Patents by Inventor Hitoshi Takagishi

Hitoshi Takagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid integrated circuit device
    Patent number: 7042087
    Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: May 9, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Noriaki Sakamoto, Yoshiyuki Kobayashi, Eiju Maehara, Noriyasu Sakai, Hitoshi Takagishi, Kouji Takahashi, Kazuhisa Kusano
  • Hybrid integrated circuit device
    Publication number: 20040070074
    Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire.
    Type: Application
    Filed: July 18, 2003
    Publication date: April 15, 2004
    Applicant: Sanyo Electric Co., Ltd., an Osaka, Japan corporation
    Inventors: Noriaki Sakamoto, Yoshiyuki Kobayashi, Eiju Maehara, Noriyasu Sakai, Hitoshi Takagishi, Kouji Takahashi, Kazuhisa Kusano
  • Hybrid integrated circuit device
    Patent number: 6624511
    Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: September 23, 2003
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Noriaki Sakamoto, Yoshiyuki Kobayashi, Eiju Maehara, Noriyasu Sakai, Hitoshi Takagishi, Kouji Takahashi, Kazuhisa Kusano
  • Hybrid integrated circuit device
    Publication number: 20020030268
    Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire.
    Type: Application
    Filed: March 29, 2001
    Publication date: March 14, 2002
    Inventors: Noriaki Sakamoto, Yoshiyuki Kobayashi, Eiju Maehara, Noriyasu Sakai, Hitoshi Takagishi, Kouji Takahashi, Kazuhisa Kusano
  • Air cell with gas diffusion electrode
    Patent number: 5306578
    Abstract: An air cell comprising a cell container, a gas diffusion electrode which uses oxygen as an active material, and an air-inlet opening for communication with air outside the container. A porous film is provided to support the gas diffusion electrode, and an air-diffusing porous sheet impregnated with film-forming silicone is provided between the porous film and the air-inlet opening.
    Type: Grant
    Filed: October 27, 1992
    Date of Patent: April 26, 1994
    Assignees: Toshiba Battery Co., Ltd., Toshiba Silicone Co., Ltd.
    Inventors: Masato Ohashi, Michio Watabe, Hitoshi Takagishi, Masao Ide, Keiji Kobayashi