Patents by Inventor Hitoshi Okuda

Hitoshi Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6830985
    Abstract: The present invention provides a method for producing a bonded dielectric separation wafer in which an auto-alignment can be carried out with reference to the orientation flat of a supporting substrate wafer after the wafer bonding step, and also an apparatus to be used for bonding wafers. When wafers are placed one upon another, the silicon wafers 10, 20 are irradiated with transmission light in order to capture the transmission images thereof. The positions of the pattern of dielectric isolation grooves 13 in the silicon wafer 10 and the orientation flat 20a of the silicon wafer 20 are determined from the images and the bonding position of the wafers 10, 20 is determined based on the determined positions. Auto-alignment of the bonded dielectric separation wafer can thereby be carried out with reference to the orientation flat 20a of the silicon wafer 20 after the wafer bonding step.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: December 14, 2004
    Assignee: Sumitomo Mitsubishi Silicon Corporation
    Inventors: Hiroyuki Oi, Hitoshi Okuda
  • Publication number: 20030092244
    Abstract: The present invention provides a method for producing a bonded dielectric separation wafer in which an auto-alignment can be carried out with reference to the orientation flat of a supporting substrate wafer after the wafer bonding step, and also an apparatus to be used for bonding wafers. When wafers are placed one upon another, the silicon wafers 10, 20 are irradiated with transmission light in order to capture the transmission images thereof. The positions of the pattern of dielectric isolation grooves 13 in the silicon wafer 10 and the orientation flat 20a of the silicon wafer 20 are determined from the images and the bonding position of the wafers 10, 20 is determined based on the determined positions. Auto-alignment of the bonded dielectric separation wafer can thereby be carried out with reference to the orientation flat 20a of the silicon wafer 20 after the wafer bonding step.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 15, 2003
    Inventors: Hiroyuki Oi, Hitoshi Okuda
  • Patent number: 5516128
    Abstract: A truck which has first wheels that are fixed to the front part of a bed with arms put in between so freely as to move up and down and designed to roll backward and forward in the longitudinal direction when in touch with the ground, second wheels that are fixed to the arms with bearing arms put in between so freely as to move up and down and designed to roll right and left in the lateral direction when in touch with the ground, and a rear wheel that is fixed to the bed with a hydraulic pressure cylinder put in between and capable of changing its direction by the turning of a pumping handle which works the cylinder.
    Type: Grant
    Filed: May 25, 1994
    Date of Patent: May 14, 1996
    Assignee: Okudaya Giken Co.
    Inventors: Kenichi Nakade, Hitoshi Okuda, Hisao Ikemoto, Kiyoji Tanda