Patents by Inventor Hitoshi Hosokawa

Hitoshi Hosokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905388
    Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: February 20, 2024
    Assignee: ADEKA CORPORATION
    Inventors: Yusuke Nuida, Hitoshi Hosokawa, Hiroshi Morita
  • Publication number: 20220282059
    Abstract: The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 ?m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.
    Type: Application
    Filed: August 11, 2020
    Publication date: September 8, 2022
    Inventors: Yusuke NUIDA, Hitoshi HOSOKAWA, Hiroshi MORITA
  • Patent number: 5688493
    Abstract: A cosmetic composition comprising an aqueous polymer emulsion in an amount of from 1 to 60% by weight in terms of the weight of solid contents of the cosmetic composition. The aqueous polymer emulsion is produced by polymerizing at least one polymerizable monomer having a double bond in the presence of a plasticizer or a film-forming auxiliary. This aqueous polymer emulsion ensures in the cosmetic composition excellent gloss, film stability, water repellency, and film-forming properties, and also ensures freedom from cosmetic crumbling due to sweat and sebum.
    Type: Grant
    Filed: October 17, 1994
    Date of Patent: November 18, 1997
    Assignee: Kao Corporation
    Inventors: Tooru Sugawara, Hitoshi Hosokawa, Koichi Nakamura, Michitaka Sawada, Takehiro Tsutsumi
  • Patent number: 4888049
    Abstract: A biocide is strengthened in the biocidal effect with a branched guaternary ammonium salt having a group of ##STR1## in which R5 is an alkyl or alkenyl having 4 to 18 carbon atoms and R6 is an alkyl or alkenyl having 2 to 16 carbon atoms.
    Type: Grant
    Filed: May 29, 1987
    Date of Patent: December 19, 1989
    Assignee: Kao Corporation
    Inventors: Tetsuji Iwasaki, Hitoshi Hosokawa
  • Patent number: 4812158
    Abstract: A fertilizer is effectively prevented from caking with an aqueous composition comprising an aqueous solution obtained by solubilizing a water-insoluble synthetic polymeric compound by a concentrated aqueous solution of a salt of an alkyl sulfate having 6 to 10 carbon atoms, an .alpha.-olefinsulfonate having 6 to 10 carbon atoms, an alkylsulfonate having 6 to 10 carbon atoms or an alkylbenzenesulfonate having an alkyl group having 4 to 8 carbon atoms, said aqueous solution containing a wet spread sticking agent in an amount of 1.0 to 50% by weight based on the synthetic polymeric compound.
    Type: Grant
    Filed: August 11, 1988
    Date of Patent: March 14, 1989
    Assignee: Kao Corporation
    Inventors: Tetsuji Iwasaki, Hitoshi Hosokawa