Patents by Inventor Hitoshi Kagaya
Hitoshi Kagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220369904Abstract: An endoscope system that illuminates an object and captures reflected light from the object includes a control processor. The control processor acquires an examination image and determines whether the examination image shows a swallowing state or a non-swallowing state. In addition, the control processor detects a high pixel value region from the examination image and determines that the examination image shows the swallowing state in a case in which an area of the high pixel value region is equal to or greater than a first threshold value. Further, the control processor performs grayscale conversion on the examination image to obtain a grayscale image and performs a binarization process for obtaining the high pixel value region in a case in which a density value of a pixel of the grayscale image is equal to or greater than a second threshold value.Type: ApplicationFiled: May 17, 2022Publication date: November 24, 2022Applicants: FUJIFILM Corporation, FUJITA ACADEMYInventors: Yuichi TERAMURA, Yohei OTAKA, Hitoshi KAGAYA, Seiko SHIBATA
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Publication number: 20220249858Abstract: A magnetic stimulator includes a magnetic core, conductors, and a casing. The magnetic core includes a body portion, and leg parts that protrude in the same direction from the body portion. The conductors are wound in a coil manner respectively around the leg parts. The casing is a container for housing the magnetic core and the conductors. The leg parts of the magnetic core are formed such that cross-sectional areas thereof that are parallel to a plane which simultaneously crosses the leg parts gradually decrease from base parts on the body portion side toward tips.Type: ApplicationFiled: January 8, 2020Publication date: August 11, 2022Inventors: Hitoshi MORI, Kenji YASHIMA, Hitoshi KAGAYA, Shinichi IZUMI
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Publication number: 20210244959Abstract: A magnetic stimulation device includes: a U-shaped magnetic core including a core body and a pair of legs extending in the same direction from the core body; conductors including a conductor having conductive layers that are wound around the leg and stacked in different levels and a conductor having conductive layers that are wound around the leg and stacked in different levels. The conductive layers are each formed of a wire having a rectangular cross section that is parallel to the longitudinal direction of the legs, and are connected in parallel to the respective legs. Between the legs, the wires of the conductive layers around the leg are respectively connected, at each level, to the wires of the conductive layers around the second leg.Type: ApplicationFiled: June 28, 2018Publication date: August 12, 2021Inventors: Hitoshi KAGAYA, Shinichi IZUMI, Hitoshi MORI, Kenji YASHIMA
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Patent number: 10303994Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.Type: GrantFiled: October 28, 2015Date of Patent: May 28, 2019Assignee: TOPPAN FORMS CO., LTD.Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
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Publication number: 20170236048Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.Type: ApplicationFiled: October 28, 2015Publication date: August 17, 2017Applicant: Toppan Forms Co., Ltd.Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
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Publication number: 20150339567Abstract: A radio IC-mounted article communicates in a microwave band or an ultrahigh frequency band, and is provided with: a substrate on which an IC chip and an antenna electrically connected to the IC chip are mounted; a first booster antenna electromagnetically coupled to the antenna; a second booster antenna electromagnetically coupled to the first booster antenna; and an article on which the substrate, the first booster antenna, and the second booster antenna are mounted.Type: ApplicationFiled: November 28, 2013Publication date: November 26, 2015Inventors: Nobuyuki Hirasaki, Yuya Takahashi, Hitoshi Kagaya
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Patent number: 8042742Abstract: A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate.Type: GrantFiled: October 7, 2005Date of Patent: October 25, 2011Assignee: Toppan Forms Co., Ltd.Inventors: Hitoshi Kagaya, Yoshiaki Ide, Takeshi Yamakami, Hiroki Ohno
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Patent number: 8020772Abstract: A non-contact type data reception and transmission body has an inlet having a base substrate, and an antenna and an integrated circuit chip which are provided on one side surface of the base substrate, and connected to each other, and a magnetic substrate layer disposed so that the magnetic substrate layer covers at least one of the antenna and the integrated circuit chip which constitute the inlet, wherein the magnetic substrate layer has a main component of a resin including a filler made of magnetic microparticles.Type: GrantFiled: December 12, 2005Date of Patent: September 20, 2011Assignees: Toppan Forms Co., Ltd., Aica Kogyo Company, LimitedInventors: Hitoshi Kagaya, Yoshiaki Ide, Takeshi Yamakami, Kenji Ebihara, Shutaro Wake
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Publication number: 20080191028Abstract: A non-contact type data reception and transmission body has an inlet having a base substrate, and an antenna and an integrated circuit chip which are provided on one side surface of the base substrate, and connected to each other, and a magnetic substrate layer disposed so that the magnetic substrate layer covers at least one of the antenna and the integrated circuit chip which constitute the inlet, wherein the magnetic substrate layer has a main component of a resin including a filler made of magnetic microparticles.Type: ApplicationFiled: December 12, 2005Publication date: August 14, 2008Applicants: TOPPAN FORMS CO., LTD., AICA KOGYO COMPANY, LIMITEDInventors: Hitoshi Kagaya, Yoshiaki Ide, Takeshi Yamakami, Kenji Ebihara, Shutaro Wake
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Publication number: 20080042266Abstract: A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate.Type: ApplicationFiled: October 7, 2005Publication date: February 21, 2008Applicant: TOPPAN FORMS CO., LTD.Inventors: Hitoshi Kagaya, Yoshiaki Ide, Takeshi Yamakami, Hiroki Ohno