Patents by Inventor Hitoshi Oikawa

Hitoshi Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070035500
    Abstract: A data bus structure, a driver therewith, and a display with a driver capable of low power consumption are provided herewith. In the proposed structure, data lines of the data bus corresponding to a plurality of output channels are divided by alternatively inserting isolating elements. By controlling these isolating elements, current will be alternatively isolated from a portion of the bus and power consumption is significantly reduced. In the proposed structure, different function and settings can be determined in advance in consideration of where data is taken into the bus line.
    Type: Application
    Filed: August 11, 2005
    Publication date: February 15, 2007
    Inventors: Keisuke Takeo, Yasuhiro Gen, Masahiro Kaneko, Hitoshi Oikawa
  • Patent number: 4958216
    Abstract: Disclosed is a package for housing semiconductor elements, which comprises an insulating substrate having in the interior thereof a cavity for attaching and housing semiconductor elements and a lid member covering said cavity, wherein the insulating substrate is composed of a mullite sintered body comprising 70 to 95% by weight of mullite and 5 to 30% by weight, as the total content, of silica (SiO.sub.2) and at least one member selected from the group consisting of magnesia (MgO) and calcia (CaO), and SiO.sub.2, MgO and CaO are present in the following composition expressed by % by weight based on the three components:100>SiO.sub.2 .gtoreq.60,40.gtoreq.MgO.gtoreq.O and40.gtoreq.CaO.gtoreq.O.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: September 18, 1990
    Assignee: Kyocera Corporation
    Inventors: Jun Tanaka, Hitoshi Oikawa, Yoshinobu Kunitomo, Masami Terasawa