Patents by Inventor Hitoshi Tamura

Hitoshi Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144979
    Abstract: A sorbent breather filter for an electronic device such as a hard disk drive (HDD) is configured with a first chamber for housing a first sorbent and environmentally coupled with an external environment via at least a first orifice and a second orifice, a corresponding replaceable first sorbent such as zeolite or silica gel beads in the first chamber, a second chamber adjacent to the first chamber for housing a second sorbent, and a corresponding second sorbent such as carbon beads in the second chamber. The first orifice is a through-hole such that the first sorbent can be loaded into the first chamber therethrough, and the second orifice is a slitted or grated hole such that the first sorbent cannot move from the first chamber to the external environment through the second orifice while loading sorbent into the first chamber through an HDD first cover breather hole.
    Type: Application
    Filed: July 17, 2023
    Publication date: May 2, 2024
    Inventors: Takeji Sumiya, Shin Nagahiro, Hitoshi Tamura, Naoki Hirayama
  • Patent number: 11948776
    Abstract: A plasma processing apparatus adapted to reduce non-uniformity of plasma distribution in a process chamber and to adjust the plasma distribution to “centrally high density”, “circumferentially high density”, or “uniform density” in accordance with a desired etching process, a process chamber; a radio frequency power source; a rectangular waveguide; and a circular waveguide connected to the rectangular waveguide, in which the rectangular waveguide includes an upper rectangular waveguide and a lower rectangular waveguide formed by vertically dividing the rectangular waveguide; and a cutoff section which cuts off the microwave frequency power and which has a dielectric body. The circular waveguide includes an inner waveguide connected to the upper rectangular waveguide and formed inside; and an outer waveguide connected to the lower rectangular waveguide and formed on an outer side of the inner waveguide. The cutoff section has a width narrower than those of the rectangular waveguides except the cutoff section.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: April 2, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Chen Pin Hsu, Hitoshi Tamura
  • Publication number: 20240093311
    Abstract: It is intended to provide a kit or a device for the detection of breast cancer and a method for detecting breast cancer. The present invention provides a kit or a device for the detection of breast cancer, comprising nucleic acid(s) capable of specifically binding to a miRNA in a sample of a subject, and a method for detecting breast cancer, comprising measuring the miRNA in vitro.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Applicants: TORAY INDUSTRIES, INC., NATIONAL CANCER CENTER
    Inventors: Satoshi KONDOU, Hitoshi NOBUMASA, Satoko KOZONO, Hiroko SUDO, Junpei KAWAUCHI, Takahiro OCHIYA, Nobuyoshi KOSAKA, Makiko ONO, Kenji TAMURA
  • Publication number: 20230352273
    Abstract: A plasma processing apparatus adapted to reduce non-uniformity of plasma distribution in a process chamber and to adjust the plasma distribution to “centrally high density”, “circumferentially high density”, or “uniform density” in accordance with a desired etching process, a process chamber; a radio frequency power source; a rectangular waveguide; and a circular waveguide connected to the rectangular waveguide, in which the rectangular waveguide includes an upper rectangular waveguide and a lower rectangular waveguide formed by vertically dividing the rectangular waveguide; and a cutoff section which cuts off the microwave frequency power and which has a dielectric body. The circular waveguide includes an inner waveguide connected to the upper rectangular waveguide and formed inside; and an outer waveguide connected to the lower rectangular waveguide and formed on an outer side of the inner waveguide. The cutoff section has a width narrower than those of the rectangular waveguides except the cutoff section.
    Type: Application
    Filed: January 21, 2021
    Publication date: November 2, 2023
    Inventors: Chen Pin Hsu, Hitoshi Tamura
  • Publication number: 20230352274
    Abstract: A plasma processing apparatus includes: a vacuum chamber that includes a plasma processing chamber in which a substrate is to be plasma-processed and that can exhaust an inside of the plasma processing chamber to vacuum; and a microwave power supply unit that supplies a microwave power to the vacuum chamber via a circular waveguide. The vacuum chamber includes: a parallel flat plate line portion that is connected to the circular waveguide and receives a microwave power propagated from the circular waveguide; a ring resonator unit that is disposed on an outer periphery of the parallel flat plate line portion and receives the microwave power propagated from the parallel flat plate line portion; a cavity portion that receives a microwave power radiated from a slot antenna formed in the ring resonator unit; and a microwave introduction window that separates the cavity portion from the plasma processing chamber.
    Type: Application
    Filed: December 24, 2020
    Publication date: November 2, 2023
    Inventors: Hitoshi Tamura, Norihiko Ikeda, Chen Pin Hsu
  • Publication number: 20220359162
    Abstract: In order to provide a plasma processing apparatus capable of easily controlling a plasma density distribution on a processing target substrate, a plasma processing apparatus includes: a microwave generating source; a waveguide path including waveguides that transmit a microwave generated by the microwave generating source to a processing chamber; the processing chamber that includes therein a placing table for placing the processing target substrate and is connected to the waveguide path; a gas introduction unit that introduces gas into the processing chamber; and an exhaust unit that discharges the gas introduced into the processing chamber to the outside of the processing chamber, in which a portion of the waveguide path connected to the processing chamber includes a plurality of waveguides formed coaxially.
    Type: Application
    Filed: January 27, 2020
    Publication date: November 10, 2022
    Inventors: Hitoshi Tamura, Norihiko Ikeda
  • Patent number: 11489170
    Abstract: A fuel cell separator includes a separator main body having a first surface and a second surface, and a first seal member disposed on the first surface. When a region on the first surface of the separator main body corresponding to an electrode member disposed on the second surface is defined as a power generation region, and a region on the first surface of the separator main body corresponding to an in-cell seal member is defined as a seal region, a displacement/vibration reducing member made of polymer is disposed at a part of the seal region. The displacement/vibration reducing member includes multiple protrusions and a coupling portion. When viewed in plan view, an axis line connecting the centers of the figures of the adjacent protrusions does not coincide with a center line passing through the widthwise center of the coupling portion. The coupling portion has a gate cut mark.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: November 1, 2022
    Assignees: Sumitomo Riko Company Limited, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideya Kadono, Shigeo Nakanishi, Shinobu Yamaguchi, Hitoshi Tamura, Shinichi Haga, Motohiro Mizuno, Kenji Sato, Takuya Kurihara, Tomohiro Mazaki
  • Publication number: 20220344132
    Abstract: In order to enable plasma density distribution control having a high degree of freedom to solve problems of not only in-plane uniformity of an etching processing but also a reduction of a charge-up damage, a plasma processing apparatus includes: a vacuum chamber provided with a plasma processing chamber that plasma-processes a substrate inside and is able to exhaust the inside of this plasma processing chamber to a vacuum; and a microwave power supply unit that is provided with a microwave source and a circular waveguide and supplies, via the circular waveguide, a microwave power oscillated from the microwave source to the vacuum chamber, in which the microwave power supply unit is configured by arranging a plurality of waveguides, which are coaxially and concentrically arranged with the circular waveguide and have different dielectric constants inside, between the circular waveguide and the vacuum chamber.
    Type: Application
    Filed: April 30, 2020
    Publication date: October 27, 2022
    Inventors: Chen Pin Hsu, Hitoshi Tamura
  • Patent number: 11365959
    Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: June 21, 2022
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventors: Hitoshi Tamura, Tomotaka Yamagata, Kento Kurihara, Yoichi Togawa
  • Publication number: 20210293519
    Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.
    Type: Application
    Filed: June 2, 2021
    Publication date: September 23, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Hitoshi TAMURA, Tomotaka YAMAGATA, Kento KURIHARA, Yoichi TOGAWA
  • Publication number: 20210194018
    Abstract: A fuel cell separator includes a separator main body having a first surface and a second surface, and a first seal member disposed on the first surface. When a region on the first surface of the separator main body corresponding to an electrode member disposed on the second surface is defined as a power generation region, and a region on the first surface of the separator main body corresponding to an in-cell seal member is defined as a seal region, a displacement/vibration reducing member made of polymer is disposed at a part of the seal region. The displacement/vibration reducing member includes multiple protrusions and a coupling portion. When viewed in plan view, an axis line connecting the centers of the figures of the adjacent protrusions does not coincide with a center line passing through the widthwise center of the coupling portion. The coupling portion has a gate cut mark.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 24, 2021
    Applicants: Sumitomo Riko Company Limited, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideya KADONO, Shigeo NAKANISHI, Shinobu YAMAGUCHI, Hitoshi TAMURA, Shinichi HAGA, Motohiro MIZUNO, Kenji SATO, Takuya KURIHARA, Tomohiro MAZAKI
  • Patent number: 10803908
    Abstract: Approaches to patching a leaky hermetically-sealed device include the use of a laminate rework patch that includes an adhesive tape layer, an aluminum sheet layer, and an outer cover layer, and whereby a viscous adhesive is injected or otherwise applied between the patch and the device leak location, over a layer of primer material, to fill the leak and stop the leakage of gas from inside the device. The thickness of the viscous adhesive, and thus the curing time and temperature of the viscous adhesive, can be managed by way of the thickness of the adhesive tape layer.
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: October 13, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hitoshi Tamura, Takako Hayakawa
  • Patent number: 10460913
    Abstract: In order to provide a plasma processing apparatus or method with improved processing uniformity, a plasma processing apparatus includes: a processing chamber which is disposed inside a vacuum container; a sample stage which is disposed inside the processing chamber and has a top surface for placing a wafer corresponding to a processing target thereon; an electric field forming part which forms an electric field supplied into the processing chamber; a coil which forms a magnetic field for forming plasma inside the processing chamber by an interaction with the electric field; and a controller which increases or decreases intensity of the plasma inside the processing chamber by repeatedly increasing or decreasing intensity of the magnetic field formed by the coil at a predetermined interval, wherein the wafer is processed while the plasma is repeatedly formed and diffused.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: October 29, 2019
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Nanako Tamari, Hitoshi Tamura, Naoki Yasui
  • Patent number: 10222733
    Abstract: An image forming apparatus includes: a first conveyance roller pair configured to convey a sheet by rotating while tightly sandwiching the sheet; a rotation blade pair disposed on a downstream side of the first conveyance roller pair in a conveyance path of the sheet and configured to cut the sheet in a direction parallel to the conveyance direction by rotating while sandwiching the sheet; and a second conveyance roller pair configured to convey a cut waste sheet cut by the rotation blade pair in the sheet conveyance direction by rotating while tightly sandwiching the cut waste sheet. A rotational speed of the second conveyance roller pair is controlled at a rotational speed higher than a rotational speed of the first conveyance roller pair.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: March 5, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventor: Hitoshi Tamura
  • Publication number: 20190006153
    Abstract: In order to provide a plasma processing apparatus or method with improved processing uniformity, a plasma processing apparatus includes: a processing chamber which is disposed inside a vacuum container; a sample stage which is disposed inside the processing chamber and has a top surface for placing a wafer corresponding to a processing target thereon; an electric field forming part which forms an electric field supplied into the processing chamber; a coil which forms a magnetic field for forming plasma inside the processing chamber by an interaction with the electric field; and a controller which increases or decreases intensity of the plasma inside the processing chamber by repeatedly increasing or decreasing intensity of the magnetic field formed by the coil at a predetermined interval, wherein the wafer is processed while the plasma is repeatedly formed and diffused.
    Type: Application
    Filed: January 30, 2017
    Publication date: January 3, 2019
    Inventors: Nanako TAMARI, Hitoshi TAMURA, Naoki YASUI
  • Patent number: 9583314
    Abstract: Provided is a plasma processing apparatus including: a circular waveguide connected with a vacuum vessel, and through which a circularly polarized wave of an electric field for plasma formation propagates; a processing chamber which is arranged below the circular waveguide, and in which plasma is formed; a circularly polarized wave generator, which is arranged in the waveguide; a circularly polarized wave adjuster which is connected with the circular waveguide below the circularly polarized wave generator; a circularly polarized wave detector which is below the circularly polarized wave adjuster; and a controller which adjusts an operation of the circularly polarized wave adjuster according to an output from the circularly polarized wave detector, in which the circularly polarized wave adjuster adjusts a length of a protrusion of a dielectric stub into the circular waveguide based on a signal from the controller.
    Type: Grant
    Filed: September 5, 2015
    Date of Patent: February 28, 2017
    Assignee: Hitachi High-Technologies Corporation
    Inventor: Hitoshi Tamura
  • Patent number: 9502212
    Abstract: An object of the present invention is to provide a method and an apparatus capable of measuring a potential of a sample surface by using a charged particle beam, or of detecting a compensation value of a variation in an apparatus condition which changes due to sample charging, by measuring a sample potential caused by irradiation with the charged particle beam. In order to achieve the object, a method and an apparatus are provided in which charged particle beams (2(a), 2(b)) emitted from a sample (23) are deflected by a charged particle deflector (33) in a state in which the sample (23) is irradiated with a charged particle beam (1), and information regarding a sample potential is detected by using a signal obtained at that time.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: November 22, 2016
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yuzuru Mizuhara, Miki Isawa, Minoru Yamazaki, Hitoshi Tamura, Hideyuki Kazumi
  • Publication number: 20160313686
    Abstract: An image forming apparatus includes: a first conveyance roller pair configured to convey a sheet by rotating while tightly sandwiching the sheet; a rotation blade pair disposed on a downstream side of the first conveyance roller pair in a conveyance path of the sheet and configured to cut the sheet in a direction parallel to the conveyance direction by rotating while sandwiching the sheet; and a second conveyance roller pair configured to convey a cut waste sheet cut by the rotation blade pair in the sheet conveyance direction by rotating while tightly sandwiching the cut waste sheet. A rotational speed of the second conveyance roller pair is controlled at a rotational speed higher than a rotational speed of the first conveyance roller pair.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 27, 2016
    Inventor: Hitoshi TAMURA
  • Publication number: 20160141151
    Abstract: Provided is a plasma processing apparatus including: a circular waveguide connected with a vacuum vessel, and through which a circularly polarized wave of an electric field for plasma formation propagates; a processing chamber which is arranged below the circular waveguide, and in which plasma is formed; a circularly polarized wave generator, which is arranged in the waveguide; a circularly polarized wave adjuster which is connected with the circular waveguide below the circularly polarized wave generator; a circularly polarized wave detector which is below the circularly polarized wave adjuster; and a controller which adjusts an operation of the circularly polarized wave adjuster according to an output from the circularly polarized wave detector, in which the circularly polarized wave adjuster adjusts a length of a protrusion of a dielectric stub into the circular waveguide based on a signal from the controller.
    Type: Application
    Filed: September 5, 2015
    Publication date: May 19, 2016
    Inventor: Hitoshi TAMURA
  • Publication number: 20150348748
    Abstract: An object of the present invention is to provide a method and an apparatus capable of measuring a potential of a sample surface by using a charged particle beam, or of detecting a compensation value of a variation in an apparatus condition which changes due to sample charging, by measuring a sample potential caused by irradiation with the charged particle beam. In order to achieve the object, a method and an apparatus are provided in which charged particle beams (2(a), 2(b)) emitted from a sample (23) are deflected by a charged particle deflector (33) in a state in which the sample (23) is irradiated with a charged particle beam (1), and information regarding a sample potential is detected by using a signal obtained at that time.
    Type: Application
    Filed: January 22, 2014
    Publication date: December 3, 2015
    Inventors: Yuzuru MIZUHARA, Miki ISAWA, Minoru YAMAZAKI, Hitoshi TAMURA, Hideyuki KAZUMI