Patents by Inventor Hitoshi Usuda

Hitoshi Usuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140083842
    Abstract: A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventors: Hitoshi USUDA, Tomohiro Noda
  • Patent number: 5891509
    Abstract: A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.
    Type: Grant
    Filed: August 4, 1997
    Date of Patent: April 6, 1999
    Assignees: Fujitsu Limited, Almex Inc.
    Inventors: Eishiro Kawana, Hitoshi Usuda, Kenji Mimura
  • Patent number: 5102521
    Abstract: According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes and diaphragmn in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. By simply carrying the objects to be plated in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: April 7, 1992
    Assignees: Almex Inc., Permelec Electrode Ltd.
    Inventors: Hitoshi Usuda, Ryoei Yamakawa, Kenichi Ueno, Kazuhiro Hirao