Patents by Inventor Hitoshi Ushijima

Hitoshi Ushijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6548185
    Abstract: To provide a feathery copper fiber body which can be uniformly dispersed in a resin composition, rubber composition, low melting metal, coating compound, adhesive, etc. to exert an effect of electrically and mechanically modifying the matrix. A fiber body made of copper, which is feathery.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: April 15, 2003
    Assignee: Yazaki Corporation
    Inventor: Hitoshi Ushijima
  • Publication number: 20030064240
    Abstract: To provide a feathery copper fiber body which can be uniformly dispersed in a resin composition, rubber composition, low melting metal, coating compound, adhesive, etc. to exert an effect of electrically and mechanically modifying the matrix. A fiber body made of copper, which is feathery.
    Type: Application
    Filed: December 16, 1999
    Publication date: April 3, 2003
    Inventor: HITOSHI USHIJIMA
  • Publication number: 20030061710
    Abstract: A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of molten metal on a substrate so as to form the first circuit based on the coordinate data.
    Type: Application
    Filed: October 2, 2002
    Publication date: April 3, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Hitoshi Ohashi, Hitoshi Ushijima, Kinya Horibe
  • Patent number: 6465098
    Abstract: An electromagnetic wave absorbing material is provided by shaping a resin composition containing 5 to 10 parts by weight of a carbon black and 1 to 10 parts by weight of a gas phase growth carbon fiber in a resin based on 100 parts by weight of the resin.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: October 15, 2002
    Assignee: Yazaki Corporation
    Inventors: Yoshifumi Mizuguchi, Hitoshi Ushijima
  • Publication number: 20020105358
    Abstract: The apparatus forms an electric circuit on a construction member of a machine based on a set of three-dimensional data. The data defines a position and a profile of the construction member, a position of the electric circuit, and a shape of the electric circuit. The electric circuit is used for electrical connection between electric instruments mounted on the machine. The data is associated with a reference coordinate system provided in the machine, and the data includes coordinates of points for determining arrangement of the electric circuit, a distance between any two of the points adjacent to each other, and a cross-sectional area of the electric circuit associated extended between the two points.
    Type: Application
    Filed: January 17, 2002
    Publication date: August 8, 2002
    Inventors: Hitoshi Ohashi, Kinya Horibe, Hitoshi Ushijima, Tatsuya Kato
  • Patent number: 6406790
    Abstract: A composite material incorporating vapor-phase-epitaxial carbon fibers and metal.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: June 18, 2002
    Assignee: Yazaki Corporation
    Inventor: Hitoshi Ushijima
  • Publication number: 20020061447
    Abstract: An electrode for secondary battery made of carbon material is provided, which is light in weight while excellent in charge-discharge properties and in durability in repetitive use. A material for electrode is obtained by intermixing a synthetic resin with vapor-phase growth carbon fibers to make the vapor-phase growth carbon fibers uniformly dispersed in the synthetic resin to obtain a mixture, molding the mixture into a predetermined shape to obtain a molded product, and heating the molded product at high temperature to convert it into a carbon-carbon composite material. The electrode for battery is made of thus obtained carbon-carbon composite material.
    Type: Application
    Filed: January 24, 2002
    Publication date: May 23, 2002
    Applicant: YAZAKI CORPORATION
    Inventors: Toshiaki Kanno, Makoto Katsumata, Hidenori Yamanashi, Hitoshi Ushijima
  • Publication number: 20020028612
    Abstract: In a structure 21 for connecting an electric wire and a connecting terminal in the invention, a ductile metal film 29 is formed in advance on an inner surface of a conductor caulking portion 24 of a crimp terminal 22 by such as plating, vacuum deposition, or adhesion. Then, the conductor caulking portion 24 in the rear portion of the crimp terminal 22 is caulked onto core wire portions M in a state of being stripped and extended in the axial direction from an end of a sheathed wire W to thereby establish connection. Subsequently, the metal film 29 is fused on heating. Accordingly, the ductile metal film 29 enters gaps between the inner surface of the conductor caulking portion 24 and the core wire portions M and between adjacent ones of the core wire portions M by the caulking stress. Hence, the area of contact between the conductor caulking portion 24 and the core wire portions M via the metal film 29 increases, and conductivity improves, thereby making it possible to suppress heat generation.
    Type: Application
    Filed: November 7, 2001
    Publication date: March 7, 2002
    Applicant: YAZAKI CORPORATION
    Inventors: Hitoshi Ushijima, Yasuyuki Saito
  • Patent number: 6334798
    Abstract: In a structure 21 for connecting an electric wire and a connecting terminal in the invention, a ductile metal film 29 is formed in advance on an inner surface of a conductor caulking portion 24 of a crimp terminal 22 by such as plating, vacuum deposition, or adhesion. Then, the conductor caulking portion 24 in the rear portion of the crimp terminal 22 is caulked onto core wire portions M in a state of being stripped and extended in the axial direction from an end of a sheathed wire W to thereby establish connection. Subsequently, the metal film 29 is fused on heating. Accordingly, the ductile metal film 29 enters gaps between the inner surface of the conductor caulking portion 24 and the core wire portions M and between adjacent ones of the core wire portions M by the caulking stress. Hence, the area of contact between the conductor caulking portion 24 and the core wire portions M via the metal film 29 increases, and conductivity improves, thereby making it possible to suppress heat generation.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: January 1, 2002
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Ushijima, Yasuyuki Saito
  • Publication number: 20010039309
    Abstract: There is provided conductive paste wherein conductive fillers composed of copper micro-fibers are mixed into thermoplastic resin or thermosetting resin.
    Type: Application
    Filed: March 28, 2001
    Publication date: November 8, 2001
    Applicant: Yazaki Corporation
    Inventors: Hitoshi Ushijima, Yoshinobu Akiha
  • Publication number: 20010016254
    Abstract: An electromagnetic wave absorbing material is provided by shaping a resin composition containing 5 to 10 parts by weight of a carbon black and 1 to 10 parts by weight of a gas phase growth carbon fiber in a resin based on 100 parts by weight of the resin.
    Type: Application
    Filed: February 9, 2001
    Publication date: August 23, 2001
    Applicant: Yazaki Corporation
    Inventors: Yoshifumi Mizuguchi, Hitoshi Ushijima
  • Publication number: 20010005936
    Abstract: An electrically conductive paste is provided in that complexes A each made up of an electrically conductive filler 1 and a heating element 3 adapted to generate heat on electromagnetic induction are compounded with a resin 5.
    Type: Application
    Filed: November 30, 2000
    Publication date: July 5, 2001
    Inventor: Hitoshi Ushijima
  • Patent number: 6172308
    Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that clattering of the terminal against the circuit assembly can be prevented.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: January 9, 2001
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Toshiyuki Mori, Hitoshi Ushijima
  • Patent number: 6054175
    Abstract: A conductive filler has a metallic layer having a low melting point formed on its surface. The filler can give an excellent electric/electromagnetic effect to a matrix.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: April 25, 2000
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiha, Tatsuya Kato, Hitoshi Ushijima
  • Patent number: 5966805
    Abstract: A connecting end portion of a planar circuit body and method of making same in which an end portion is directly formed into a terminal thereby improving conductivity and simplifying the connection. According to one embodiment, a connecting end portion of a flat cable is formed by laminating a rectangular circuit conductor with an insulating cover material, a terminal member is fixedly secured to the planar circuit conductor at an end portion of the circuit conductor with a conductive adhesive agent, and plated metal layer is formed thereon.
    Type: Grant
    Filed: November 1, 1996
    Date of Patent: October 19, 1999
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiha, Hitoshi Ushijima
  • Patent number: 5945637
    Abstract: A terminal attachment structure includes a circuit assembly and a terminal attached to the circuit assembly. The circuit assembly has an insulating substrate and a circuit printed on the insulating substrate. The terminal is composed of a circuit-contact part, a connecting part to be connected with a mating terminal and a cradle part arranged between the circuit-contact part and the connecting part. When a force directing the insulating substrate is applied on the connecting part, the cradle part operates to receive the force. Accordingly, the circuit-contact part does not rise from the insulating substrate, so that tottering of the terminal against the circuit assembly can be prevented.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: August 31, 1999
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Toshiyuki Mori, Hitoshi Ushijima
  • Patent number: 5868967
    Abstract: In a carbon thread, vapor phase growth carbon fiber (VGCF) are dispersedly contained in a carbon matrix. The carbon thread is produced by forming a thread-like element from a mixture of VGCF and carbonizable carbon-containing compound and then by heat-treating the thread-like element to effect carbonization thereon. The thread-like element may be formed either by melt-spinning or solution-spinning the mixture, or by impregnably adhering the mixture onto a thread of heat resisting fibers. The carbonized carbon thread thus obtained may be subjected to further heat treatment to graphitize the carbon thread.
    Type: Grant
    Filed: March 15, 1996
    Date of Patent: February 9, 1999
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Hidenori Yamanashi, Hitoshi Ushijima
  • Patent number: 5718047
    Abstract: A method of manufacturing an electrical junction box, which is provided with a casing constructing an outline thereof and accommodating a circuit board having a desired circuit pattern, a plurality of housings mounted outside the casing for connecting electrical parts such as a fuse, relay and a connector for wiring harnesses, wherein terminals drawn out from the circuit of the circuit board are accommodated in an aligned form in each of the housings, the method comprising the steps of: making a plurality of terminal insertion holes along a predetermined pattern composed of a plurality of paths formed in the casing; forming a circuit pattern by screen printing an electrically conductive paste on the inner surface of the casing from the upper position of the terminal insertion holes; pressure inserting a bottom base portion of the respective terminals into a corresponding one of the plurality of terminal insertion holes; and forming an electrically conductive circuit pattern by depositing a plated layer of a d
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: February 17, 1998
    Assignee: Yazaki Corporation
    Inventors: Makoto Nakayama, Hitoshi Ushijima, Masashi Kitada
  • Patent number: 5714050
    Abstract: A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic resin; heating and retaining the mold so that the circuit body is bonded to the board under heat and pressure; and releasing the mold from the board after cooling the board to thereby transfer the circuit body to the board. The circuit board may be in the shape of box with the circuit body on the inner surfaces thereof.
    Type: Grant
    Filed: January 26, 1996
    Date of Patent: February 3, 1998
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiba, Makoto Katsumata, Hitoshi Ushijima, Hidenori Yamanashi
  • Patent number: 5677009
    Abstract: A metal plated carbon material containing at least one metal chloride compound disposed between graphite layers to form a graphite intercalation compound, and a metal plated layer being formed on a front surface of the metal plated carbon material. A method of producing the metal plated carbon material comprising the steps of immersing a graphite intercalation compound in an electroless plating solution for 6 to 30 hours, and forming a metal plated layer on a surface of the graphite intercalation compound with an excellent adherence thereto.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: October 14, 1997
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Hidenori Yamanashi, Hitoshi Ushijima