Patents by Inventor Hitoshi Nojiri
Hitoshi Nojiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20100218984Abstract: The present invention is to provide (i) a photosensitive dry film resist which allows water system development and which is excellent in resolution, flame retardancy, adhesiveness, moisture resistance, electric reliability, and preservation stability, (ii) a method for producing the photosensitive dry film resist, and (iii) usage thereof.Type: ApplicationFiled: January 23, 2007Publication date: September 2, 2010Inventors: Toshio Yamanaka, Koji Okada, Kohei Kojima, Hitoshi Nojiri
-
Patent number: 7721672Abstract: An electrically illuminating indicator needle and a light guiding member therefor that allow such a control as length of the needle can be varied while undergoing less unevenness in luminance and can be manufactured at a lower cost are provided. The electrically illuminating indicator needle comprises a plurality of planes of incidence, a plurality of light reflecting surfaces disposed to correspond to the planes of incidence so as to reflect light coming from the planes of incidence, a light guiding member disposed to correspond to the light reflecting surfaces so as to cause the light reflected on the light reflecting surfaces to emerge, and a plurality of light emitting diodes disposed to oppose the planes of incidence.Type: GrantFiled: April 17, 2006Date of Patent: May 25, 2010Assignee: Nichia CorporationInventors: Koji Nakano, Hitoshi Nojiri, Ryosuke Wakaki
-
Patent number: 7662429Abstract: A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.Type: GrantFiled: February 14, 2001Date of Patent: February 16, 2010Assignee: Kaneka CorporationInventors: Shoji Hara, Takashi Itoh, Hitoshi Nojiri, Masaru Nishinaka
-
Publication number: 20080210154Abstract: An electrically illuminating indicator needle and a light guiding member therefor that allow such a control as length of the needle can be varied while undergoing less unevenness in luminance and can be manufactured at a lower cost are provided. The electrically illuminating indicator needle comprises a plurality of planes of incidence, a plurality of light reflecting surfaces disposed to correspond to the planes of incidence so as to reflect light coming from the planes of incidence, a light guiding member disposed to correspond to the light reflecting surfaces so as to cause the light reflected on the light reflecting surfaces to emerge, and a plurality of light emitting diodes disposed to oppose the planes of incidence.Type: ApplicationFiled: April 17, 2006Publication date: September 4, 2008Applicant: NICHIA CIRPORATIONInventors: Koji Nakano, Hitoshi Nojiri, Ryosuke Wakaki
-
Patent number: 7063450Abstract: An surface light emitting device that is capable of emitting light of high luminance with higher uniformity is disclosed. The surface light emitting device comprising; a light guide plate, a reflector on the under surface of the light guide plate and, an LED light source having at least one LED element and provided so that a light emitted by the LED element is incident on at least one end face of the light guide plate, wherein the light guide plate has a light diffusing portion on the one end face so that a light emitted from the LED light source enters the light guide plate while being diffused therein, and the light diffusing portion has the top end being space from the top surface.Type: GrantFiled: July 30, 2003Date of Patent: June 20, 2006Assignee: Nichia CorporationInventors: Munetsugu Ehara, Hitoshi Nojiri, Eiji Nakanishi, Koichi Kunikata
-
Patent number: 7019104Abstract: An object of present invention is to provide a diamine and an acid dianhydride having photoreactivity and thermoreactivity and a polyimide composition containing the diamine and the acid dianhydride as monomer components, and specifically to synthesize a diamine and an acid dianhydride having a photoreactive and thermoreactive group containing a double bond or triple bond such as cinnamic acid, chalcone, benzalacetophenone, stilbene, coumarin, pyrone, allyl, propargyl, and acetylene or a derivative skeleton thereof so as to exhibit photoreactivity and thermoreactivity specific to the reactive group, thereby providing a polyimide composition containing the diamine and the acid dianhydride.Type: GrantFiled: November 1, 2000Date of Patent: March 28, 2006Assignee: Kaneka CorporationInventors: Koji Okada, Shoji Hara, Hitoshi Nojiri
-
Patent number: 6916393Abstract: A multi-layered endless belt having an arbitrary layer thickness by the thickness of the film and the winding number, a medium conveying belt using the same, and a method and apparatus by which these can be stably produced without various residues in the production process and can be produced with a high general-purpose properties and at a low cost. There are provided a multi-layered endless belt made by winding and heat-welding a polymer material film and a production method thereof, and further a production method of medium conveying belts of various forms fundamentally having a construction in which an electrode pattern and a protective film are laminated thereon, and a novel production method and molding apparatus for molding the multi-layered endless belt by heat-pressing a wound tubular body.Type: GrantFiled: November 9, 2001Date of Patent: July 12, 2005Assignee: Kaneka CorporationInventors: Tomohiro Ohzuru, Hitoshi Nojiri, Yoshio Sakata, Koji Sezaki
-
Patent number: 6790930Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.Type: GrantFiled: April 4, 2002Date of Patent: September 14, 2004Assignee: Kaneka CorporationInventors: Takeshi Kikuchi, Hiroyuki Tsuji, Koji Okada, Hiroyuki Furutani, Koichiro Tanaka, Shoji Hara, Hitoshi Nojiri
-
Patent number: 6689899Abstract: The present invention provides a novel diamine and a novel acid anhydride which are applicable for a polyimide and includes a cinnamoyl group or a derived cinnamoyl group. The novel diamines and acid anhydrides have photo-reactivity and heat-reactivity inherent to the cinnamoyl group.Type: GrantFiled: August 17, 2001Date of Patent: February 10, 2004Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Kohji Okada, Hitoshi Nojiri
-
Publication number: 20040024107Abstract: The present invention provides a polyimide intermediate transfer belt having a medium resistivity, little non-uniformity, and high insulating reliability, in which its volume resistivity at the measured voltage of 100V is within the range of 1×106to 1×1012 &OHgr;·cm because of the containing of 0.5 to 20 parts by weight of carbon black and 5 to 40 parts by weight of a plate-like or pillar-like electrically conductive powder based on 100 parts by weight of a polyimide resin. It is possible to obtain a most suitable intermediate transfer belt by the formation of a fluorocarbon resin layer including an electrically conductive material where the surface resistivity is within the range of 1×108 to 1×1013 &OHgr;/cm2.Type: ApplicationFiled: March 12, 2003Publication date: February 5, 2004Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki
-
Publication number: 20030214818Abstract: An surface light emitting device that is capable of emitting light of high luminance with higher uniformity is disclosed.Type: ApplicationFiled: July 30, 2003Publication date: November 20, 2003Applicant: Nichia CorporationInventors: Munetsugu Ehara, Hitoshi Nojiri, Eiji Nakanishi, Koichi Kunikata
-
Patent number: 6642393Abstract: Novel polyimides substituted by a substituent having an alkyl or fluoroalkyl group and having reduced water absorption; a process for producing these novel polyimides; and novel acid dianhydrides to be used in the production thereof. A polyimide containing a structure represented by the following general formula (I): wherein X1 represents a tetravalent organic group having a substituent —R1AR2 (wherein A represents a divalent linkage group; R1 represents a single bond or a C1-3 alkylene group; and R2 represents a C1-25 alkyl group or a fluoroalkyl group); and Y represents a divalent organic group.Type: GrantFiled: December 21, 2001Date of Patent: November 4, 2003Assignee: Kaneka CorporationInventors: Koji Okada, Shoji Hara, Hitoshi Nojiri
-
Patent number: 6605353Abstract: An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.Type: GrantFiled: December 28, 2000Date of Patent: August 12, 2003Assignee: Kaneka CorporationInventors: Koji Okada, Hitoshi Nojiri, Shoji Hara
-
Patent number: 6601962Abstract: An surface light emitting device that is capable of emitting light of high luminance with higher uniformity is disclosed. The surface light emitting device comprising; a light guide plate, a reflector on the under surface of the light guide plate and, an LED light source having at least one LED element and provided so that a light emitted by the LED element is incident on at least one end face of the light guide plate, wherein the light guide plate has a light diffusing portion on the one end face so that a light emitted from the LED light source enters the light guide plate while being diffused therein, and the light diffusing portion has the top end being space from the top surface.Type: GrantFiled: May 10, 2000Date of Patent: August 5, 2003Assignee: Nichia CorporationInventors: Munetsugu Ehara, Hitoshi Nojiri, Eiji Nakanishi, Koichi Kunikata
-
Publication number: 20030090031Abstract: The present invention provides a method and an apparatus for producing a polyimide molding which have superior productivity and accuracy of dimension. The invention particularly relates to a tubular polyimide applicable to an electrophotographic device, such as a laser-beam printer and a copying machine, or a precision driving belt required for high strength and high dimensional stability.Type: ApplicationFiled: June 21, 2002Publication date: May 15, 2003Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki, Teruo Matsutani
-
Publication number: 20020104606Abstract: A multi-layered endless belt having an arbitrary layer thickness by the thickness of the film and the winding number, a medium conveying belt using the same, and a method and apparatus by which these can be stably produced without various residues in the production process and can be produced with a high general-purpose properties and at a low cost. There are provided a multi-layered endless belt made by winding and heat-welding a polymer material film and a production method thereof, and further a production method of medium conveying belts of various forms fundamentally having a construction in which an electrode pattern and a protective film are laminated thereon, and a novel production method and molding apparatus for molding the multi-layered endless belt by heat-pressing a wound tubular body.Type: ApplicationFiled: November 9, 2001Publication date: August 8, 2002Applicant: Keneka Japan CorporationInventors: Tomohiro Ohzuru, Hitoshi Nojiri, Yoshio Sakata, Koji Sezaki
-
Patent number: 6350845Abstract: Novel polyimides substituted by a substituent having an alkyl or fluoroalkyl group and having reduced water absorption; a process for producing these novel polyimides; and novel acid dianhydrides to be used in the production thereof. A polyimide containing a structure represented by the following general formula (I): wherein X1 represents a tetravalent organic group having a substituent —R1AR2 (wherein A represents a divalent linkage group; R1 represents a single bond or a C1-3 alkylene group; and R2 represents a C1-25 alkyl group or a fluoroalkyl group); and Y represents a divalent organic group.Type: GrantFiled: June 26, 2000Date of Patent: February 26, 2002Assignee: Kaneka CorporationInventors: Koji Okada, Shoji Hara, Hitoshi Nojiri
-
Publication number: 20020019558Abstract: The present invention provides a novel diamine and a novel acid anhydride which are applicable for a polyimide and includes a cinnamoyl group or a derived cinnamoyl group. The novel diamines and acid anhydrides have photo-reactivity and heat-reactivity inherent to the cinnamoyl group.Type: ApplicationFiled: August 17, 2001Publication date: February 14, 2002Applicant: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Kohji Okada, Hitoshi Nojiri
-
Patent number: 6335416Abstract: A polyimide film, which is produced from polyamide acid prepared through the reaction of p-phenylenebis(trimellitic acid monoester anhydride), oxydiphthalic acid dianhydride, p-phenylenediamine, and 4,4′-diaminodiphenylether in an organic solvent, and which has a high elastic modulus, a high elongation, a low coefficient of linear expansion which is not quite different from that of copper, and a low coefficient of hygroscopic expansion.Type: GrantFiled: April 25, 2000Date of Patent: January 1, 2002Assignee: Kaneka CorporationInventors: Hitoshi Nojiri, Koichiro Tanaka
-
Publication number: 20010056174Abstract: An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.Type: ApplicationFiled: December 28, 2000Publication date: December 27, 2001Inventors: Koji Okada, Hitoshi Nojiri, Shoji Hara