Patents by Inventor Hitoya MITSUDUKA

Hitoya MITSUDUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220381485
    Abstract: A hydrogen cooling apparatus according to an embodiment includes: a binary refrigeration unit including a high-temperature-side refrigerator and a low-temperature-side refrigerator; and a hydrogen-cooling-fluid circulation unit. The binary refrigeration unit cools a hydrogen cooling fluid circulated by the hydrogen-cooling-fluid circulation unit by means of a low-temperature-side evaporator of the low-temperature-side refrigerator.
    Type: Application
    Filed: October 6, 2020
    Publication date: December 1, 2022
    Applicant: SHINWA CONTROLS CO., LTD
    Inventors: Minoru UCHIDA, Ryo MORIYA, Hitoya MITSUDUKA, Shigeo AOKI, Toshiki HIGUMA
  • Patent number: 11391497
    Abstract: A refrigeration apparatus includes first and second refrigeration circuits, and a supercooling circuit. The supercooling circuit includes a supercooling bypass flow path which communicates a part of the first refrigeration circuit positioned on the downstream side of the condenser and on the upstream side of the first expansion valve, to a compressor on the first refrigeration circuit; a supercooling control valve; and a supercooling heat exchanger disposed on the downstream side of the supercooling control valve in the supercooling bypass flow path. The supercooling heat exchanger is configured to cool the refrigerant flowing through a part of the first refrigeration circuit, on the downstream side of a connection position to the supercooling bypass flow path. The second refrigeration circuit includes: a branch flow path which branches from a part of the first refrigeration circuit, on the upstream side of the connection position to the supercooling bypass flow path.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: July 19, 2022
    Assignee: Shinwa Controls Co., Ltd
    Inventors: Takuya Saho, Satoru Kuwahata, Hitoya Mitsuduka
  • Publication number: 20210108840
    Abstract: A refrigeration apparatus includes first and second refrigeration circuits, and a supercooling circuit. The supercooling circuit includes a supercooling bypass flow path which communicates a part of the first refrigeration circuit positioned on the downstream side of the condenser and on the upstream side of the first expansion valve, to a compressor on the first refrigeration circuit; a supercooling control valve; and a supercooling heat exchanger disposed on the downstream side of the supercooling control valve in the supercooling bypass flow path. The supercooling heat exchanger is configured to cool the refrigerant flowing through a part of the first refrigeration circuit, on the downstream side of a connection position to the supercooling bypass flow path. The second refrigeration circuit includes: a branch flow path which branches from a part of the first refrigeration circuit, on the upstream side of the connection position to the supercooling bypass flow path.
    Type: Application
    Filed: May 11, 2018
    Publication date: April 15, 2021
    Applicant: SHINWA CONTROLS CO., LTD
    Inventors: Takuya SAHO, Satoru KUWAHATA, Hitoya MITSUDUKA