Patents by Inventor Hitoshi Kanmura

Hitoshi Kanmura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080191373
    Abstract: In a method of regenerating a molding die which is over its lifetime after repetition use, a slit groove part, namely, an upper end surface of each block body in the molding die is cut or grinded to obtain a flat upper end surface of each block body. After completion of the cutting step, the flat upper end surface of each block body is coated with a coating layer using CVD method or a combination of CVD and PVD methods. Those steps enable each slit groove to have an original opening width, like each slit groove in a new molding die before repetition use. After completion of the regeneration, the regenerated molding die can produce porous structure bodies by extruding clayey ceramic raw material through the slit grooves.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 14, 2008
    Applicant: DENSO CORPORATION
    Inventor: Hitoshi Kanmura
  • Publication number: 20080006964
    Abstract: Ceramic honeycomb structure bodies are produced by using a die composed of ceramic batch supplying holes through which a ceramic batch is supplied and slit grooves through which the ceramic batch is extruded and shaped in a honeycomb structure shape. In a method of producing such a die, hardening is performed onto at least a slit groove formation surface of a die member in order to form a hardening treated film on the slit groove formation surface of the die member. After the completion of the hardening process, plural slit grooves are formed in the slit groove formation surface of the die member. A hardness of the hardening treated film of the die member is not less than 1.5 times of a hardness of the die member.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 10, 2008
    Applicant: DENSO CORPORATION
    Inventor: Hitoshi Kanmura
  • Publication number: 20070164456
    Abstract: A method is provided for repairing a die for molding a structure. A die to be repaired has holes for supplying a material, grooves arranged in a lattice form for communicating with the respective holes and for forming the material into a desired shape, and worn-out portions caused by repeated use. In the method, a repairing film is formed on a surface having the grooves and serving as an end face of a die body, through which extrusion is performed, so as to extend onto each corner at an intersecting line between the groove-formed surface and an inner side face of each groove, to restore each worn-out portion. Meanwhile, a material is supplied from the groove-formed surface side utilizing either one or both of PVD and CVD processes. This method readily provides a repaired die with good accuracy, which is excellent in durability and abrasion resistance.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 19, 2007
    Applicant: Denso Corporation
    Inventor: Hitoshi Kanmura
  • Patent number: 6849222
    Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are provided, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: February 1, 2005
    Assignee: Denso Corporation
    Inventors: Satoru Yamaguchi, Hitoshi Kanmura, Akinobu Muto, Toshiaki Tanida
  • Patent number: 6709704
    Abstract: A method of sealing the cells of a ceramic honeycomb body (5) and a cell sealing material (1) are disclosed which can suppress the deformation and dissolution of the portions of the ceramic honeycomb body dipped in the cell sealing material. An end surface (50) of the ceramic honeycomb body (5), with the portions of the end surface (50) not to be sealed covered with a masking material, is dipped in the cell sealing material (1) thereby to seal the cells in a predetermined part of the end surface. The cell sealing material (1) is composed of ceramic particles and an assistant for fluidizing the ceramic particles. The assistant has the property of not substantially redissolving a binder contained in the ceramic honeycomb body.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: March 23, 2004
    Assignee: Denso Corporation
    Inventors: Satoru Yamaguchi, Hitoshi Kanmura, Noboru Ogino, Takahiro Kondou, Kouji Suzuki
  • Publication number: 20030057204
    Abstract: The invention provides microwave continuous heating equipment that does not need redesigning even when workpiece size or length is changed, and that can perform efficient heat treatment by continuously radiating microwave power while preventing leakage of the microwave power. The microwave continuous heating equipment comprises a heating chamber 11, microwave absorbing chambers 13 and 14 connected to the front and rear ends, respectively, of the heating chamber, and transport equipment 15 for transporting workpieces thereon through the front-end microwave absorbing chamber 13, the heating chamber 11, and the rear-end microwave absorbing chamber 14 in the order state. Each of the microwave absorbing chambers 13 and 14 includes a workpiece transport path 13a, 14a having a meandering shape to prevent the microwave power from passing straight through an opening 13b, 14b at one end and an opening 13c, 14c, at the other end.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 27, 2003
    Inventors: Tomio Minobe, Kouji Mikami, Satoru Yamaguchi, Hitoshi Kanmura, Hiromi Katou, Yasunao Miura
  • Publication number: 20020066982
    Abstract: A method of sealing the cells of a ceramic honeycomb body (5) and a cell sealing material (1) are disclosed which can suppress the deformation and dissolution of the portions of the ceramic honeycomb body dipped in the cell sealing material. An end surface (50) of the ceramic honeycomb body (5), with the portions of the end surface (50) not to be sealed covered with a masking material, is dipped in the cell sealing material (1) thereby to seal the cells in a predetermined part of the end surface. The cell sealing material (1) is composed of ceramic particles and an assistant for fluidizing the ceramic particles. The assistant has the property of not substantially redissolving a binder contained in the ceramic honeycomb body.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 6, 2002
    Inventors: Satoru Yamaguchi, Hitoshi Kanmura, Noboru Ogino, Takahiro Kondou, Kouji Suzuki
  • Publication number: 20020020944
    Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are disclosed, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).
    Type: Application
    Filed: May 11, 2001
    Publication date: February 21, 2002
    Inventors: Satoru Yamaguchi, Hitoshi Kanmura, Akinobu Muto, Toshiaki Tanida
  • Patent number: 4261318
    Abstract: An engine ignition system includes a throttle sensor for detecting the position of a throttle valve. A control circuit is responsive to the detected throttle signal as well as the signals from other negative pressure and engine rpm sensors to generate a spark plug discharge start signal and a discharge stop signal. A high voltage generator supplies a high voltage to the respective spark plugs during the time interval between the time that the discharge start signal is generated and the time that the discharge stop signal is generated.
    Type: Grant
    Filed: May 4, 1979
    Date of Patent: April 14, 1981
    Assignee: Nippon Soken, Inc.
    Inventors: Toshihiko Igashira, Hisasi Kawai, Seiji Morino, Hitoshi Kanmura
  • Patent number: 4084548
    Abstract: A rotary piston engine has a rotor housing and a rotor disposed therein for planetary rotary motion. The housing and the rotor cooperate to define a plurality of variable volume working chambers each of which is moved along the inner peripheral surfaces of the housing and acts as intake, compression, combustion-expansion and exhaust chambers as the rotary planetary motion proceeds. A plug hole in which electrodes of an ignition plug are disposed is formed in the housing and so positioned as to be communicated with the intake chamber at its final stage of intake stroke. A passage is formed in the housing and connected at one end to the plug hole. The other end of the passage is connected to a supply source of a combustible gas, such as LPG or air-gasoline mixture, or to the atmosphere.
    Type: Grant
    Filed: June 15, 1976
    Date of Patent: April 18, 1978
    Assignee: Nippon Soken, Inc.
    Inventors: Hachiro Sasakura, Hitoshi Kanmura