Patents by Inventor Hitoshi NAMAI

Hitoshi NAMAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230230886
    Abstract: To provide a technique capable of quantitatively grasping a change in three-dimensional shape including a cross-sectional shape of a pattern within a surface of a wafer or between wafers in a non-destructive manner before cross-sectional observation.
    Type: Application
    Filed: December 14, 2022
    Publication date: July 20, 2023
    Applicant: Hitachi High-Tech Corporation
    Inventors: Kenji YASUI, Mayuka OSAKI, Hitoshi NAMAI, Yuki OJIMA, Wataru NAGATOMO, Masami IKOTA, Maki KIMURA
  • Patent number: 10724856
    Abstract: To provide an image analysis apparatus capable of easily extracting an edge of an upper layer pattern formed intersecting with a lower layer pattern so as not to be affected by the lower layer pattern, the image analysis apparatus includes a calculation unit that calculates an analysis range including a region where the lower layer pattern intersects with the upper layer pattern and a region where the lower pattern is not formed, a calculation unit that averages a plurality of signal profiles, a calculation unit that calculates a maximum value and a minimum value of a signal intensity, a calculation unit that calculates a threshold level difference using the maximum value and the minimum value, and a calculation unit that calculates the edge of the upper layer pattern on the signal profile.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 28, 2020
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Atsuko Yamaguchi, Kazuhisa Hasumi, Hitoshi Namai
  • Publication number: 20190204247
    Abstract: To provide an image analysis apparatus capable of easily extracting an edge of an upper layer pattern formed intersecting with a lower layer pattern so as not to be affected by the lower layer pattern, the image analysis apparatus includes a calculation unit that calculates an analysis range including a region where the lower layer pattern intersects with the upper layer pattern and a region where the lower pattern is not formed, a calculation unit that averages a plurality of signal profiles, a calculation unit that calculates a maximum value and a minimum value of a signal intensity, a calculation unit that calculates a threshold level difference using the maximum value and the minimum value, and a calculation unit that calculates the edge of the upper layer pattern on the signal profile.
    Type: Application
    Filed: September 1, 2016
    Publication date: July 4, 2019
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Atsuko YAMAGUCHI, Kazuhisa HASUMI, Hitoshi NAMAI
  • Patent number: 10186399
    Abstract: A scanning electron microscope capable of properly determining a step of a step pattern formed on a sample regardless of combination of material of a groove of the step pattern and material of a projection of the step pattern, the scanning electron microscope includes a beam source, a detection unit having a first detection unit that detects a secondary electron emitted from the sample at an angle between an optical axis direction of the primary electron beam which is equal to or less than a predetermined value, and a second detection unit that detects a secondary electron emitted from the sample at an angle between the optical axis direction of the primary electron beam which is greater than the predetermined value, and a processing unit to obtain information on the step pattern using the information on a ratio between signals outputted from the first and the second detection unit.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 22, 2019
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Mayuka Osaki, Chie Shishido, Maki Tanaka, Hitoshi Namai, Fumihiro Sasajima, Makoto Suzuki, Yoshinori Momonoi
  • Patent number: 10096451
    Abstract: The present invention is: a pattern measurement device that, regardless of increased fineness, deviation, or the like of a pattern, accurately and stably performs measurement on the basis of edge identification or pattern or edge judgment; and a computer program. The pattern measurement device classifies pattern sites (G1, G2, G3, G4), which are repeatedly arrayed at a specific interval, in accordance with the position of the pattern sites, and executes a pattern edge type identification, a pattern type identification, or a measurement of the dimensions between predetermined pattern sites on the basis of an association between the classified pattern sites and information pertaining to the pattern edge type or information pertaining to the pattern type. The computer program causes a computer to execute the abovementioned process.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: October 9, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Hitoshi Namai, Tomoaki Yamazaki
  • Publication number: 20170301513
    Abstract: A scanning electron microscope capable of properly determining a step of a step pattern formed on a sample regardless of combination of material of a groove of the step pattern and material of a projection of the step pattern, the scanning electron microscope includes a beam source, a detection unit having a first detection unit that detects a secondary electron emitted from the sample at an angle between an optical axis direction of the primary electron beam which is equal to or less than a predetermined value, and a second detection unit that detects a secondary electron emitted from the sample at an angle between the optical axis direction of the primary electron beam which is greater than the predetermined value, and a processing unit to obtain information on the step pattern using the information on a ratio between signals outputted from the first and the second detection unit.
    Type: Application
    Filed: February 28, 2017
    Publication date: October 19, 2017
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Mayuka OSAKI, Chie SHISHIDO, Maki TANAKA, Hitoshi NAMAI, Fumihiro SASAJIMA, Makoto SUZUKI, Yoshinori MOMONOI
  • Publication number: 20160307730
    Abstract: The present invention is: a pattern measurement device that, regardless of increased fineness, deviation, or the like of a pattern, accurately and stably performs measurement on the basis of edge identification or pattern or edge judgment; and a computer program. The pattern measurement device classifies pattern sites (G1, G2, G3, G4), which are repeatedly arrayed at a specific interval, in accordance with the position of the pattern sites, and executes a pattern edge type identification, a pattern type identification, or a measurement of the dimensions between predetermined pattern sites on the basis of an association between the classified pattern sites and information pertaining to the pattern edge type or information pertaining to the pattern type. The computer program causes a computer to execute the abovementioned process.
    Type: Application
    Filed: December 1, 2014
    Publication date: October 20, 2016
    Inventors: Hitoshi NAMAI, Tomoaki YAMAZAKI
  • Patent number: 9329034
    Abstract: An object of the invention is to provide: a sample unevenness device that stably identifies unevenness formed on a sample, regardless of a pattern formation state or image acquisition conditions; and a computer program. As an aspect to achieve the above object, a device and computer program are proposed that obtain the area of a plurality of regions formed by a profile waveform of a given threshold or lower for a profile formed based on a detection signal obtained by scanning with a charged particle beam with respect to the sample; and determine either or both of that a site corresponding to a region with a relatively large area is a concave portion or that a space portion and a site corresponding to a space with a relatively small area is a convex portion or a line portion.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: May 3, 2016
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Hitoshi Namai, Satoru Yamaguchi, Fumihiro Sasajima
  • Patent number: 8953855
    Abstract: An object of the present invention is to provide an edge detection technique and equipment which are capable of stably detecting an edge by suppressing the influence of noise even in the case where the image is obtained by charged particle radiation equipment, such as a scanning electron microscope and has a low S/N ratio. More specifically, the present invention is to propose a technique and equipment which are configured to determine a peak position (edge) on the basis of the following two edge extraction techniques. That is, the present invention is to propose a technique and equipment wherein at least two peaks are formed by using, as edge detection techniques, for example, one peak detection technique having a relatively high sensitivity and the other peak detection technique which is relatively less susceptible to the influence of noise than the one peak detection technique, and wherein a position where the peaks coincide with each other is determined as a true peak position (edge position).
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: February 10, 2015
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Hitoshi Namai, Osamu Komuro, Satoru Yamaguchi, Fumihiro Sasajima
  • Publication number: 20130270436
    Abstract: An object of the invention is to provide: a sample unevenness device that stably identifies unevenness formed on a sample, regardless of a pattern formation state or image acquisition conditions; and a computer program. As an aspect to achieve the above object, a device and computer program are proposed that obtain the area of a plurality of regions formed by a profile waveform of a given threshold or lower for a profile formed based on a detection signal obtained by scanning with a charged particle beam with respect to the sample; and determine either or both of that a site corresponding to a region with a relatively large area is a concave portion or that a space portion and a site corresponding to a space with a relatively small area is a convex portion or a line portion.
    Type: Application
    Filed: October 14, 2011
    Publication date: October 17, 2013
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Hitoshi Namai, Satoru Yamaguchi, Fumihiro Sasajima
  • Publication number: 20090226096
    Abstract: An object of the present invention is to provide an edge detection technique and equipment which are capable of stably detecting an edge by suppressing the influence of noise even in the case where the image is obtained by charged particle radiation equipment, such as a scanning electron microscope and has a low S/N ratio. More specifically, the present invention is to propose a technique and equipment which are configured to determine a peak position (edge) on the basis of the following two edge extraction techniques. That is, the present invention is to propose a technique and equipment wherein at least two peaks are formed by using, as edge detection techniques, for example, one peak detection technique having a relatively high sensitivity and the other peak detection technique which is relatively less susceptible to the influence of noise than the one peak detection technique, and wherein a position where the peaks coincide with each other is determined as a true peak position (edge position).
    Type: Application
    Filed: February 26, 2009
    Publication date: September 10, 2009
    Inventors: Hitoshi NAMAI, Osamu Komuro, Satoru Yamaguchi, Fumihiro Sasajima
  • Publication number: 20070103463
    Abstract: To realize high speed simulation a simulation apparatus is provided with a graphics board including a depth buffer that stores a depth value of each polygon represented by three dimensional polygon data. In the graphics board, the depth value of each polygon is calculated on the basis of a camera parameter and the three dimensional polygon data, and the depth value within the depth buffer is sequentially updated with the calculated depth value. According to the depth value, sensor data is generated and outputted.
    Type: Application
    Filed: August 30, 2006
    Publication date: May 10, 2007
    Inventors: Fumiko Beniyama, Toshio Moriya, Hitoshi Namai