Patents by Inventor Hitoshi Heta

Hitoshi Heta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6960383
    Abstract: Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: November 1, 2005
    Assignee: Araco Kabushiki Kaisha
    Inventors: Hitoshi Heta, Tamotsu Nagaya, Toshiaki Kondo, Masahiko Uchida, Makoto Suzuki
  • Publication number: 20030170422
    Abstract: Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).
    Type: Application
    Filed: February 5, 2003
    Publication date: September 11, 2003
    Applicant: Araco Kabushiki Kaisha and Daiwa Kasei Kogyo Kabuskiki Kaisha
    Inventors: Hitoshi Heta, Tamotsu Nagaya, Toshiaki Kondo, Masahiko Uchida, Makoto Suzuki