Patents by Inventor Hk Looi
Hk Looi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9671671Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.Type: GrantFiled: October 10, 2013Date of Patent: June 6, 2017Assignee: STMICROELECTRONICS PTE LTDInventors: Wee Chin Judy Lim, David Gani, Hk Looi, Bs Aw, Cheng-hai Cheh
-
Patent number: 9244334Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.Type: GrantFiled: March 29, 2013Date of Patent: January 26, 2016Assignee: STMicroelectronics Pte LtdInventors: Hk Looi, Wee Chin Judy Lim, Cheng-Hai Cheh, Bs Aw, David Gani, Tin-Tun Maung, Choon Lee Lai
-
Patent number: 9105766Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.Type: GrantFiled: March 18, 2013Date of Patent: August 11, 2015Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics PTE LTDInventors: Romain Coffy, Eric Saugier, Hk Looi, Norbert Chevrier
-
Publication number: 20150138420Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.Type: ApplicationFiled: November 21, 2013Publication date: May 21, 2015Applicant: STMicroelectronics Pte Ltd.Inventors: Hk Looi, David Gani, Wee Chin Judy Lim, Bs Aw, Cheng-Hai Cheh
-
Patent number: 9025339Abstract: On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.Type: GrantFiled: December 29, 2011Date of Patent: May 5, 2015Assignee: STMicroelectronics Pte Ltd.Inventors: Jing-En Luan, Hk Looi
-
Publication number: 20150103297Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.Type: ApplicationFiled: October 10, 2013Publication date: April 16, 2015Applicant: STMICROELECTRONICS PTE. LTDInventors: WeeChinJudy LIM, David Gani, Hk Looi, Bs Aw, Cheng-hai Cheh
-
Patent number: 9003644Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.Type: GrantFiled: October 15, 2012Date of Patent: April 14, 2015Assignee: STMicroelectronics Pte LtdInventors: Hk Looi, Cheng-hai Cheh, HaiKin Toh
-
Publication number: 20140293120Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.Type: ApplicationFiled: March 29, 2013Publication date: October 2, 2014Applicant: STMicroelectronics Pte Ltd.Inventors: Hk Looi, Wee Chin Judy Lim, Cheng-Hai Cheh, Bs Aw, David Gani, Tin-Tun Maung, Choon Lee Lai
-
Patent number: 8779443Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.Type: GrantFiled: September 27, 2012Date of Patent: July 15, 2014Assignee: STMicroelectronics Pte Ltd.Inventors: Wing Shenq Wong, Hk Looi
-
Publication number: 20140105717Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.Type: ApplicationFiled: October 15, 2012Publication date: April 17, 2014Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)Inventors: Hk LOOI, Cheng-hai CHEH, HaiKin TOH
-
Publication number: 20140084308Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.Type: ApplicationFiled: September 27, 2012Publication date: March 27, 2014Applicant: STMicroelectronics Pte Ltd.Inventors: Wing Shenq Wong, Hk Looi
-
Publication number: 20130248887Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.Type: ApplicationFiled: March 18, 2013Publication date: September 26, 2013Applicants: STMICROELECTRONICS PTE LTD, STMICROELECTRONICS (GRENOBLE 2) SASInventors: Romain Coffy, Eric Saugier, Hk Looi, Norbert Chevrier
-
Patent number: 8492181Abstract: A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.Type: GrantFiled: December 22, 2011Date of Patent: July 23, 2013Assignee: STMicroelectronics Pte Ltd.Inventors: Anandan Ramasamy, KahWee Gan, Hk Looi, David Gani
-
Publication number: 20130170164Abstract: On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: STMICROELECTRONICS PTE LTD.Inventors: Jing-En Luan, Hk Looi
-
Publication number: 20130164867Abstract: A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.Type: ApplicationFiled: December 22, 2011Publication date: June 27, 2013Applicant: STMicroelectronics Pte Ltd.Inventors: Anandan Ramasamy, KahWee Gan, Hk Looi, David Gani
-
Publication number: 20120171372Abstract: In automated gluing systems for semiconductor device manufacture, an automatic shutter system is provided for use with an adhesive dispenser that is configured to deposit adhesive for joining elements during final assembly processes. A shutter is configured to interpose itself between a needle tip of the dispenser and a working surface, on which devices in process are positioned, while the dispenser is in a ready position and not actually delivering adhesive, and to withdraw from the interposed position as, or immediately before the needle tip descends to a dispensing position to deposit adhesive on a device. In this way, drops of adhesive that fall from the needle tip while in the ready position are captured by the shutter and prevented from falling onto a device in process in an unintended location of the device.Type: ApplicationFiled: December 30, 2010Publication date: July 5, 2012Applicant: STMICROELECTRONICS PTE LTD.Inventors: Hk Looi, Cheng-hai Cheh