Abstract: A chromium-free treating liquid and treatment methods which are for imparting to a zinc or zinc alloy deposit a coating film which is highly corrosion-resistant, has a uniform appearance free from sag stains/puddle stains, has no failure concerning thickness unevenness, and has satisfactory adhesion. The surface-treating aqueous solution, which is for forming a corrosion-resistant coating film over a zinc or zinc alloy deposit, is characterized by comprising (a) an alkali metal silicate (M2O.nSiO2 (wherein M represents an alkali metal and n indicates SiO2/M2O molar ratio)), (b) a water-soluble or water-dispersible silane coupling agent, and (c) a water-soluble or water-dispersible glycidyl ether compound. One of the surface treatment methods for forming a highly corrosion-resistant coating film over a zinc or zinc alloy deposit includes bringing the surface of the zinc or zinc alloy deposit into contact with the surface-treating aqueous solution.

Abstract: The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

Abstract: A press machine braking performance verifying apparatus verifies performance of brakes applying braking to a slide. The press machine braking performance verifying apparatus includes a speed detecting component, a stopping instruction detecting component, a stopping time measuring component, a maximum stopping time calculating component and an evaluating component. The speed detecting component detects a slide driving speed. The stopping instruction detecting component detects if stopping of the slide is instructed. The stopping time measuring component measures a stopping time until the slide stops when a stopping instruction is detected. The maximum stopping time calculating component calculates predicted stopping time in a case where the slide is driven at a maximum driving speed based on the slide driving speed after detecting the stopping instruction and the stopping time.

Abstract: A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

Abstract: The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.

Abstract: In a separating device that separates a processor configured to perform process by using data recorded in a cache memory connected to the processor, a stopping unit, upon receiving a processor separation request, stops the processor from performing a new process; and a separation executing unit, upon completion of process being performed by the processor, separates the processor after invalidating the data recorded in the cache memory.

Abstract: A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

Abstract: A chromium-free treating liquid and treatment methods which are for imparting to a zinc or zinc alloy deposit a coating film which is highly corrosion-resistant, has a uniform appearance free from sag stains/puddle stains, has no failure concerning thickness unevenness, and has satisfactory adhesion. The surface-treating aqueous solution, which is for forming a corrosion-resistant coating film over a zinc or zinc alloy deposit, is characterized by comprising (a) an alkali metal silicate (M2O.nSiO2 (wherein M represents an alkali metal and n indicates SiO2/M2O molar ratio)), (b) a water-soluble or water-dispersible silane coupling agent, and (c) a water-soluble or water-dispersible glycidyl ether compound. One of the surface treatment methods for forming a highly corrosion-resistant coating film over a zinc or zinc alloy deposit includes bringing the surface of the zinc or zinc alloy deposit into contact with the surface-treating aqueous solution.

Abstract: The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.

Abstract: A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: A motorcycle includes a fuel supply device that supplies fuel to an intake passage, an ECU that controls an opening/closing valve that opens and closes the intake passage, an exhaust gas passage, a catalyst disposed inside the exhaust gas passage, and a switch of an engine. When the engine rotation speed is equal to or more than a determined rotation speed when the switch is turned off, the opening/closing valve is switched on to close the intake passage. When the engine rotation speed is less than the determined rotation speed, the opening/closing valve is switched off to open the intake passage. Thermal degradation of a catalyst is thereby inhibited and electric power consumption is reduced when an engine is turned off.

Abstract: In a separating device that separates a processor configured to perform process by using data recorded in a cache memory connected to the processor, a stopping unit, upon receiving a processor separation request, stops the processor from performing a new process; and a separation executing unit, upon completion of process being performed by the processor, separates the processor after invalidating the data recorded in the cache memory.

Abstract: The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.

Abstract: A cache memory unit connecting to a main memory system having a cache memory area in which, if memory data that the main memory system has is registered therewith, the registered memory data is accessed by a memory access instruction that accesses the main memory system and a local memory area with which local data to be used by the processing section is registered and in which the registered local data is accessed by a local memory access instruction, which is different from the memory access instruction.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. A second solder paste composition contains a deposition solder material which deposits the solder by heating and a flux, and a metallic powder comprising metallic species different from metallic species constituting a metallic component in the deposition solder material and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the metallic component in the deposition solder material.

Abstract: Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the electrodes. Subsequently, in removing the resin mask layer, at least one selected from glycol ethers and aminoalcohols is used. Thereby, the resin mask layer is removed after heating process. This makes it possible to easily remove the heat-processed resin mask layer in a short period of time without damaging solder resist and solder bumps on the substrate.

Abstract: Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the electrodes. Subsequently, in removing the resin mask layer, at least one selected from glycol ethers and aminoalcohols is used. Thereby, the resin mask layer is removed after heating process. This makes it possible to easily remove the heat-processed resin mask layer in a short period of time without damaging solder resist and solder bumps on the substrate.

Abstract: A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.