Patents by Inventor Hiu Tung Chu

Hiu Tung Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11158772
    Abstract: A lighting assembly is disclosed which includes a leadframe and at least one light-emitting diode (LED) element arranged on the leadframe. At least a portion of the leadframe is covered with a polyurethane coating arranged to electrically insulate the portion of the leadframe, and at least a portion of the polyurethane covered portion of the leadframe is further covered with a thermally conductive material. A method for manufacturing the lighting assembly is also disclosed.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: October 26, 2021
    Assignee: Lumileds LLC
    Inventors: Nan Chen, Hiu Tung Chu, Dong Pan, Paul Scott Martin, Tomonari Ishikawa
  • Publication number: 20190280171
    Abstract: A lighting assembly is disclosed which includes a leadframe and at least one light-emitting diode (LED) element arranged on the leadframe. At least a portion of the leadframe is covered with a polyurethane coating arranged to electrically insulate the portion of the leadframe, and at least a portion of the polyurethane covered portion of the leadframe is further covered with a thermally conductive material. A method for manufacturing the lighting assembly is also disclosed.
    Type: Application
    Filed: May 16, 2017
    Publication date: September 12, 2019
    Applicant: Lumileds LLC
    Inventors: Nan CHEN, Hiu Tung CHU, Dong PAN, Paul Scott MARTIN, Tomonari ISHIKAWA
  • Patent number: 10168015
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: January 1, 2019
    Assignee: Koninklijke Philips N.V.
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Publication number: 20170241611
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Application
    Filed: May 18, 2015
    Publication date: August 24, 2017
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Patent number: D740983
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: October 13, 2015
    Assignee: Koninklijke Philips N.V.
    Inventors: Hui Ling Pan, Jin Cherl Kwon, Hiu Tung Chu, Hua Sin Yew
  • Patent number: D803429
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: November 21, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Paul Scott Martin, Jin Cherl Kwon, Leifang Shi, Xiaofang Mo, Jianzhong Pan, Hiu Tung Chu