Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: A door handle device for vehicles includes a handle body positioned on an outer surface of a vehicle door and lifted to be pulled back when the vehicle door is opened. The handle body is provided with a finger rest which extends to at least three directions of four directions including up, down, right and left directions.

Abstract: An overhead conveyance device and an overhead conveyance vehicle that can convey a conveying object, while keeping it at a minimum distance from surrounding equipment when the overhead conveying vehicle turns around during conveyance of the conveying object. The overhead conveyance device (1) is so structured that even when a carriage part (6) of the overhead conveyance vehicle (5) enters a branching part (3) for allowing the carriage part to change in traveling direction and turns around, the conveying object (25) grasped by a hand (9) can be kept unchanged in direction.

Abstract: An overhead conveyance device and an overhead conveyance vehicle that can convey a conveying object, while keeping it at a minimum distance from surrounding equipment when the overhead conveying vehicle turns around during conveyance of the conveying object. The overhead conveyance device (1) is so structured that even when a carriage part (6) of the overhead conveyance vehicle (5) enters a branching part (3) for allowing the carriage part to change in traveling direction and turns around, the conveying object (25) grasped by a hand (9) can be kept unchanged in direction.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: An overhead conveyance device and an overhead conveyance vehicle that can convey a conveying object, while keeping it at a minimum distance from surrounding equipment when the overhead conveying vehicle turns around during conveyance of the conveying object. The overhead conveyance device (1) is so structured that even when a carriage part (6) of the overhead conveyance vehicle (5) enters a branching part (3) for allowing the carriage part to change in traveling direction and turns around, the conveying object (25) grasped by a hand (9) can be kept unchanged in direction.

Abstract: A mechanical interface apparatus which is capable of loading semiconductor wafers stored in a sealed container into a processing apparatus without adversely affecting the surfaces of the semiconductor wafers due to exposure to external air or dust. When a sealed container 100 is placed on top of a processing apparatus 200, latch mechanisms 201 are activated to engage with a flange 103, so as to affix the container body 101. Then, valves 3 and 5 are opened to perform a gas purge, after which a drive mechanism provided inside a lock operating mechanism 220 is operated in order to withdraw lock arms 111 from concave portions 103a, thereby unlocking the bottom lid 110. Then, wafer cassettes 106 inside the container are lowered to a predetermined position by means of an in-apparatus elevator mechanism 202, and the wafer cassettes are loaded into the processing apparatus 200 by a cassette loading mechanism.

Abstract: A transport system has a track provided along a transport route forming a main route and at least one branch route connected to the main route at a branch point. A first power supply line is provided along the main route; a second power supply line is provided along the branch route and a transport vehicle moves along the track. There is a drive unit for driving the transport vehicle along the track with the drive unit being attached to the transport vehicle, a route selector for selecting a branch route at the branch point and a power receiver for receiving electric power from the first and second power supply lines to supply electric power to the drive unit.

Abstract: In an overhead hoist transfer having a moving carriage with a hand portion, which holds a load, elevatably suspended therefrom; and a means for teaching an appointed stop position on a placement base, on which said load is placed, to said moving carriage, LEDs 7a and 7b are installed at the hand portion 6, and a position detecting portion 12 consisting of a lens 12a and PSD 12b is installed at the placement base 53 side, in order to automatically and accurately enable a teaching of position correcting data in a short time without use of any manpower.

Abstract: A method of refining metal to be processed to a high degree of purity by heat-melting the metal in a melting furnace in the form of a metal crucible placed in a vacuum vessel. The method includes evacuating prior to melting, preheating the inside of the entire vacuum atmosphere including the inner wall surface of the vacuum vessel, component parts inside the vessel and the like in order to keep the total pressure within the vessel at 1.times.10.sup.-8 Torr or lower, and effecting high frequency induction heating while controlling the partial pressure of each of O.sub.2, H.sub.2, CO in the atmosphere inside the vessel. Further, the vacuum vessel, the metal crucible and an induction heating coil attached to the crucible, each of which has double jacket structure, are heated or cooled by supplying circulating heating or cooling water in a water-passage space of each of the vacuum vessel, the metal crucible and the induction heating coil, so that the inside of the melting furnace is baked.

Abstract: An automated guided vehicle includes a transporting portion having an upper surface and a driving device, the transporting portion being movable by the driving device; a transferring device provided on the upper surface of the transporting portion, the transferring device being capable of transferring a workpiece to or from an apparatus; and a mounting portion formed on the upper surface of the transporting portion, the mounting portion having at least two opening portions which allow an operation for transferring the workpiece. In the automated guided vehicle, photosensors are respectively arranged on the opening portions to detect an object which intrudes into a predetermined area or projects from the predetermined area, and a control device monitors a state of the photosensors and controls the transferring device or the driving device in accordance with the state of the photosensors.

Abstract: A method of refining metal to be processed to a high degree of purity by heat-melting the metal in a melting furnace in the form of a metal crucible placed in a vacuum vessel. The method includes evacuating prior to melting, preheating the inside of the entire vacuum atmosphere including the inner wall surface of the vacuum vessel, component parts inside the vessel and the like in order to keep the total pressure within the vessel at 1.times.10.sup.-8 Torr or lower, and effecting high frequency induction heating while controlling the partial pressure of each of O.sub.2, H.sub.2, CO in the atmosphere inside the vessel. Further, the vacuum vessel, the metal crucible and an induction heating coil attached to the crucible, each of which has double jacket structure, are heated or cooled by supplying circulating heating or cooling water in a water-passage space of each of the vacuum vessel, the metal crucible and the induction heating coil, so that the inside of the melting furnace is baked.

Abstract: A cold crucible induction melting furnace is provided with a plurality of segments separated by a plurality of slits that surround a bottom member which together form the melting chamber. Each lower end of each segment is overlapped with and spaced from a short part of a vertically extending side wall of the bottom member so as to form a horizontal gap there between. A radially and outwardly extending flange protrudes from the bottom member side wall below each segment lower end to form a lower gap there between. An induction coil is disposed around and spaced from an outer face of the segments with a lower end adjacent to each of the lower segment ends and an upper end adjacent to an upper part of each segment that is in turn connected with an adjacent upper segment part to form a short circuited part.

Abstract: A portable closed container has a container body, and a lid for opening and hermetically closing the opening of the container body, in which an internal atmosphere thereof is replaced with an inner atmosphere suitable for an article contained in the container through a gas purging operation. The container is improved such that the lid is a hollowed body with at least one purging wall hole.

Abstract: Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

Abstract: Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

Abstract: Disclosed is a wafer conveying system for a clean room which is high in wafer conveying efficiency, and makes it possible to achieve a variety of processing operations with high efficiency.

Abstract: A gas purge unit for a portable closed container is defined by a purge box including an opening, and a container stand around the opening on which a closed container is set; a gas supplying inlet coupled to a gas supplying source, and a gas discharging outlet; and a lifting mechanism for closing the opening from inside of the purge box and controlling the locking and unlocking operations of a locking mechanism provided in the lid of the container.