Patents by Inventor Hitoshi Hatashima

Hitoshi Hatashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5575851
    Abstract: Disclosed herein is a die coater comprising a die composed of upper and lower mold-pieces which form a manifold and a slit extending from the manifold, an inner deckle shaft disposed in the manifold, a deckle disposed in the slit in a fluid-tight state, and a deckle guide; the inner deckle shaft having a fluid-tight portion near an end thereof and capable of moving with its fluid-tight state kept, the deckle and the deckle guide being secured to the inner deckle shaft, and the deckle being connected with the fluid-tight portion of the inner deckle shaft.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: November 19, 1996
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tetsuo Abe, Hitoshi Hatashima, Kunihiko Ichikawa, Takefumi Yoshikawa