Abstract: A load management system includes: an image acquisition sensor configured to acquire image data including an analysis target image including a load loaded in a medium processing apparatus; a judgment circuitry configured to judge whether or not the image data is authentic; and an image analysis circuitry configured to analyze the analysis target image to acquire information about the load when the image data is authentic.

Abstract: A medium processing system includes: a memory and a processor, in which the processor performs application execution for exchanging transaction information with a device via middleware to perform information processing on a transaction of a valuable medium, the device being configured to perform the transaction, and error processing of acquiring, upon occurrence of an error in the device during the transaction of the valuable medium, first error information from among pieces of information on the error without the middleware to perform error recovery processing on the error based on the first error information.

Abstract: An electronic device includes a substrate having a first surface and a second surface in a front-back relation, a first electronic component mounted on the second surface, and a lead joined to the second surface of the substrate via a conductive joint member, wherein the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and ?1>?2, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is ?1, a distance between the first electronic component and the terminal surface in the thickne

Abstract: In a method for manufacturing an electronic device, a first electronic device includes a first sensor, a second sensor, a first circuit board, and a first package, a second electronic device includes a third sensor, a fourth sensor, a second circuit board, and a second package, the first package and the second package have the same size in plan view, the second sensor has a size smaller than a size of the fourth sensor in plan view, the first circuit board and the second circuit board have the same size in plan view, and the method includes: mounting the first circuit board on the first package and then mounting the second sensor; and mounting the fourth sensor on the second package and then mounting the second circuit board.

Abstract: A medium processing system includes: a memory and a processor, in which the processor performs application execution for exchanging transaction information with a device via middleware to perform information processing on a transaction of a valuable medium, the device being configured to perform the transaction, and error processing of acquiring, upon occurrence of an error in the device during the transaction of the valuable medium, first error information from among pieces of information 10 on the error without the middleware to perform error recovery processing on the error based on the first error information.

Abstract: An electronic device includes a substrate having a first surface and a second surface in a front-back relation, a first electronic component mounted on the second surface, and a lead joined to the second surface of the substrate via a conductive joint member, wherein the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and ?1>?2, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is ?1, a distance between the first electronic component and the terminal surface in the thickne

Abstract: A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

Abstract: A load management system includes: an image acquisition sensor configured to acquire image data including an analysis target image including a load loaded in a medium processing apparatus; a judgment circuitry configured to judge whether or not the image data is authentic; and an image analysis circuitry configured to analyze the analysis target image to acquire information about the load when the image data is authentic.

Abstract: A sensor module includes a circuit board, a sensor element having a detection axis along a planar direction of the circuit board, a sensor package accommodating the sensor element and mounted on the circuit board, a board land pattern used for mounting the sensor package disposed on the circuit board, and a package electrode disposed on a mounting surface of the sensor package facing the circuit board and joined to the board land pattern by a solder. A relationship of Xp?X1 is satisfied, in which Xp is a width of the board land pattern in a first direction along the planar direction of the circuit board, and X1 is a width of the package electrode in the first direction.

Abstract: An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

Abstract: The process includes acquiring, from a relay device that relays a packet between a first communication device and a second communication device, a plurality of first delay times generated by a round trip of the packet between the first communication device and the relay device, and a plurality of second delay times generated by a round trip of the packet between the second communication device and the relay device, sorting separately the plurality of first delay times and the plurality of second delay times based on a length of a delay time, and calculating device delay times based on a first delay calculation that calculates a difference between each of the plurality of first delay times and each of the plurality of second delay times in a same rank after the sorting.

Abstract: A computer readable network analysis program of performing local modeling analysis of determining an estimated value of a current network quality corresponding to explanatory variable vector in current aggregated data based on a local model including local training data; determining an abnormality in the network based on whether or not a measured value of the current network quality is lower than a threshold; determining whether or not a distribution of the connections having the measured value of the network quality exceeding the threshold is present in a large size; extracting an individual-analysis-target connection group including more than predetermined proportions of connections in the distribution of the connections having the large size; and performing the local modeling analysis to the individual-analysis-target connection group and the remaining connection groups to determine the abnormality in the network.

Abstract: A method of calculating a predicted exhaustion date for causing a computer to execute a process. The process includes calculating a first predicted exhaustion date when a resource in a system is predicted to be exhausted, at a first time point, calculating: a second predicted exhaustion date when the resource is predicted to be exhausted, at a second time point after the first time point, calculating a difference between the first predicted exhaustion date and the second predicted exhaustion date, calculating, a third predicted exhaustion date by con-ecting the second predicted exhaustion date based on the difference, and presenting the third predicted exhaustion date.

Abstract: A service specifying method for causing a computer to execute a process. The process includes acquiring a parameter indicating a load of a resource used by a plurality of services for each of the plurality of services, estimating a performance of each service for each of a plurality of the services by using an estimation model that estimates the performance of the each service from the parameter related to the each service, the estimation model being provided for each of the plurality of services, and specifying, among the plurality of services, a service whose performance is deteriorated due to a failure of the resource based on the estimated performance.

Abstract: A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

Abstract: An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

Abstract: A non-transitory computer-readable storage medium storing a packet analysis program for causing a computer to execute a process, the process includes acquiring packets communicated between nodes, adding information of communication of ongoing couplings to an ongoing coupling list in each of predetermined time ranges belonging to start times of the couplings based on the packets, and removing information of communication of a terminated coupling from the ongoing coupling list based on the packets, and analyzing the quality of the communication of the terminated coupling in a cycle corresponding to a time range among the time ranges, and analyzing the quality of communication related to a coupling present in the ongoing coupling list even when the cycle has elapsed a predetermined number of times or more after the addition of information of the coupling to the ongoing coupling list.

Abstract: A distribution process system includes a first terminal configured to, in accordance with a change relating to a processing load, perform transmission of first information relating to the processing load of the first terminal to a second terminal having a transmission frequency of a message relating to a processing load of the second terminal to a management device higher than a transmission frequency of a message relating to the processing load of the first terminal, the second terminal configured to, in response to receiving the first information, transmit to the management device a first message relating to the processing load of the second terminal and the first information, and the management device configured to manage a load state of each of the first terminal and the second terminal, and update the load state of the first terminal in accordance with the first information in response to receiving the first information.