Patents by Inventor Hitoshi Yokemura

Hitoshi Yokemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8710918
    Abstract: An electronic component includes a driver that outputs a signal to a reception apparatus; a storage device storing therein reflection information related to a reflected wave that returns to the driver when the signal is reflected back by the reception apparatus; a reflected wave detector that based on the reflection information, determines a measurement period for measuring the reflected wave and that based on the measurement period, measures an arrival time and a peak amplitude of the reflected wave; and a controller that based on the arrival time and the peak amplitude, extracts reflected-wave cancelling information for inhibiting effects of the reflected wave from the reception apparatus and that sets the extracted reflected-wave cancelling information in the driver.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: April 29, 2014
    Assignee: Fujitsu Limited
    Inventors: Takeshi Uemura, Masaki Tosaka, Hitoshi Yokemura
  • Patent number: 8402648
    Abstract: A printed circuit board includes a through hole constituted by a hole penetrating through the front and rear surfaces of the printed circuit board. A fabrication method of the printed circuit board, includes applying conductive material plating to the inner wall surface of the hole to form a through hole electrically connecting the front and rear surfaces of the printed circuit board, and removing the conductive material plated on the hole inner wall surface at least at a portion between the front and rear surfaces of the printed circuit board is carried out to thereby fabricate a printed circuit board having a through hole electrically isolates the front surface of the printed circuit board from the rear surface thereof.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: March 26, 2013
    Assignee: Fujitsu Limited
    Inventors: Daita Tsubamoto, Hitoshi Yokemura, Masaki Tosaka
  • Publication number: 20130049848
    Abstract: An electronic component includes a driver that outputs a signal to a reception apparatus; a storage device storing therein reflection information related to a reflected wave that returns to the driver when the signal is reflected back by the reception apparatus; a reflected wave detector that based on the reflection information, determines a measurement period for measuring the reflected wave and that based on the measurement period, measures an arrival time and a peak amplitude of the reflected wave; and a controller that based on the arrival time and the peak amplitude, extracts reflected-wave cancelling information for inhibiting effects of the reflected wave from the reception apparatus and that sets the extracted reflected-wave cancelling information in the driver.
    Type: Application
    Filed: June 28, 2012
    Publication date: February 28, 2013
    Applicant: Fujitsu Limited
    Inventors: Takeshi UEMURA, Masaki Tosaka, Hitoshi Yokemura
  • Patent number: 8352233
    Abstract: An electromagnetic field simulation apparatus disclosed herein replaces a predetermined region in printed circuit board CAD data to be subjected to electromagnetic field simulation with measurement data measured by a near-field measurement device and generates new printed circuit board CAD data. Subsequently, regarding a measurement data portion in the new printed circuit board CAD data generated by the data generating unit, the electromagnetic field simulation apparatus generates analysis model data by setting, as a wave source, an electric field or a magnetic field measured by the near-field measurement device. Then, the electromagnetic field simulation apparatus executes electromagnetic field simulation with respect to the analysis model data having a set wave source.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: January 8, 2013
    Assignee: Fujitsu Limited
    Inventors: Takashi Yamagajo, Hitoshi Yokemura
  • Patent number: 8219955
    Abstract: In order to make it possible to automatically execute a wiring process which satisfies not only a design condition but also design quality relating to an electric characteristic, according to the embodiment, an automatic wiring apparatus includes a design condition changing section for changing a design condition in accordance with priority information regarding the design condition where a wiring process which satisfies the design condition cannot be carried out by a first wiring processing section, a quality allowability decision section for deciding whether or not quality of a wiring region can be allowed where a wiring process which satisfies the design condition after the changing can be executed by a second wiring processing section and an outputting section for outputting a result of the wiring process of the wiring region by the second wiring processing section if it is decided that the quality of the wiring region can be allowed.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: July 10, 2012
    Assignee: Fujitsu Limited
    Inventors: Daita Tsubamoto, Hitoshi Yokemura, Hidenobu Shiihara, Kazukiyo Ogawa, Hisashi Aoyama, Masaki Tosaka
  • Patent number: 8000662
    Abstract: A transmission characteristic adjustment device and the like that can carry out circuit adjustment before an error occurs, and has a transmission characteristic with high reliability without generating an error are provided. The device determines existence or non-existence of a difference with respect to confirmed data based on each phase of a multiphase clock, detects a window width in a time axis direction of receiving data based on a result of the determination and a phase of the multiphase clock, and evaluates a setting value of a circuit element of the transmission element or the reception element that has an influence on a receiving waveform based on a fluctuation of the detected window width, and changes the setting value of the circuit element of the transmission element or the reception element based on a result of the evaluation.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: August 16, 2011
    Assignee: Fujitsu Limited
    Inventors: Daita Tsubamoto, Makoto Suwada, Hitoshi Yokemura, Masaki Tosaka
  • Publication number: 20100312539
    Abstract: An electromagnetic field simulation apparatus disclosed herein replaces a predetermined region in printed circuit board CAD data to be subjected to electromagnetic field simulation with measurement data measured by a near-field measurement device and generates new printed circuit board CAD data. Subsequently, regarding a measurement data portion in the new printed circuit board CAD data generated by the data generating unit, the electromagnetic field simulation apparatus generates analysis model data by setting, as a wave source, an electric field or a magnetic field measured by the near-field measurement device. Then, the electromagnetic field simulation apparatus executes electromagnetic field simulation with respect to the analysis model data having a set wave source.
    Type: Application
    Filed: May 26, 2010
    Publication date: December 9, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Yamagajo, Hitoshi Yokemura
  • Publication number: 20100072977
    Abstract: An electronic device includes a receiver receiving a signal, a driver outputting a signal, and at least one of an amplitude measuring device having an amplitude detector connected to an input end of the receiver and a jitter measuring device having a phase detector connected to an output end of the receiver. An output end of the driver and an input end of the receiver are connected to measure at least one of the amplitude and jitter of the driver output.
    Type: Application
    Filed: December 2, 2009
    Publication date: March 25, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Teruaki YAGOSHI, Hitoshi YOKEMURA
  • Publication number: 20100030358
    Abstract: In order to make it possible to automatically execute a wiring process which satisfies not only a design condition but also design quality relating to an electric characteristic, according to the embodiment, an automatic wiring apparatus includes a design condition changing section for changing a design condition in accordance with priority information regarding the design condition where a wiring process which satisfies the design condition cannot be carried out by a first wiring processing section, a quality allowability decision section for deciding whether or not quality of a wiring region can be allowed where a wiring process which satisfies the design condition after the changing can be executed by a second wiring processing section and an outputting section for outputting a result of the wiring process of the wiring region by the second wiring processing section if it is decided that the quality of the wiring region can be allowed.
    Type: Application
    Filed: October 6, 2009
    Publication date: February 4, 2010
    Inventors: Daita TSUBAMOTO, Hitoshi YOKEMURA, Hidenobu SHIIHARA, Kazukiyo OGAWA, Hisashi AOYAMA, Masaki TOSAKA
  • Publication number: 20090294169
    Abstract: A printed circuit board includes a through hole constituted by a hole penetrating through the front and rear surfaces of the printed circuit board. A fabrication method of the printed circuit board, includes applying conductive material plating to the inner wall surface of the hole to form a through hole electrically connecting the front and rear surfaces of the printed circuit board, and removing the conductive material plated on the hole inner wall surface at least at a portion between the front and rear surfaces of the printed circuit board is carried out to thereby fabricate a printed circuit board having a through hole electrically isolates the front surface of the printed circuit board from the rear surface thereof.
    Type: Application
    Filed: February 2, 2009
    Publication date: December 3, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Daita TSUBAMOTO, Hitoshi YOKEMURA, Masaki TOSAKA
  • Publication number: 20090168859
    Abstract: A transmission characteristic adjustment device with high reliability in a transmission characteristic that can adjust a circuit before an error occurs and does not generate an error is provided. A transmission characteristic adjustment device that adjusts a transmission characteristic between a transmission element and a receiving element interposing a transmission path, includes: a sight test circuit that is provided on the receiving element side and detects an eye pattern aperture; a margin calculation circuit that calculates a margin with respect to a mask included in the detected eye pattern aperture; a circuit element adjustment circuit that evaluates a setting value of a circuit element of the transmission element or the receiving element having influence on a receiving waveform based on fluctuation of the calculated margin, and changes the setting value of the circuit element of the transmission element or the receiving element based on a result of the evaluation.
    Type: Application
    Filed: August 8, 2008
    Publication date: July 2, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Daita TSUBAMOTO, Makoto SUWADA, Hitoshi YOKEMURA, Masaki TOSAKA
  • Publication number: 20090167452
    Abstract: A transmission characteristic adjustment device and the like that can carry out circuit adjustment before an error occurs, and has a transmission characteristic with high reliability without generating an error are provided. The device determines existence or non-existence of a difference with respect to confirmed data based on each phase of a multiphase clock, detects a window width in a time axis direction of receiving data based on a result of the determination and a phase of the multiphase clock, and evaluates a setting value of a circuit element of the transmission element or the reception element that has an influence on a receiving waveform based on a fluctuation of the detected window width, and changes the setting value of the circuit element of the transmission element or the reception element based on a result of the evaluation.
    Type: Application
    Filed: August 5, 2008
    Publication date: July 2, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Daita TSUBAMOTO, Makoto Suwada, Hitoshi Yokemura, Masaki Tosaka
  • Patent number: 6388879
    Abstract: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Otaguro, Takayuki Ashida, Hitoshi Yokemura, Hidenao Nakajima, Yoshimi Watanabe, Shuuhei Fujita
  • Patent number: 6216342
    Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: April 17, 2001
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 6127634
    Abstract: A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.
    Type: Grant
    Filed: June 13, 1995
    Date of Patent: October 3, 2000
    Assignee: Fujitsu Limited
    Inventors: Yutaka Higashiguchi, Masao Hosogai, Hiroyuki Otaguro, Hitoshi Yokemura, Masaharu Hida
  • Patent number: 6116912
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: September 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 5886309
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: March 23, 1999
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 5355282
    Abstract: An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).
    Type: Grant
    Filed: April 26, 1993
    Date of Patent: October 11, 1994
    Assignee: Fujitsu Limited
    Inventors: Hitoshi Yokemura, Masao Hosogai, Yuko Tsujimura