Abstract: A method for manufacturing fuel cell bipolar plates involves heating and softening a nonwoven fabric including an electrically conductive powder and thermoplastic resin fibers of 0.1 to 20 ?m diameter, and shaping the softened nonwoven fabric.

Abstract: A block copolymer composed of polyphenylene sulfide segments and aromatic sulfide sulfone polymer segments and having a logarithmic viscosity [.eta.], determined at 206.degree. C. for its solution in alpha-chloronaphthalene in a polymer concentration of 0.4 g/100 ml of solution and calculated in accordance with the equation [.eta.]=ln (relative viscosity)/polymer concentration, of 0.03 to 1.0. A resin composition comprising the block copolymer and polyphenylene sulfide and/or an aromatic sulfide sulfone polymer and optionally a filler. The block copolymer and the resin composition have improved mechanical strength and are suitable, for example, for encapsulation of electronic component parts.

Abstract: A process for producing a block copolymer composed of polyphenylene sulfide segments and polyphenylene sulfide sulfone segments comprises reacting a polyphenylene sulfide prepolymer with a mixture of a dihalodiphenyl sulfone and a sulfidization agent, or a polyphenylene sulfide sulfone prepolymer with a mixture of a polyhalogenated aromatic compound and a sulfidization agent.

Abstract: A block copolymer composed of polyphenylene sulfide segments and aromatic sulfide sulfone polymer segments and having a logarithmic viscosity [.xi.], determined at 206.degree. C. for its solution in alpha-chloronaphthalene in a polymer concentration of 0.4 g/100 ml of solution and calculated in accordance with the equation [.xi.]=ln (relative viscosity)/polymer concentration, of 0.03 to 1.0. A resin composition comprising the block copolymer and polyphenylene sulfide and/or an aromatic sulfide sulfone polymer and optionally a filler. The block copolymer and the resin composition have improved mechanical strength and are suitable, for example, for encapsulation of electronic component parts.

Abstract: A resin composition comprising (a) 100 parts by weight of a block copolymer composed of polyphenylene sulfide segments and polyphenylene sulfide sulfone segments and (b) 0.01 to 20 parts by weight of at least one compound selected from the group consisting of epoxy resins, maleimide compounds, N,N'-diarylcarbodiimide compounds and organosilane compounds and as required, (c) an organic filler.

Abstract: A polyarylene sulfide resin composition comprising (A) 100 parts by weight of a polyarylene sulfide resin, (B) 0.01 to 30 parts of a polymer containing a fluoro-aliphatic group and having affinity for the resin (A) and a graft or block copolymer having affinity for the resin (A) and hydrophilicity and (C) 0 to 600 parts by weight of a filler. The composition is suitable for use as an encapsulation on material for electronic component parts and a coating agent.

Abstract: A block copolymer composed of polyphenylene sulfide segments and aromatic sulfide sulfone polymer segments and having a logarithmic viscosity [.eta.], determined at 206.degree. C. for its solution in alpha-chloronaphthalene in a polymer concentration of 0.4 g/100 ml of solution and calculated in accordance with the equation [.eta.]=ln (relative viscosity)/polymer concentration, of 0.03 to 1.0. A resin composition comprising the block copolymer and polyphenylene sulfide and/or an aromatic sulfide sulfone polymer and optionally a filler. The block copolymer and the resin composition have improved mechanical strength and are suitable, for example, for encapsulation of electronic component parts.

Abstract: A polyphenylene sulfide resin composition comprising (1) a polyphenylene sulfide resin having a melt flow value of at least 1,000 g/min., (2) silicic acid and/or a silicate, and (3) a silane compound composed of a vinylsilane and an aminosilane and/or an epoxysilane.