Patents by Inventor Ho-Am Kim

Ho-Am Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9384105
    Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: July 5, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Kim, Yean-Sang You, Won-Gil Han, Ho-Am Kim, Byong-Joo Kim, Do-Hoon Lee
  • Publication number: 20140359372
    Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.
    Type: Application
    Filed: February 20, 2014
    Publication date: December 4, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Kim, Yean-Sang You, Won-Gil Han, Ho-Am Kim, Byong-Joo Kim, Do-Hoon Lee