Patents by Inventor Hitoshi TAKAMIYA

Hitoshi TAKAMIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9670581
    Abstract: A method for producing an epitaxial silicon wafer by applying a vapor deposition on a silicon wafer is disclosed. A vapor deposition apparatus in which the vapor deposition is conducted at least includes a chamber and a hydrogen-chloride-gas supply apparatus that is in communication and connected with an inside of the chamber to supply hydrogen chloride gas into the chamber. A valve including a diaphragm that allows or blocks a flow of the hydrogen chloride gas from an inlet channel to an outlet channel is disposed in the hydrogen-chloride-gas supply apparatus. A W-free anticorrosion alloy material is used for the diaphragm. When a maintenance work is to be done inside the chamber, the hydrogen chloride gas is supplied from the hydrogen-chloride-gas supply apparatus into the chamber.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: June 6, 2017
    Assignee: SUMCO CORPORATION
    Inventors: Motoki Goto, Yusuke Kurozumi, Kan Yoshitake, Hitoshi Takamiya
  • Publication number: 20160087049
    Abstract: An epitaxial silicon wafer includes: a silicon wafer; and a silicon epitaxial layer formed on the silicon wafer, in which a W concentration obtained by a metal analysis of a surface of the silicon epitaxial layer using an inductively coupled plasma mass spectrometry is 1×106 atoms/cm2 or less. Further, the W concentration obtained by the metal analysis of the surface of the silicon epitaxial layer using the inductively coupled plasma mass spectrometry is preferably 1×107 atoms/cm2 or less.
    Type: Application
    Filed: September 16, 2015
    Publication date: March 24, 2016
    Applicant: SUMCO CORPORATION
    Inventors: Motoki GOTO, Yusuke KUROZUMI, Kan YOSHITAKE, Hitoshi TAKAMIYA
  • Publication number: 20160083836
    Abstract: A method for producing an epitaxial silicon wafer by applying a vapor deposition on a silicon wafer is disclosed. A vapor deposition apparatus in which the vapor deposition is conducted at least includes a chamber and a hydrogen-chloride-gas supply apparatus that is in communication and connected with an inside of the chamber to supply hydrogen chloride gas into the chamber. A valve including a diaphragm that allows or blocks a flow of the hydrogen chloride gas from an inlet channel to an outlet channel is disposed in the hydrogen-chloride-gas supply apparatus. A W-free anticorrosion alloy material is used for the diaphragm. When a maintenance work is to be done inside the chamber, the hydrogen chloride gas is supplied from the hydrogen-chloride-gas supply apparatus into the chamber.
    Type: Application
    Filed: September 16, 2015
    Publication date: March 24, 2016
    Applicant: SUMCO CORPORATION
    Inventors: Motoki GOTO, Yusuke KUROZUMI, Kan YOSHITAKE, Hitoshi TAKAMIYA