Patents by Inventor Hitoshi SEJIMO

Hitoshi SEJIMO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9662805
    Abstract: A method of resuming operation of a wire saw in which slicing of a workpiece is suspended due to a wire break, including processes of: imparting axial reciprocating motion to a wire while supplying a new line of the wire; and slicing the workpiece into wafers by moving the workpiece downwardly to press the workpiece against the reciprocating wire while supplying a slicing slurry to the wire, the method includes: repairing the broken wire after suspending the slicing of the workpiece before resuming the slicing of the workpiece; and preparing for the slicing in that a diameter of the repaired wire at a position at which the workpiece is to be sliced is matched to the diameter of the wire just before occurrence of the wire break. The method can inhibit the formation of grooves in wafers sliced after the resumption and reduce low-quality production wafers.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: May 30, 2017
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Atsuo Uchiyama, Hisakazu Takano, Hitoshi Sejimo, Yukio Hijirisawa, Daisuke Nakamata
  • Publication number: 20150328800
    Abstract: A method of resuming operation of a wire saw in which slicing of a workpiece is suspended due to a wire break, including processes of: imparting axial reciprocating motion to a wire while supplying a new line of the wire; and slicing the workpiece into wafers by moving the workpiece downwardly to press the workpiece against the reciprocating wire while supplying a slicing slurry to the wire, the method includes: repairing the broken wire after suspending the slicing of the workpiece before resuming the slicing of the workpiece; and preparing for the slicing in that a diameter of the repaired wire at a position at which the workpiece is to be sliced is matched to the diameter of the wire just before occurrence of the wire break. The method can inhibit the formation of grooves in wafers sliced after the resumption and reduce low-quality production wafers.
    Type: Application
    Filed: December 6, 2013
    Publication date: November 19, 2015
    Inventors: Atsuo UCHIYAMA, Hisakazu TAKANO, Hitoshi SEJIMO, Yukio HIJIRISAWA, Daisuke NAKAMATA