Patents by Inventor Hitoshi Yoshizawa

Hitoshi Yoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190248623
    Abstract: A guiding device according to the present invention generates and displays guidance information for displaying a sequence of operation states of an elevator on a three-sided frame corresponding to the car responding to a call for the elevator or the periphery of the three-sided frame. The sequence of operation state of the elevator includes the position of the lobby corresponding to the car number of the car selected from among a plurality of cars in response to the call for the elevator, the movement of the car of the elevator, the arrival direction of the car, a situation where the car arrives at the calling floor and the door opens, a situation where the door is fully open and starts closing, and a situation where the door is closing. Thus, a user in the lobby can intuitively determine the complicated sequence of operation states of the elevator.
    Type: Application
    Filed: October 24, 2016
    Publication date: August 15, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hitoshi YOSHIZAWA, Masato HIRAI
  • Publication number: 20120162860
    Abstract: A chip capacitor (1) includes: a capacitor body (10) from which an anode lead wire (11) and a cathode lead wire (12) are extended out; and a mount portion (20) which is fitted to the capacitor body (10), in which terminal portions (11a and 12a) of the lead wires (11 and 12) are arranged in a board mounting surface (20a) and which is placed on a circuit board. In the chip capacitor (1) in which the terminal portions (11a and 12a) are soldered to the circuit board, the mount portion (20) is formed of a resin containing an organic metal complex compound, and an assistant terminal portion (21) formed by plating a region to which a metal is exposed by applying laser light onto the board mounting surface (20a) is provided.
    Type: Application
    Filed: April 18, 2011
    Publication date: June 28, 2012
    Inventors: Yutaka Taketani, Hitoshi Yoshizawa, Kazuo Teraji, Naoya Saiki