Patents by Inventor Hitoshi Takata

Hitoshi Takata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979669
    Abstract: In a cleaning device, a signal processing circuit determines that a foreign substance has adhered to a surface of a protection cover based on at least two pieces of information among a change amount of a resonant frequency when a vibration portion is driven at a first voltage, a change amount of a current value relating to an impedance detected by an impedance detector, and a temporal change of an image captured by an imaging portion, and cleans the surface of the protection cover by controlling the vibration portion in accordance with the determination.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: May 7, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noritaka Kishi, Hitoshi Sakaguchi, Masaaki Takata, Masaru Amano, Takaaki Mori
  • Patent number: 11830681
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode terminal and a cathode terminal. The capacitor element includes an anode body, a dielectric layer, a solid electrolytic layer, a conductive layer and an anode lead wire. The anode lead wire is partially embedded in the anode body and extends in a horizontal direction from the anode body. The anode lead wire has a thicker portion and a thinner portion. The thinner portion is positioned closer to the anode body than the thicker portion is in the horizontal direction. The anode terminal at least has a first end, a second end and an overlapping portion. The anode terminal is connected to the anode lead wire under a state where the first end of the anode terminal is positioned on the thinner portion while the overlapping portion of the anode terminal overlaps with the thicker portion.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: November 28, 2023
    Assignee: TOKIN CORPORATION
    Inventors: Hitoshi Takata, Hiromasa Tanaka
  • Patent number: 11791105
    Abstract: A solid electrolytic capacitor includes a capacitor element, an outer anode terminal, an outer cathode terminal and an outer mold. The capacitor element has an anode lead wire, an anode body and a cathode layer. The capacitor element has an upper surface and a lower surface in an up-down direction. The outer cathode terminal and the outer anode terminal are positioned away from each other in a predetermined direction perpendicular to the up-down direction. The outer cathode terminal has an upper portion, a lower portion and a connecting portion. One of the upper portion and the lower portion is longer than a remaining one of the upper portion and the lower portion in the predetermined direction. The outer mold covers the capacitor element so that each of the outer anode terminal and the outer cathode terminal is partially exposed to an outside of the solid electrolytic capacitor.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: October 17, 2023
    Assignee: TOKIN CORPORATION
    Inventors: Hitoshi Takata, Masami Ishijima, Satoshi Abe, Kazuaki Saito
  • Publication number: 20230011445
    Abstract: A solid electrolytic capacitor comprises a capacitor element, an anode terminal and a cathode terminal. The capacitor element comprises an anode body, a dielectric layer, a solid electrolytic layer, a conductive layer and an anode lead wire. The anode lead wire is partially embedded in the anode body and extends in a horizontal direction from the anode body. The anode lead wire has a thicker portion and a thinner portion. The thinner portion is positioned closer to the anode body than the thicker portion is in the horizontal direction. The anode terminal at least has a first end, a second end and an overlapping portion. The anode terminal is connected to the anode lead wire under a state where the first end of the anode terminal is positioned on the thinner portion while the overlapping portion of the anode terminal overlaps with the thicker portion.
    Type: Application
    Filed: June 29, 2022
    Publication date: January 12, 2023
    Applicant: TOKIN CORPORATION
    Inventors: Hitoshi TAKATA, Hiromasa TANAKA
  • Publication number: 20220336159
    Abstract: A solid electrolytic capacitor comprises a capacitor element, an outer anode terminal, an outer cathode terminal and an outer mold. The capacitor element has an anode lead wire, an anode body and a cathode layer. The capacitor element has an upper surface and a lower surface in an up-down direction. The outer cathode terminal and the outer anode terminal are positioned away from each other in a predetermined direction perpendicular to the up-down direction. The outer cathode terminal has an upper portion, a lower portion and a connecting portion. One of the upper portion and the lower portion is longer than a remaining one of the upper portion and the lower portion in the predetermined direction. The outer mold covers the capacitor element so that each of the outer anode terminal and the outer cathode terminal is partially exposed to an outside of the solid electrolytic capacitor.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 20, 2022
    Applicant: TOKIN CORPORATION
    Inventors: Hitoshi TAKATA, Masami ISHIJIMA, Satoshi ABE, Kazuaki SAITO
  • Patent number: 7355835
    Abstract: A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band, an insulating coating covering a region sandwiched between the first and second bands, a cathode layer formed on the insulating coating, and an anode containing the plate and formed on an outer side of at least one of the first and second bands. The cathode layers are elctrically connected to each other through paths each connecting in series the facing two cathode layers of the adjacent two elements and path(s) connecting in parallel the cathode layers to each other, and the anodes are electrically connected to each other through path(s) connecting in parallel the anodes to each other.
    Type: Grant
    Filed: May 20, 2006
    Date of Patent: April 8, 2008
    Assignee: NEC TOKIN Corporation
    Inventors: Takeshi Saitou, Hitoshi Takata, Katsuhiro Yoshida
  • Patent number: 7326261
    Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: February 5, 2008
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
  • Publication number: 20070148900
    Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
    Type: Application
    Filed: March 1, 2007
    Publication date: June 28, 2007
    Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Toshihisa NAGASAWA, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
  • Patent number: 7206193
    Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: April 17, 2007
    Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
  • Publication number: 20060262490
    Abstract: A capacitor has stacking capacitor elements, each of which contains a conductor plate, a first band being an insulator and disposed around the plate, a second band being an insulator and disposed around the plate so as to be substantially parallel to the first band, an insulating coating covering a region sandwiched between the first and second bands, a cathode layer formed on the insulating coating, and an anode containing the plate and formed on an outer side of at least one of the first and second bands. The cathode layers are elctrically connected to each other through paths each connecting in series the facing two cathode layers of the adjacent two elements and path(s) connecting in parallel the cathode layers to each other, and the anodes are electrically connected to each other through path(s) connecting in parallel the anodes to each other.
    Type: Application
    Filed: May 20, 2006
    Publication date: November 23, 2006
    Inventors: Takeshi Saitou, Hitoshi Takata, Katsuhiro Yoshida
  • Publication number: 20060087795
    Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
    Type: Application
    Filed: October 27, 2005
    Publication date: April 27, 2006
    Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai