Abstract: The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 ?m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Abstract: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Abstract: The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 ?m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Abstract: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Abstract: A high specific-gravity EPDM composition consisting of a mixture of EPDM containing diene at less than 4.5 wt % and ethylene at not less than 58 wt % nor more than 80 wt % and having a Mooney viscosity ML1+4 not less than 50 nor more than 170 at 125° C. and a powdery material, containing powder whose specific gravity is not less than 12 as a main component thereof, added to the EPDM at not less than 80 wt % nor more than 97.5 wt % of a whole amount of the high specific-gravity EPDM composition.

Abstract: A high specific-gravity EPDM composition consisting of a mixture of EPDM containing diene at less than 4.5 wt % and ethylene at not less than 58 wt % nor more than 80 wt % and having a Mooney viscosity ML1+4 not less than 50 nor more than 170 at 125° C. and a powdery material, containing powder whose specific gravity is not less than 12 as a main component thereof, added to the EPDM at not less than 80 wt % nor more than 97.5 wt % of a whole amount of the high specific-gravity EPDM composition.