provided on a substrate; a source electrode and a drain electrode that are provided on the first insulating layer; a semiconductor layer provided so as to cover the first insulating layer, the source electrode, and the drain electrode; a second insulating layer provided on the semiconductor layer; and a gate electrode provided on the second insulating layer, in which the first insulating layer is formed of a hydrophilic/hydrophobic material and has a recess portion, and the source electrode and the drain electrode are provided so as to fill the recess portion of the first insulating layer.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: July 24, 2018
    Assignee: JSR Corporation
    Inventors: Hitoshi Hamaguchi, Kenrou Tanaka, Kenzou Ookita, Keisuke Kuriyama
  • Patent number: 9980392
    Abstract: A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 22, 2018
    Assignee: JSR CORPORATION
    Inventors: Hitoshi Hamaguchi, Kenrou Tanaka, Kenzou Ookita, Keisuke Kuriyama
  • Publication number: 20170306481
    Abstract: The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i): (i) the step of forming a coating film on a non-flat surface of a structure using a resin composition which includes an acid-dissociable group-containing polymer and an acid generator; and (ii) the step of forming a recess by subjecting a prescribed part of a portion of the coating film to irradiation with radiation.
    Type: Application
    Filed: September 8, 2015
    Publication date: October 26, 2017
    Applicant: JSR CORPORATION
    Inventors: Hitoshi HAMAGUCHI, Kenrou TANAKA, Kenzou OOKITA, Keisuke KURIYAMA
  • Patent number: 9746775
    Abstract: Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: August 29, 2017
    Assignee: JSR CORPORATION
    Inventors: Hitoshi Hamaguchi, Kenrou Tanaka, Kenzou Ookita, Keisuke Kuriyama
  • Publication number: 20170243980
    Abstract: The thin film transistor includes a first insulating layer provided on a substrate; a source electrode and a drain electrode that are provided on the first insulating layer; a semiconductor layer provided so as to cover the first insulating layer, the source electrode, and the drain electrode; a second insulating layer provided on the semiconductor layer; and a gate electrode provided on the second insulating layer, in which the first insulating layer is formed of a hydrophilic/hydrophobic material and has a recess portion, and the source electrode and the drain electrode are provided so as to fill the recess portion of the first insulating layer.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 24, 2017
    Inventors: Hitoshi HAMAGUCHI, Kenrou TANAKA, Kenzou OOKITA, Keisuke KURIYAMA
  • Publication number: 20170042038
    Abstract: A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.
    Type: Application
    Filed: September 12, 2016
    Publication date: February 9, 2017
    Applicant: JSR CORPORATION
    Inventors: HITOSHI HAMAGUCHI, KENROU TANAKA, KENZOU OOKITA, KEISUKE KURIYAMA
  • Publication number: 20160062242
    Abstract: Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.
    Type: Application
    Filed: April 15, 2014
    Publication date: March 3, 2016
    Applicant: JSR CORPORATION
    Inventors: Hitoshi HAMAGUCHI, Kenrou TANAKA, Kenzou OOKITA, Keisuke KURIYAMA
  • Patent number: 7923967
    Abstract: A method controls a battery pack that includes a rechargeable battery, a control circuit that controls charge operation of the battery, and a charge control element that controls the charge current through the control circuit. In the method, even though the control circuit controls the charge control element so that the charge control element turns to OFF, in a case where the charge current is detected, the control circuit determines that abnormality occurs if detecting that the current flows at a rate not less than a first current value during a first detection period, and additionally determines that abnormality occurs if detecting a state the current flows at a rate less than the first current value for a second detection period longer than the first detection period.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: April 12, 2011
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hitoshi Hamaguchi, Toru Nishikawa
  • Patent number: 7642747
    Abstract: A battery pack provided with a current cut-off device connected in series with batteries, a tamper detector to detect tampering and issue a tamper signal, and a control circuit connected to the tamper detector. If the tamper detector detects tampering with the battery pack, the control circuit switches the current cut-off device off to shut off current to the batteries, or it issues a tamper signal.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: January 5, 2010
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Toru Morioka, Shinichi Itagaki, Hitoshi Hamaguchi, Atsushi Kawasumi, Toru Nishikawa
  • Publication number: 20080224667
    Abstract: A method for charging a lithium-ion secondary battery is so designed as to fully charge, with a voltage of the lithium-ion secondary battery being limited to a set voltage. Further, the method for charging the lithium-ion secondary battery is so designed that a degradation level of the lithium-ion secondary battery is detected, and when the degradation is advanced, the battery is fully charged with the set voltage being lowered.
    Type: Application
    Filed: March 11, 2008
    Publication date: September 18, 2008
    Inventors: Koji Tanaka, Kenichi Morina, Hitoshi Hamaguchi, Hirofumi Hirooka, Toru Morioka
  • Publication number: 20070229026
    Abstract: The battery pack of the present invention is provided with a current cut-off device connected in series with batteries, a tamper detector to detect tampering and issue a tamper signal, and a control circuit connected to the tamper detector. If the tamper detector detects tampering with the battery pack, the control circuit switches the current cut-off device off to shut off current to the batteries, or it issues a tamper signal.
    Type: Application
    Filed: March 23, 2007
    Publication date: October 4, 2007
    Inventors: Toru Morioka, Shinichi Itagaki, Hitoshi Hamaguchi, Atsushi Kawasumi, Toru Nishikawa
  • Publication number: 20070188141
    Abstract: A method controls a battery pack that includes a rechargeable battery, a control circuit that controls charge operation of the battery, and a charge control element that controls the charge current through the control circuit. In the method, even though the control circuit controls the charge control element so that the charge control element turns to OFF, in a case where the charge current is detected, the control circuit determines that abnormality occurs if detecting that the current flows at a rate not less than a first current value during a first detection period, and additionally determines that abnormality occurs if detecting a state the current flows at a rate less than the first current value for a second detection period longer than the first detection period.
    Type: Application
    Filed: February 7, 2007
    Publication date: August 16, 2007
    Inventors: Hitoshi Hamaguchi, Toru Nishikawa