Abstract: An information processing apparatus (1) included in a welding training system includes a transmittance adjuster (14) capable of adjusting a transmittance of a window of a welding helmet in virtual space in multiple grades, and a display controller (17) configured to cause a display of an HMD (2) to display a situation of a welding operation in the virtual space at an illuminance corresponding to the adjusted transmittance. The transmittance adjuster (14) adjusts the transmittance based on a skill level of a trainee determined by a skill level determination unit (13).

Abstract: A semiconductor light emitting device includes a substrate, a first semiconductor light emitting element and a second semiconductor light emitting element. A first semiconductor light emitting element is provided on the substrate and includes a first layer having a first conductivity type, a first light emitting layer, and a second layer having a second conductivity type. A second semiconductor light emitting element is provided on the substrate and includes a third layer having a second conductivity type, a second light emitting layer, and a fourth layer having a first conductivity type. The first layer and the third layer are electrically connected. A peak emission wavelength of light emitted from the first light emitting layer and a peak emission wavelength of light emitted from the second light emitting layer are substantially same.

Abstract: According to an embodiment, a semiconductor device includes a first frame, a semiconductor element fixed to the first frame, a second frame, a third frame and a resin package. The second frame faces the first frame and is away from the first frame, the second frame being electrically connected to the semiconductor element via a metal wire. The resin package covers the semiconductor element, the first frame, and the second frame. The first frame and the second frame are exposed in one major surface of the resin package. The third frame juxtaposed to one of the first frame and the second frame, the third frame being continuously exposed from the major surface of the resin package to a side surface in contact with the major surface.

Abstract: According to an embodiment, a semiconductor device includes a first frame, a semiconductor element fixed to the first frame, a second frame, a third frame and a resin package. The second frame faces the first frame and is away from the first frame, the second frame being electrically connected to the semiconductor element via a metal wire. The resin package covers the semiconductor element, the first frame, and the second frame. The first frame and the second frame are exposed in one major surface of the resin package. The third frame juxtaposed to one of the first frame and the second frame, the third frame being continuously exposed from the major surface of the resin package to a side surface in contact with the major surface.

Abstract: An electric light bulb with a base 1, including a positioning ring 7 adapted to be fitted onto and mounted to a cylindrical-shaped base 2 which holds a glass bulb 3 enclosing therein filaments 6. The positioning ring includes elastic pieces 11 and weld pieces 12 formed on a fitting hole 8, through which the base is inserted, the elastic pieces being adapted to resiliently abut against an outer peripheral surface of the base, the weld pieces being adapted to be welded to the outer peripheral surface of the base. The weld pieces 12 are securely welded to the outer peripheral surface of the base after the elastic pieces are made to abut against the outer peripheral surface of the base.

Abstract: An LED lamp assembly according to one embodiment of the present invention comprises an LED chip mounted on a first lead, a second lead electrically connected to the LED chip, a sealant for sealing the LED chip and portions of the first and second leads, the first and second leads comprising first areas sealed with the sealant and second areas exposed from the sealant, a metal plate fixed to at least one of the second areas of the first and second leads, and a pin for fixing the at least one of the second areas of the first and second leads and the metal plate, wherein a first hole is provided on the at least one of the second areas of the first and second leads, a second hole is provided in an area of the metal plate, and the pin is inserted in the first and second holes.

Abstract: A semiconductor light emitting device of this invention has more than three light emitting diodes which includes a pair of diodes connected parallel in the reverse direction for each other. A common terminal connecting each one of electrodes of all diodes, the first terminal in which the other electrodes of the diode pair is connected, and the second terminal in which the other electrode of the rest diode is connected, are provide in order to drive the diodes separately.

Abstract: A semiconductor light emitting device of this invention has more than three light emitting diodes which includes a pair of diodes connected parallel in the reverse direction for each other. A common terminal connecting each one of the electrodes of said all diodes, the first terminal in which the other electrodes of said diode pair is connected, and the second terminal in which the other electrode of the rest diode is connected, are provide in order to drive said diodes separately.

Abstract: A process for manufacturing zinc-silica composite plated steel performed by electrolyzation in a galvanization bath containing fine grains of silica, particularly colloidal silica fine particles. Surfactant having cationic property, such as polyoxyethylenelaurylamine or dodecyltrimethylammonium chloride is further added to the galavinization bath so that a zinc-silica layer is formed over the steel. The plated steel surfaces are further treated with a silane coupling agent, such as gamma-aminopropyltriethoxysilane. The steel plated with zinc-silica composite thus obtained has excellent resistance against corrosion and adhesion to organic paints or organic adhesives. The steel is suitable for various steel members and sheet iron for automobile bodies and parts which require high corrosion resistance.