Patents by Inventor Hitoshi Nagase

Hitoshi Nagase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6978681
    Abstract: A pressure sensor comprising a holder 1 having mounted thereto a semiconductor pressure sensor element 2 that outputs a voltage signal corresponding to the pressure it receives, a connector case 3 for fixing a lead member 23 connected to the semiconductor pressure sensor element 21, a diaphragm 4 that defines together with the holder 1 a pressure sensing chamber 6 filled with insulating oil, and a lid member 5 made of metal to which a pressure introduction pipe 51 is mounted, wherein the holder 1 is made of metal and has a through-hole 12 that communicates the pressure sensing chamber 6 with the exterior and a seal member 27 that seals the through-hole 12, the connector case 3 has an insert hole 31 communicated with the through-hole 12 and through which the seal member 27 is inserted, and the diaphragm 4 is sandwiched between the holder 1 made of metal and the lid member 5 made of metal and bonded thereto.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: December 27, 2005
    Assignee: Fujikoki Corporation
    Inventors: Keiji Sasaki, Hitoshi Nagase
  • Publication number: 20050011273
    Abstract: A pressure sensor comprising a holder 1 having mounted thereto a semiconductor pressure sensor element 2 that outputs a voltage signal corresponding to the pressure it receives, a connector case 3 for fixing a lead member 23 connected to the semiconductor pressure sensor element 21, a diaphragm 4 that defines together with the holder 1 a pressure sensing chamber 6 filled with insulating oil, and a lid member 5 made of metal to which a pressure introduction pipe 51 is mounted, wherein the holder 1 is made of metal and has a through-hole 12 that communicates the pressure sensing chamber 6 with the exterior and a seal member 27 that seals the through-hole 12, the connector case 3 has an insert hole 31 communicated with the through-hole 12 and through which the seal member 27 is inserted, and the diaphragm 4 is sandwiched between the holder 1 made of metal and the lid member 5 made of metal and bonded thereto.
    Type: Application
    Filed: April 27, 2004
    Publication date: January 20, 2005
    Inventors: Keiji Sasaki, Hitoshi Nagase
  • Patent number: 6745633
    Abstract: A pressure sensor 1′ comprising a housing 10′ having a pressure introduction hole 12, a pressure sensing element 22 composed of a semiconductor element having piezoresistance effect, a holder 30 having fixed thereto the pressure sensing element 22, a guide member 98, a seal member 99 and a connector case 70, the pressure sensor element 22 and holder 30 joined in airtight manner to create a reference pressure chamber 72. On the holder 30 of the pressure sensor body is mounted a circuit board 40 having electrode pads, the electrode pads connected to connectors 80 fixed to the connector case 70 via conductive spring bodies 50. The guide member 98 supports holder 30, and in the opening 100 of the guide member 98 is placed the seal member 99.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: June 8, 2004
    Assignee: Fujikoki Corporation
    Inventors: Keiji Sasaki, Hitoshi Nagase, Isao Okura
  • Publication number: 20030107491
    Abstract: A pressure sensor 1′ comprising a housing 10′ having a pressure introduction hole 12, a pressure sensing element 22 composed of a semiconductor element having piezoresistance effect, a holder 30 having fixed thereto the pressure sensing element 22, a guide member 98, a seal member 99 and a connector case 70, the pressure sensor element 22 and holder 30 joined in airtight manner to create a reference pressure chamber 72. On the holder 30 of the pressure sensor body is mounted a circuit board 40 having electrode pads, the electrode pads connected to connectors 80 fixed to the connector case 70 via conductive spring bodies 50. The guide member 98 supports holder 30, and in the opening 100 of the guide member 98 is placed the seal member 99.
    Type: Application
    Filed: August 21, 2002
    Publication date: June 12, 2003
    Inventors: Keiji Sasaki, Hitoshi Nagase, Isao Okura