Patents by Inventor Hitoshi Motomura

Hitoshi Motomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, its manufacturing method, and semiconductor light emitting device using the same
    Patent number: 8841692
    Abstract: A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area S1 of the mounting upper surface of the pad part 2 and an area S2 of a radiating lower surface opposite to the mounting upper surface is represented by 0<S1<S2. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: September 23, 2014
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Osamu Yoshioka, Hitoshi Motomura, Takehito Tsukamoto
  • Lead frame, its manufacturing method, and semiconductor light emitting device using the same
    Publication number: 20110133232
    Abstract: A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area S1 of the mounting upper surface of the pad part 2 and an area S2 of a radiating lower surface opposite to the mounting upper surface is represented by 0<S1<S2. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding.
    Type: Application
    Filed: February 4, 2011
    Publication date: June 9, 2011
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Osamu Yoshioka, Hitoshi Motomura, Takehito Tsukamoto