Abstract: A circuit board has: an insulating substrate formed by plural ceramic insulating layers being layered on one another and having a first surface and a second surface on the opposite side to the first surface; a circuit conductor passing through the inside of the insulating substrate and positioned in a region from the first surface to the second surface; and at least one heating wire positioned in the insulating substrate. The heating wire is positioned in, among plural interlayer regions between the ceramic insulating layers, at least one interlayer region between the ceramic insulating layers and has a mesh shape having plural first through holes through which a portion of the circuit conductor passes and having plural second through holes through which the circuit conductor does not pass.

Abstract: Provided is a heater substrate that includes an insulating substrate having a first surface and a second surface that is on an opposite side from the first surface, a heater wire located inside the insulating substrate, and an adjustment part that is electrically connected to the heater wire. The adjustment part includes a pair of adjustment terminals that are located on the second surface and are respectively electrically connected to two ends of a partial section of the heater wire, and an adjustment conductor that is located on the second surface and is connected to the pair of adjustment terminals. Also provided are a probe card substrate and a probe card that include the heater substrate.

Abstract: A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposite to the insulating substrate. Each of the plurality of internal conductors includes a part that is inclined with respect to a perpendicular to the surface facing the insulating substrate. Intervals at which the plurality of internal conductors are located on the side opposite to the insulating substrate are narrower than intervals at which the plurality of internal conductors are located on an insulating substrate side.

Abstract: Provided is a heater substrate that includes an insulating substrate having a first surface and a second surface that is on an opposite side from the first surface, a heater wire located inside the insulating substrate, and an adjustment part that is electrically connected to the heater wire. The adjustment part includes a pair of adjustment terminals that are located on the second surface and are respectively electrically connected to two ends of a partial section of the heater wire, and an adjustment conductor that is located on the second surface and is connected to the pair of adjustment terminals. Also provided are a probe card substrate and a probe card that include the heater substrate.

Abstract: A circuit board has: an insulating substrate formed by plural ceramic insulating layers being layered on one another and having a first surface and a second surface on the opposite side to the first surface; a circuit conductor passing through the inside of the insulating substrate and positioned in a region from the first surface to the second surface; and at least one heating wire positioned in the insulating substrate. The heating wire is positioned in, among plural interlayer regions between the ceramic insulating layers, at least one interlayer region between the ceramic insulating layers and has a mesh shape having plural first through holes through which a portion of the circuit conductor passes and having plural second through holes through which the circuit conductor does not pass.