Abstract: A module includes an electrical wiring layer, an optical wiring layer, an electrical element, and an optical element. The electrical wiring layer includes electrical wiring lines for propagating electrical signals. The optical wiring layer includes optical wiring lines that are formed over the electrical wiring layer and are designed for propagating optical signals. The electrical element is formed on the electrical wiring layer and is electrically connected to the electrical wiring lines. The optical element is formed on the optical wiring layer and is optically connected to the optical wiring lines.

Abstract: A trace structure includes a first signal line in which a first outer layer conductor on a top surface of a dielectric substrate, a first via, a first inner layer conductor, a second via, and a second outer layer conductor on a bottom surface of the substrate are electrically connected, and a second signal line in which a third outer layer conductor on the top surface, a third via, a second inner layer conductor, a fourth via, and a fourth outer layer conductor on the bottom surface are electrically connected, and in which the first and second inner layer conductors have substantially equivalent lengths and are arranged on different planes each parallel to the bottom surface to overlap each other in a vertical direction, and a sum of lengths of the first and second vias is substantially equivalent to a sum of lengths of the third and fourth vias.

Abstract: A wiring substrate is a wiring substrate including a plurality of differential pairs. Each of the differential pairs includes a first signal conductor, a first connection portion connected to the first signal conductor via a first via, a second signal conductor, and a second connection portion connected to the second signal conductor via a second via. The first signal conductor and the second signal conductor are arranged on different planes parallel to a bottom surface of the wiring substrate and overlap in a vertical direction. The first connection portion and the second connection portion are arranged on a top surface of the wiring substrate at a predetermined interval in a signal transmission direction. Adjacent differential pairs among the plurality of differential pairs are arranged at a predetermined interval in the signal transmission direction and at a predetermined interval in a direction perpendicular to the signal transmission direction.

Abstract: An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

Abstract: An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.

Abstract: There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.

Abstract: To provide an optical module, an optical wiring board, and a method for manufacturing an optical module that provide the two-dimensional freedom degree of the joint portion between the optical module and the optical fiber even through the OBO method is applied to an optical module mounted via WLP.

Abstract: The optical module includes an extension circuit board and a front end flip-chip mounted on the extension circuit board. The front end includes a semiconductor amplifier chip that executes signal processing, and an optical semiconductor chip that includes at least one of a light emitting element and a light receiving element and is flip-chip mounted on the semiconductor amplifier chip. The extension circuit board has a recessed portion that can accommodate at least a part of the optical semiconductor chip. The semiconductor amplifier chip is flip-chip mounted on the extension circuit board in the state where the surface mounting the optical semiconductor chip faces the surface of the extension circuit board, and at least a part of the optical semiconductor chip is accommodated in the recessed portion.

Abstract: To provide an optical module, an optical wiring board, and a method for manufacturing an optical module that provide the two-dimensional freedom degree of the joint portion between the optical module and the optical fiber even through the OBO method is applied to an optical module mounted via WLP.

Abstract: There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.

Abstract: An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

Abstract: An optical device includes a waveguide configured with a waveguide core and clad layers. A thickness of the upper clad layer between a surface of a coupling unit of the waveguide and the waveguide core is set to a thickness with which optical evanescent coupling is capable of being performed with a waveguide or optical fiber for monitoring in a case where the waveguide or optical fiber for monitoring is arranged in a vicinity of the surface of the coupling unit.

Abstract: An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.

Abstract: A connection structure (3) of a high-frequency transmission line according to this invention includes a columnar central conductor (7) having one end connected to a coaxial line and the other end connected to a planar transmission line, a first outer conductor (41) arranged on a side of the one end of the central conductor coaxially with the central conductor, a first dielectric body (42) filled between the first outer conductor and the central conductor, a second outer conductor (61) arranged on a side of the other end of the central conductor coaxially with the central conductor, a second dielectric body (62) filled between the second outer conductor and the central conductor, a third outer conductor (51) arranged between the first outer conductor and the second outer conductor coaxially with the central conductor, and a third dielectric body (52) filled between the third outer conductor and the central conductor.

Abstract: A connection structure (3) of a high-frequency transmission line according to this invention includes a columnar central conductor (7) having one end connected to a coaxial line and the other end connected to a planar transmission line, a first outer conductor (41) arranged on a side of the one end of the central conductor coaxially with the central conductor, a first dielectric body (42) filled between the first outer conductor and the central conductor, a second outer conductor (61) arranged on a side of the other end of the central conductor coaxially with the central conductor, a second dielectric body (62) filled between the second outer conductor and the central conductor, a third outer conductor (51) arranged between the first outer conductor and the second outer conductor coaxially with the central conductor, and a third dielectric body (52) filled between the third outer conductor and the central conductor.

Abstract: An induction heating apparatus of the invention is provided with a pair of inversely parallel connected thyristors which receives power from a low frequency energy source. Depending on the polarity of the source voltage, one of the thyristors is triggered into conduction by a control pulse generated in delayed response to a sensed forward bias potential at its anode for the purpose of supplying a forward current to a commutating circuit which is tuned to a high frequency in the ultrasonic range, whereupon a backward current is generated. The backward current is commutated through the other thyristor to complete a high frequency oscillation. A detector is provided to detect when the magnitude of the backward commutating current reaches a predetermined value for the purpose of terminating the trigger control pulse.