Abstract: A piston for an internal combustion engine includes a piston body. The piston body includes a head, two side walls, two skirts, and a reinforcement member. The head includes a recessed crown. Each side wall includes a pin boss configured to support a piston pin. The two skirts are respectively located at a thrust side with respect to an axis of the piston pin and an anti-thrust side with respect to the axis of the piston pin. The reinforcement member includes two legs and a connecting portion connecting upper ends of the two legs. The two legs are respectively insert-casted in the two skirts. The connecting portion is insert-casted in the head.

Abstract: A piston for an internal combustion engine includes a piston body. The piston body includes a head, two side walls, two skirts, and a reinforcement member. The head includes a recessed crown. Each side wall includes a pin boss configured to support a piston pin. The two skirts are respectively located at a thrust side with respect to an axis of the piston pin and an anti-thrust side with respect to the axis of the piston pin. The reinforcement member includes two legs and a connecting portion connecting upper ends of the two legs. The two legs are respectively insert-casted in the two skirts. The connecting portion is insert-casted in the head.

Abstract: The front face of an opening in a first wiring substrate is covered by a transparent substrate, a light-receiving face is made to face the opening, and an imaging element chip is flip-chip bonded to the rear face side of the first substrate. A gap formed between connection terminals between the periphery of the light-receiving face of the imaging element chip and the peripheral edge section of the opening is buried in a first resin, and the entire rear face of the imaging element chip and the rear face side of the first substrate are covered by a second resin. At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate is covered with the second resin. A second wiring substrate is electrically and mechanically connected to the first substrate.

Abstract: An exhaust manifold includes: a double collecting pipe formed of inner and outer pipes; and an inner pipe retainer formed of a pair of semi-circular portions and a connecting portion. The inner pipe includes a collecting pipe portion and bifurcated branch pipe portions. The outer pipe covers outer peripheral portions of the collecting and branch pipe portions. The semi-circular portions are respectively connected to outer peripheral portions of branched branch pipe portions and an inner peripheral portion of the outer pipe. The connecting portion connects the semi-circular portions. The inner pipe retainer is interposed between the inner pipe and the outer pipe and is connected to the inner pipe and the outer pipe to define a certain gap therebetween. Exhaust gas from exhaust ports of a set of cylinders among a plurality of cylinders of an engine is introduced into the collecting pipe portion through the branch pipe portions.

Abstract: A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a, 58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.

Abstract: An exhaust manifold includes: a double collecting pipe formed of inner and outer pipes; and an inner pipe retainer formed of a pair of semi-circular portions and a connecting portion. The inner pipe includes a collecting pipe portion and bifurcated branch pipe portions. The outer pipe covers outer peripheral portions of the collecting and branch pipe portions. The semi-circular portions are respectively connected to outer peripheral portions of branched branch pipe portions and an inner peripheral portion of the outer pipe. The connecting portion connects the semi-circular portions. The inner pipe retainer is interposed between the inner pipe and the outer pipe and is connected to the inner pipe and the outer pipe to define a certain gap therebetween. Exhaust gas from exhaust ports of a set of cylinders among a plurality of cylinders of an engine is introduced into the collecting pipe portion through the branch pipe portions.

Abstract: A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.

Abstract: A mask (68) is attached to a circuit assembly board (47) on which a plurality of sensor packages (4) are adhered. An upper face of a cover glass (6) of each sensor package (4) is protected by a mask section (68b) of the mask (68). The circuit assembly board (47) is set in a vacuum screen printing machine and paste of sealing resin (7) is supplied to it. The circuit assembly board (47) is moved in a horizontal direction on a stage with a squeegee (65) pressed onto an upper face of the mask (68). The squeegee (65) presses to fill the sealing resin (7) around each of the sensor packages (4).

Abstract: A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a, 58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.

Abstract: A method of grinding a multilayer body which can prevent a substrate from being damaged by a broken piece of a planar substance, which occurs during grinding and cutting in grinding and cutting the planar substance of the multilayer substance constructed by the substrate and the planar substance which are joined with an extremely narrow gap portion therebetween is provided. A protection layer of the substrate is formed in the gap portion in advance and the substrate can be prevented from being damaged by the broken piece of the planar substance occurring by grinding, in grinding and cutting the planar substance by cutting into the gap portion with a grindstone, of the multilayer body in which the substrate and the planar substance are joined to have the gap portion therebetween.

Abstract: A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.

Abstract: This metal gasket is formed by laminating a pair of bead plates and a pair of intermediate plates, and capable of setting the temperature distribution thereof uniform by efficiently cooling high-temperature regions which are in the vicinity of swirl chambers without causing a decrease in the rigidity and strength thereof. The portions of the bead plates which are in the vicinity of the parts thereof in which the swirl chambers are positioned are provided with coolant-contact areas surrounded by half beads formed on the bead plates, these coolant-contact areas being provided with holes. The wall surfaces of these holes directly contact the cooling water flowing in a water jacket in a cylinder head, and fulfil the function of radiating the heat transmitted from a high-temperature combustion gas thereto.