Abstract: A projector includes: a position detection unit which detects a designated position (XYZ coordinates) designated by a light pen; and a mode changing unit which determines that an operation button provided on the light pen is operated, and which changes a drawing mode if it is determined that the operation button is operated. The mode changing unit: changes the drawing tool if the Z coordinate of the designated position when it is determined that the operation button is operated is within a first distance range; changes the color of the pen if the Z coordinate of the designated position when it is determined that the operation button is operated is within a second distance range; and changes the thickness of the pen or the like if the Z coordinate of the designated position when it is determined that the operation button is operated is within a third distance range.

Abstract: The objective of the present invention is to provide a display device having an external appearance which is improved by eliminating a print step on a dial plate inside which a liquid crystal panel is disposed. In a display device 1 provided with a liquid crystal panel 3 including a display portion 31, and a dial plate 2 disposed on a front side of the liquid crystal panel 3, the dial plate 2 includes a transparent substrate 21, a first protective layer 22 formed on a front surface of the transparent substrate 21, and a second protective layer 23 formed on a front surface of the first protective layer 22. The second protective layer 23 of the dial plate 2 includes a first opening portion 23a in a position corresponding to the display portion 31, and a gradation portion 23b having a gradation which becomes thinner toward the inside of the first opening portion 23a.

Abstract: A projector includes: a position detection unit which detects a designated position (XYZ coordinates) designated by a light pen; and a mode changing unit which determines that an operation button provided on the light pen is operated, and which changes a drawing mode if it is determined that the operation button is operated. The mode changing unit: changes the drawing tool if the Z coordinate of the designated position when it is determined that the operation button is operated is within a first distance range; changes the color of the pen if the Z coordinate of the designated position when it is determined that the operation button is operated is within a second distance range; and changes the thickness of the pen or the like if the Z coordinate of the designated position when it is determined that the operation button is operated is within a third distance range.

Abstract: A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.

Abstract: A frame for housing plate materials includes a pair of laterally opposed side boards having formed equally thereon a plurality of parallel, mutually opposed support grooves; bases (top and bottom plates) formed on and beneath the side boards; joints for interconnecting the side boards and the bases; a device provided in the frame to adjust an interval between the side boards in order that given plate materials may be accommodated in the frame as spaced at predetermined intervals by causing paired edges of the plate materials to be inserted into the opposed support grooves; adjusting projections protruding slightly from the support grooves and disposed on at least either of mutually opposed inner surfaces of members suitably selected from among the side boards, bases and joints; and auxiliary adjusters disposed near the adjusting projections and adapted to allow terminal parts on at least one side of the plate materials to collide against the mutually opposed inner surfaces by simply moving one of the side boa

Abstract: A frame structure includes a pair of sideboards facing each other, each sideboard having an inner surface provided with a plurality of support grooves for receiving and supporting panel plates, a first joint for fixing one of the pair of sideboards to a base and a second joint for fixing the other of the pair of sideboards to the base and provided with a movement-effecting mechanism. The first and second joints have formed on the facing inner surfaces thereof at substantially the same height steps for contacting side surfaces of the panel plates and supporting the panel plates. At least one of the steps has a surface for contacting at one side surface of one of the panel plates prior to panel plates being received in the plurality of support grooves in order to set a distance between end surfaces of opposed ones of the plurality of support grooves equal to a sum of the width of the panel plates received in and supported by the plurality of support grooves and a predetermined clearance.

Abstract: A frame for housing plate materials includes a pair of laterally opposed side boards having formed equally thereon a plurality of parallel, mutually opposed support grooves; bases (top and bottom plates) formed on and beneath the side boards; joints for interconnecting the side boards and the bases; a device provided in the frame to adjust an interval between the side boards in order that given plate materials may be accommodated in the frame as spaced at predetermined intervals by causing paired edges of the plate materials to be inserted into the opposed support grooves; adjusting projections protruding slightly from the support grooves and disposed on at least either of mutually opposed inner surfaces of members suitably selected from among the side boards, bases and joints; and auxiliary adjusters disposed near the adjusting projections and adapted to allow terminal parts on at least one side of the plate materials to collide against the mutually opposed inner surfaces by simply moving one of the side boa

Abstract: A resin sealing method for semiconductors comprises molding a resin with a release film 1 interposed between a molding die 4 and a sealing surface of a semiconductor chip 2 having terminals 22 or electrodes in such a manner that the sealed semiconductor chip may have the tips of the terminals 22 or the electrodes exposed on the surface of the cured resin which has been in contact with the release film 1, wherein the release film 1 is a composite film comprising a base layer 11 and an auxiliary layer 12 having a lower compressive modulus than the base layer 11, and the release film is used with the auxiliary layer 12 facing the sealing surface of the semiconductor chip 2.

Abstract: A frame structure includes a pair of sideboards facing each other, each sideboard having an inner surface provided with a plurality of support grooves for receiving and supporting panel plates, a first joint for fixing one of the pair of sideboards to a base and a second joint for fixing the other of the pair of sideboards to the base and provided with a movement-effecting mechanism. The first and second joints have formed on the facing inner surfaces thereof at substantially the same height steps for contacting side surfaces of the panel plates and supporting the panel plates. At least one of the steps has a surface for contacting at one side surface of one of the panel plates prior to panel plates being received in the plurality of support grooves in order to set a distance between end surfaces of opposed ones of the plurality of support grooves equal to a sum of the width of the panel plates received in and supported by the plurality of support grooves and a predetermined clearance.

Abstract: A resin sealing method for semiconductors comprises molding a resin with a release film 1 interposed between a molding die 4 and a sealing surface of a semiconductor chip 2 having terminals 22 or electrodes in such a manner that the sealed semiconductor chip may have the tips of the terminals 22 or the electrodes exposed on the surface of the cured resin which has been in contact with the release film 1, wherein the release film 1 is a composite film comprising a base layer 11 and an auxiliary layer 12 having a lower compressive modulus than the base layer 11, and the release film is used with the auxiliary layer 12 facing the sealing surface of the semiconductor chip 2.

Abstract: A lead frame laminate for use in manufacturing semiconductor parts is provided. A lead frame has an opening and a copper terminal portions formed in the opening. A base material film covers at least the opening and the terminal portions, and laminated on the lead frame through an adhesive layer. The adhesive layer contains a silicone binder and an oxidation inhibitor.

Abstract: A frame structure includes a pair of side frame boards, with the inner surfaces of the side frame boards that face each other being provided with a plurality of support grooves for receiving panel plates. The frame structure has a device for adjusting the spacing between the side frame boards. The adjustment device is a projection provided on at least one of the inner surfaces of the side frame boards that face each other, the size of the projection being such that the spacing is set to an amount that is the width of the received panel plates plus a clearance.

Abstract: A frame structure for housing panel plates includes a box-shaped structure having openings at opposite ends. The box structure includes a pair of side plates, the inner surfaces of which are provided with grooves for housing panel plates, two pairs of bases, one pair being affixed to the upper portions of the pair of side plates and the other pair being affixed to the lower portions of the pair of side plates, and two pairs of connecting plates, one pair connecting the one pair of bases at the upper portions and the other pair connecting the other pair of bases at the lower portions. Stop members are provided at the openings at the opposite ends to prevent housed panel plates from dropping out. A stop member support device has one end affixed to the base, and at the other end is a stop member support portion.

Abstract: A separation membrane and a method of producing the membrane are provided. The membrane can control its permselectivity and its fouled pores can be easily washed by using the reversible shape change of the membrane. For this purpose, porous shape memory polymers are used for the separation membrane.

Abstract: The gasification burner of this invention capable of maintaining a high combustion rate for a long period of time comprises a combustion chamber having a ceiling with a small hole in its center, a pre-mixing pipe fitted into the small hole and having a nozzle at its top, wherein the pre-mixing pipe and the combustion chamber are concentric, and the spread angle of the gas flow sprayed from the end of the pre-mixing pipe is between 10 and 40 degrees, so that the relationship between the bottom of the combustion chamber and the conical gas flow is regulated by keeping a good balance between the gasification rate of the powdered coke and the life of the combustion chamber.

Abstract: A pyrometallurgical refining process for obtaining one or both of zinc and lead from a sulfide concentrate, in which an iron-silicate slag or iron-silicate slag containing lime is formed and the sulfide concentrate, incombustible materials, and flux, together with at least one of industrial oxygen, oxygen-enriched air, or air, are blown into the slag to cause a reaction; as a result of the reaction, the major part of the zinc and part of the lead in the sulfide concentrate and the incombustible materials are dissolved in the slag, to arrange the slag and a matte and/or metal from one part of the lead in the raw material. A reducing agent such as heavy oil, pulverized coal, powdered coke, or the like is blown through the resulting slag, and the zinc and the lead in the slag are volatilized then condensed to obtain molten zinc and molten lead.